Abstract: Devices and methods are provided for controlling dead-time of a direct current to direct current (DC-DC) converter. A control circuit includes a first transistor having a source/drain terminal coupled to an output voltage of the DC-DC converter configured to provide current based on the output voltage. The control circuit also includes a digital up/down counter having an output terminal electrically coupled to an input terminal of a delay cell of the DC-DC converter. A current sensing circuit of the control circuit is electrically coupled to an input terminal of the digital up/down counter configured to receive the current and drive the digital up/down counter based on the current.

Abstract: Various magnetic thin film inductor structures are disclosed that include one or more magnetic thin film (MTF) materials. During operation, an electric field passes through one or more conductive windings which, in turn, generates a magnetic field for storing energy within these magnetic thin film inductor structures. The magnetic thin film (MTF) materials within these magnetic thin film inductor structures effectively attract magnetic flux lines of this magnetic field. As a result, any magnetic leakage resulting from the magnetic field generated by these magnetic thin film inductor structures onto nearby electrical, mechanical, and/or electro-mechanical devices is lessened when compared to magnetic leakage resulting from the magnetic field generated by other inductor structures not having the one or more MTF materials.

Abstract: An analog-to-digital converter (ADC) includes a first ADC stage with a first sub-ADC stage configured to sample the analog input voltage in response to a first phase clock signal and output a first digital value corresponding to an analog input voltage in response to a second phase clock signal. A current mode DAC stage is configured to convert the analog input voltage and the first digital value to respective first and second current signals, determine a residue current signal representing a difference between the first and the second current signal, and convert the residue current signal to an analog residual voltage signal. A second ADC stage is coupled to the first ADC stage to receive the analog residual voltage signal, and convert the analog residue voltage signal to a second digital value. An alignment and digital error correction stage is configured to combine the first and the second digital values.

Abstract: Systems and methods are provided for analog-to-digital conversion (ADC). A first quantization stage may be configured to receive an analog input signal and sample the analog input signal to generate a first digital signal, the first quantization stage may be further configured to filter the first digital signal with a first noise-shaping transfer function to generate a first noise-shaped digital output and to generate a quantization error signal based on a comparison of the analog input signal and the first noise-shaped digital output. A voltage controlled oscillator (VCO)-based second quantization stage may be configured to receive the quantization error signal and sample the quantization error signal to generate a second digital signal, the VCO-based second quantization stage may be further configured to filter the second digital signal with a second noise-shaping transfer function to generate a second noise-shaped digital output.

Abstract: A power converter module includes a ground terminal, an input voltage terminal configured to receive a raw input voltage, and an interconnection terminal configured to provide a regulated output voltage to a load such as a SOC or SIP system to be powered. A voltage regulator is connected to the ground terminal and the input voltage terminal. An inductor has an inductor output connected to the interconnection terminal.

Abstract: An apparatus and method for analog to digital conversion of analog input signals are disclosed herein. In some embodiments, an analog-to-digital (ADC) may comprise: a first successive approximation register (SAR) circuit comprising a fast SAR (FSAR) circuit and a residue digital-to-analog converter (RDAC) circuit and a residue amplifier circuit, coupled to the RDAC circuit, comprising an amplifier circuit that is configured to amplify a residual signal generated by the RDAC circuit, wherein the amplifier circuit comprises a deadzone control circuit and a first, second and third inverter stages, wherein the third stage is biased to operate in a sub-threshold region.

Abstract: A duty cycle measurement (DCM) device includes a charge pump circuit and a clocked comparator circuit. The charge pump circuit is configured to receive a clock signal that has an unknown duty cycle and to generate a capacitor voltage based on the duty cycle of the clock signal. The clocked comparator circuit is configured to receive the capacitor voltage and a reference voltage and to generate a digital output code based on the capacitor voltage and the reference voltage. The digital output code is indicative of the duty cycle of the clock signal. The charge pump circuit is further configured to receive the digital output code. A method of determining a duty cycle of a clock signal is also disclosed.

