Abstract: The present application discloses a single sided hydrophilic nonwoven fabric with high tensile strength and a CSR wrap made therefrom, wherein the single sided hydrophilic nonwoven fabric has a spunbonded/meltblown/spunbonded (SMS) structure consisting of a top spunbonded layer, a middle meltblown layer and a bottom spunbonded layer, wherein one side of the nonwoven fabric is hydrophilic, and the other side of the nonwoven fabric is hydrophobic.

Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: A B7-H3 targeting antibody-drug conjugate, and a preparation method therefor and use thereof. Provided is the antibody-drug conjugate as shown in formula I. The compound has a good targeting property, good inhibitory effect on tumor cells positively expressing B7-H3, and good druggability and safety. The present antibody-drug conjugate has an inhibitory effect against B7-H3, and also a good inhibitory effect against at least one of NCI-N87, A375, LN-229, PA-1, MDA-MB-468, Calu-6 and HS-700T cells.

Abstract: A TROP2 targeting antibody-drug conjugate, and a preparation method and use therefor. The antibody-drug conjugate is shown in formula I. Said type of compound has a good targeting property, a good inhibitory effect on tumor cells positively expressing TROP2, and good druggability and high safety. The present antibody drug conjugate has an inhibitory effect on TROP2, and also a good inhibitory effect on at least one of NCI-N87, MDA-MB-468 and BXPC3 cells.

Abstract: An electronic device is disclosed, which includes: a panel, including: a first substrate; a second substrate, disposed opposite to the first substrate; a first protection element, disposed on a surface of the first substrate away from the second substrate; and a first polarizer, disposed on the first protection element.

Abstract: An antibody-drug conjugate, and an intermediate thereof, a preparation method therefor, and an application thereof. Provided is an antibody-drug conjugate as represented by formula I. The compound has good targetability, has a good inhibitory effect on HER3-positive tumor cells, and has good druggability and high safety. The antibody-drug conjugate has an inhibitory effect on HER3, has an inhibitory effect on SK-BR-3 and SW620 cells, and also has a good inhibitory effect on at least one of 22Rv1, LNCaP, NCI-H820, OVCAR-8, and HCC827 cells.

Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.

Abstract: The present disclosure includes methods and systems for monitoring real time quality of specialty fluids within one or more specialty fluid containers stored within one or more gas cabinets. The methods and systems monitoring the real time quality of the specialty fluids may utilize an analyzer and sampler to perform one or more tests on the specialty fluids to determine the quality of the specialty fluids in real time. The data collected by the analyzer and sampler may be stored on and processed with the on-line data system to determine if the quality of the specialty fluids is sufficient to be introduced to one or more workpiece processing tools for processing one or more workpieces. The data collected may be compared to a manufacturer technical specification with respect to the specialty fluid to determine if the manufacturer is providing specialty fluids of sufficient quality.

Abstract: A structure including stacked substrates, a first semiconductor die, a second semiconductor die, and an insulating encapsulation is provided. The first semiconductor die is disposed over the stacked substrates. The second semiconductor die is stacked over the first semiconductor die. The insulating encapsulation includes a first encapsulation portion encapsulating the first semiconductor die and a second encapsulation portion encapsulating the second semiconductor die.

Abstract: A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.

Abstract: A structure including stacked substrates, a first semiconductor die, a second semiconductor die, and an insulating encapsulation is provided. The first semiconductor die is disposed over the stacked substrates. The second semiconductor die is stacked over the first semiconductor die. The insulating encapsulation includes a first encapsulation portion encapsulating the first semiconductor die and a second encapsulation portion encapsulating the second semiconductor die.

Abstract: A semiconductor package includes a first die and a through via. The through via is electrically connected to the first die. The through via includes a first conductive layer having a first width, a second conductive layer having a second width different from the first width and a first seed layer disposed aside an interface between the first conductive layer and the second conductive layer.

Abstract: A package structure is provided. The package structure includes a dielectric structure and an antenna structure disposed in the dielectric structure. The package structure also includes a semiconductor device disposed on the dielectric structure and a protective layer surrounding the semiconductor device. The package structure further includes a conductive feature electrically connecting the semiconductor device and the antenna structure. A portion of the antenna structure is between the conductive feature and the dielectric structure.

Abstract: Disclosed are a laser structure and a method for fabricating the laser structure. The method includes: providing an epitaxial structure, the epitaxial structure including a substrate, a first doped dielectric layer, a multiple quantum well active layer and a ridge-shaped doped dielectric layer stacked in sequence; forming a grating structure on the ridge-shaped doped dielectric layer and forming a reflective surface on one end of the grating structure, the reflective surface and the grating structure are defined by a same lithography mask, and the mask is protected in a semiconductor etching process selectively, ensuring that relative positions of the reflective surface and the grating structure are not changed, so that light reflected from the reflective surface back to laser cavity has a predetermined phase defined by design, therefore improves performance and stability of the laser, reduces complexity and cost of the fabrication process, and increases yield and reliability.

Abstract: A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.

Abstract: A semiconductor package includes a first die, a plurality of second dies and a through via. The second dies are disposed over and electrically connected to the first die. The through via is disposed between the second dies and electrically connected to the first die. The through via includes a first portion having a first width and a second portion having a second width different from the first width and disposed between the first portion and the first die. The first portion includes a first seed layer and a first conductive layer, and the first seed layer is disposed aside an interface between the first portion and the second portion.

Abstract: Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and an antenna element over the semiconductor die. The chip package also includes a first conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element. The chip package further includes a protective layer surrounding the first conductive feature. In addition, the chip package includes a second conductive feature over the first conductive feature. A portion of the second conductive feature is between the first conductive feature and the protective layer.

Abstract: Disclosed is a surface etched grating semiconductor laser with periodic pumping structure. The structure includes a lower doped dielectric layer, a multiple quantum well active layer, a ridge-shaped doped dielectric layer, periodic grating grooves formed on the ridge-shaped doped dielectric layer and a top electrical contact layer forming ohmic electrical contact with electrical contact regions between the grating grooves. Carriers are injected through the periodic electrical contact layer, flow through the electrical contact regions, spread laterally when reaching the bottom of the grating grooves, and then continue to spread to the multiple quantum well active layer. In a case of uniform distribution, a laser based on refractive index modulation is realized. In a case of non-uniform distribution, a laser with mixed modulation is realized by introducing additional gain modulation.

Abstract: Provided is a monoclonal antibody of matrix metalloproteinase 1. The monoclonal antibody has a heavy chain variable region with an amino sequence comprising i) CDR1 selected from the group consisting of SEQ ID NOs: 1, 7 and 13, ii) CDR2 selected from the group consisting of SEQ ID NOs: 2, 8 and 14, and iii) CDR3 selected from the group consisting of SEQ ID NOs: 3, 9 and 15. The monoclonal antibody also has a light chain variable region with an amino sequence comprising i) CDR1 selected from the group consisting of SEQ ID NOs: 4, 10 and 16, ii) CDR2 selected from the group consisting of SEQ ID NOs: to 5, 11 and 17, and iii) CDR3 selected from the group consisting of SEQ ID NOs: 6, 12 and 18. A polynucleotide encoding the monoclonal antibody and a complementary polynucleotide sequence thereof are provided as well. A detection kit and a detection method are also provided, wherein the detection kit contains the monoclonal antibody of the matrix metalloproteinase 1.

Abstract: A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.