Abstract: An anti-B7-H3 antibody, a preparation method therefor, a conjugate and an application thereof. The anti-B7-H3 antibody comprises a complementarity determining region: one or more of heavy chain CDR1, heavy chain CDR2, and heavy chain CDR3, and/or one or more of light chain CDR1, light chain CDR2, and light chain CDR3. A sequence of the complementarity determining region is as described in the specification. The anti-B7-H3 antibody is a fully human antibody, has a unique antigen binding epitope, and can specifically bind B7-H3 antigen on tumor cells. Moreover, the antibody can rapidly internalize into cells after binding to tumor cells, and can be used for ADC drug development to obtain better anti-tumor activity and efficacy to achieve the purpose of treating cancers.

Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.

Abstract: A lighting device is provided and comprises a housing, a light source module, a light guiding module, and a positioning member. The housing has an accommodating space. The light source module is disposed in the accommodating space. The light guiding module is configured to receive the light emitted from the light source module, and the light guiding module includes at least two light guiding plates. The positioning member is slidably disposed in the accommodating space of the housing. The two light guide plates are configured in the accommodating space of the housing and are coupled to the opposite sides of the positioning member, so that the positioning member supports and positions the two light guide plates.

Abstract: A semiconductor package includes a first die, a plurality of second dies and a through via. The second dies are disposed over and electrically connected to the first die. The through via is disposed between the second dies and electrically connected to the first die. The through via includes a first portion having a first width and a second portion having a second width different from the first width and disposed between the first portion and the first die. The first portion includes a first seed layer and a first conductive layer, and the first seed layer is disposed aside an interface between the first portion and the second portion.

Abstract: In an embodiment, a device includes: a bottom integrated circuit die having a first front side and a first back side; a top integrated circuit die having a second front side and a second back side, the second back side being bonded to the first front side, the top integrated circuit die being free from through substrate vias (TSVs); a dielectric layer surrounding the top integrated circuit die, the dielectric layer being disposed on the first front side, the dielectric layer and the bottom integrated circuit die being laterally coterminous; and a through via extending through the dielectric layer, the through via being electrically coupled to the bottom integrated circuit die, surfaces of the through via, the dielectric layer, and the top integrated circuit die being planar.

Abstract: Disclosed are a bailer-type long-shaft pump (100) and an associated pump station (200). The long-shaft pump comprises a bailer vehicle (110), a long shaft (120), a bearing (130), a transmission device (140) and an electric motor (150). One end of the long shaft (120) successively passes through the bearing (130) and the transmission device (140) so as to be in transmission connection with a drive shaft of the electric motor (150). The pump station (200) comprises a pump station foundation (210), several equipment rooms (231) transversely distributed at intervals and constructed on the pump station foundation (210), and two ends of the long shaft (120) are supported on side walls of two adjacent equipment rooms. The bailer-type long-shaft pump achieve large water flow and low lift, the pump station is space-saving, has shorter construction cycle, and reduces investment and operation costs.

Abstract: Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and an antenna element over the semiconductor die. The chip package also includes a first conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element. The chip package further includes a protective layer surrounding the first conductive feature. In addition, the chip package includes a second conductive feature over the first conductive feature. A portion of the second conductive feature is between the first conductive feature and the protective layer.

Abstract: The present invention provides histidyl-tRNA synthetase and Fc region conjugate polypeptides (HRS-Fc conjugates), such as HRS-Fc fusion polypeptides, compositions comprising the same, and methods of using such conjugates and compositions for treating or diagnosing a variety of conditions. The HRS-Fc conjugates of the invention have improved controlled release properties, stability, half-life, and other pharmacokinetic and biological properties relative to corresponding, unmodified HRS polypeptides.

Abstract: A lighting device is provided and comprises a housing, a light source module, a light guiding module, and a positioning member. The housing has an accommodating space. The light source module is disposed in the accommodating space. The light guiding module is configured to receive the light emitted from the light source module, and the light guiding module includes at least two light guiding plates. The positioning member is slidably disposed in the accommodating space of the housing. The two light guide plates are configured in the accommodating space of the housing and are coupled to the opposite sides of the positioning member, so that the positioning member supports and positions the two light guide plates.