Abstract: Systems and methods are provided for analog-to-digital conversion (ADC). A first quantization stage may be configured to receive an analog input signal and sample the analog input signal to generate a first digital signal, the first quantization stage may be further configured to filter the first digital signal with a first noise-shaping transfer function to generate a first noise-shaped digital output and to generate a quantization error signal based on a comparison of the analog input signal and the first noise-shaped digital output. A voltage controlled oscillator (VCO)-based second quantization stage may be configured to receive the quantization error signal and sample the quantization error signal to generate a second digital signal, the VCO-based second quantization stage may be further configured to filter the second digital signal with a second noise-shaping transfer function to generate a second noise-shaped digital output.

Abstract: An apparatus and method for analog to digital conversion of analog input signals are disclosed herein. In some embodiments, an analog-to-digital (ADC) may comprise: a first successive approximation register (SAR) circuit comprising a fast SAR (FSAR) circuit and a residue digital-to-analog converter (RDAC) circuit and a residue amplifier circuit, coupled to the RDAC circuit, comprising an amplifier circuit that is configured to amplify a residual signal generated by the RDAC circuit, wherein the amplifier circuit comprises a deadzone control circuit and a first, second and third inverter stages, wherein the third stage is biased to operate in a sub-threshold region.

Abstract: Voltage reference circuits are provided. A voltage reference circuit includes a first transistor, a flipped-gate transistor, a first current mirror unit, a second current mirror unit, and an output note. The first transistor is formed by a plurality of second transistors. A gate and a drain of the flipped-gate transistor are coupled to a gate and a drain of each second transistor. The first current mirror unit is configured to provide a first current to the flipped-gate transistor and a mirroring current in response to a bias current. The second current mirror unit is configured to drain a second current from the first transistor in response to the mirroring current. The output node is coupled to a source of each second transistor and the second current mirror unit, and configured to output a reference voltage. Size of the flipped-gate transistor is less than that of the first transistor.

Abstract: A semiconductor structure includes a first substrate. A first die and a second die are disposed over the first substrate and are adjacent to one another. A plurality of first conductive bumps are disposed between the first substrate and the first die and between the first substrate and the second die. A second substrate is disposed below the first substrate. A plurality of second conductive bumps is disposed between the first substrate and the second substrate. An in-package voltage regulator (PVR) chip is disposed over the second substrate. A molding material is disposed over the first substrate and surrounds the first die, the second die, the plurality of first conductive bumps, the plurality of second conductive bumps, and the PVR chip.

Abstract: A charge pump circuit includes an output stage coupled to an output, a pumping stage between an input and the output stage, and a control circuit that outputs control signals. A pumping stage transistor includes S/D terminals coupled to input/output terminals, capacitive devices between signal terminals and either a transistor gate or a S/D terminal, and diode devices including either the anode/cathode or cathode/anode coupled to the respective gate and S/D terminal. An output stage transistor includes S/D terminals coupled to an input terminal and the output. One control signal includes a transition from first to second logic levels at a first time and another control signal includes a transition from the first to second logic levels at a second time, and a period between the transitions is sufficiently small to cause a change in a voltage at the pumping stage S/D terminal to be less than 100 millivolts.

Abstract: An analog-to-digital converter (ADC) includes a first ADC stage with a first sub-ADC stage configured to sample the analog input voltage in response to a first phase clock signal and output a first digital value corresponding to an analog input voltage in response to a second phase clock signal. A current mode DAC stage is configured to convert the analog input voltage and the first digital value to respective first and second current signals, determine a residue current signal representing a difference between the first and the second current signal, and convert the residue current signal to an analog residual voltage signal. A second ADC stage is coupled to the first ADC stage to receive the analog residual voltage signal, and convert the analog residue voltage signal to a second digital value. An alignment and digital error correction stage is configured to combine the first and the second digital values.

Abstract: Voltage reference circuits are provided. A voltage reference circuit includes a transistor, a flipped-gate transistor, a first current mirror unit, a second current mirror unit and an output node. The gate and the drain of the flipped-gate transistor are coupled to the gate and the drain of the transistor. The first current mirror unit is configured to provide a first current to the flipped-gate transistor and the mirroring current in response to a bias current. The second current mirror unit is configured to drain a second current from the transistor in response to the mirroring current. The output node is coupled to the source of the transistor and the second current mirror unit, and is configured to output a reference voltage.

Abstract: Systems and methods are provided for analog-to-digital conversion (ADC). A first quantization stage may be configured to receive an analog input signal and sample the analog input signal to generate a first digital signal, the first quantization stage may be further configured to filter the first digital signal with a first noise-shaping transfer function to generate a first noise-shaped digital output and to generate a quantization error signal based on a comparison of the analog input signal and the first noise-shaped digital output. A voltage controlled oscillator (VCO)-based second quantization stage may be configured to receive the quantization error signal and sample the quantization error signal to generate a second digital signal, the VCO-based second quantization stage may be further configured to filter the second digital signal with a second noise-shaping transfer function to generate a second noise-shaped digital output.

Abstract: A semiconductor structure includes a first substrate. A first die and a second die are disposed over the first substrate and are adjacent to one another. A plurality of first conductive bumps are disposed between the first substrate and the first die and between the first substrate and the second die. A second substrate is disposed below the first substrate. A plurality of second conductive bumps is disposed between the first substrate and the second substrate. An in-package voltage regulator (PVR) chip is disposed over the second substrate. A molding material is disposed over the first substrate and surrounds the first die, the second die, the plurality of first conductive bumps, the plurality of second conductive bumps, and the PVR chip.

Abstract: An integrated circuit includes a first conductive path over a substrate, a coil structure over the substrate, and a ferromagnetic structure. The first conductive path is configured to carry a first time-varying current and to generate a first time-varying magnetic field based on the first time-varying current. The coil structure is magnetically coupled with the first conductive path, and is configured to generate an induced electrical potential responsive to the first time-varying magnetic field. The ferromagnetic structure includes an open portion. The first conductive path extends through the open portion of the ferromagnetic structure. The first conductive path includes a first conductive line below the ferromagnetic structure, a second conductive line above the ferromagnetic structure, and a first via plug coplanar with the ferromagnetic structure. The first via plug electrically coupling the first conductive line and the second conductive line.

Abstract: A charge pump circuit includes a sub-circuit, which is a pumping stage circuit or an output stage circuit. The sub-circuit includes an input terminal, an output terminal, a transistor, a first capacitive device, a first diode device, and a second diode device. The transistor has a first source/drain (S/D) terminal coupled with the input terminal, a second S/D terminal coupled with the output terminal, and a gate terminal. The first capacitive device has a first end coupled with the gate terminal of the transistor and a second end configured to receive a first driving signal. The first diode device has a cathode coupled with the second S/D terminal of the transistor and an anode coupled with the gate terminal of the transistor. The second diode device has a cathode coupled with the gate terminal of the transistor and an anode coupled with the second S/D terminal of the transistor.

Abstract: An integrated circuit includes a first and a second conductive path over a substrate, a coil structure over the substrate, a voltage sensing circuit electrically coupled with the coil structure, and a ferromagnetic structure including an open portion. The first conductive path is configured to carry a first time-varying current and to generate a first time-varying magnetic field. The second conductive path is configured to carry a second time-varying current and to generate a second time-varying magnetic field. The first conductive path and the second conductive path extend through the open portion of the ferromagnetic structure. The first conductive path includes a first conductive line below the ferromagnetic structure, a second conductive line above the ferromagnetic structure, and a first via plug coplanar with the ferromagnetic structure, the first via plug electrically coupling the first conductive line and the second conductive line.

Abstract: An analog-to-digital converter (“ADC”) includes an input terminal configured to receive an analog input signal. A first ADC circuit is coupled to the input terminal and includes a VCO. The first ADC circuit is configured to output a first digital signal in a frequency domain based on the analog input signal. The first digital signal includes an error component. A first DAC is configured to convert the first digital signal to an analog output signal. A first summation circuit is configured to receive the analog output signal, the analog input signal, and a loop filtered version of the analog input signal and extract the error component, and output a negative of the error component. A second ADC circuit is configured to convert the negative of the error component to a digital error signal. A second summation circuit is configured to receive the first digital signal and the digital error signal, and to output a digital output signal corresponding to the analog input at an output terminal.