Abstract: Semiconductor packages and method of forming the same are disclosed. One of the semiconductor packages includes a first die, a second die, a through via and a dielectric encapsulation. The second die is bonded to the first die. The through via is disposed aside the second die and electrically connected to the first die. The through via includes a step-shaped sidewall. The dielectric encapsulation encapsulates the second die and the through via.

Abstract: In an embodiment, a device includes: a bottom integrated circuit die having a first front side and a first back side; a top integrated circuit die having a second front side and a second back side, the second back side being bonded to the first front side, the top integrated circuit die being free from through substrate vias (TSVs); a dielectric layer surrounding the top integrated circuit die, the dielectric layer being disposed on the first front side, the dielectric layer and the bottom integrated circuit die being laterally coterminous; and a through via extending through the dielectric layer, the through via being electrically coupled to the bottom integrated circuit die, surfaces of the through via, the dielectric layer, and the top integrated circuit die being planar.

Abstract: Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and a first protective layer surrounding the semiconductor die. The chip package also includes a second protective layer over the semiconductor die and the first protective layer. The chip package further includes an antenna element over the second protective layer. The antenna element is electrically connected to the conductive element of the semiconductor die.

Abstract: A structure including stacked substrates, a first semiconductor die, a second semiconductor die, and an insulating encapsulation is provided. The first semiconductor die is disposed over the stacked substrates. The second semiconductor die is stacked over the first semiconductor die. The insulating encapsulation includes a first encapsulation portion encapsulating the first semiconductor die and a second encapsulation portion encapsulating the second semiconductor die.

Abstract: A lamp has a base, a transmission mechanism, and multiple light-emitting assemblies. The transmission mechanism is mounted on the base and is rotatable around a transmission axis. The light-emitting assemblies is mounted on the base and is connected to the transmission mechanism. Each light-emitting assembly is rotatable around a rotation axis which is nonparallel with the transmission axis. The light-emitting assemblies can be rotated through driving the transmission mechanism, so as to adjust lighting effects of the light-emitting assemblies and an appearance of the lamp. Not only the lighting effects can be adjusted according to a user's need, but also the appearance of the lamp can be changed to adapt the lamp to the environment where the lamp is disposed, such that the lamp of the present invention can be widely used.

Abstract: A package structure comprising a die, a first molding compound encapsulating the die, an antenna structure and a reflector pattern disposed above the die is provided. Through vias penetrating through the first molding compound are disposed around the die. The reflector pattern is disposed on the die and the through vias. The antenna structure is disposed on the reflector pattern and electrically connected with the reflector pattern and the die. The antenna structure is wrapped by a second molding compound disposed on the reflector pattern.

Abstract: The present invention relates to the field of functional materials for medical use, and particularly to a biomimetic bone composite material, a preparation method and uses thereof. The biomimetic bone composite material provided by the invention is prepared from the raw material containing the following components: gelatin and/or collagen, hydroxyapatite and a silicon source. The present invention also provides a preparation method of the composite material and uses thereof in preparing bone repair materials. The highly biomimetic composite material with fibrous network structure prepared by the present invention can simulate the microenvironment similar to natural bone for cells, meet the biological requirements of bone tissue engineering, and is expected to become an ideal bioactive scaffold for bone repair.

Abstract: A pump body includes a housing, a first and a second chambers separated and communicated by the housing, an input pipe communicated with the first chamber and an output pipe communicated with the second chamber. The input pipe has a water outlet located in the first chamber. The output pipe has a water inlet located in the second chamber. The first pump has a first rotor placed in the first chamber. The second pump has a second rotor placed in the second chamber, wherein an extension line of a rotating shaft of the second rotor is perpendicular to a plane where a rotating shaft of the first rotor located.