Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Abstract: Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.

Abstract: A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

Abstract: Methods are provided for interconnecting two electronic components having surface mount technology interconnects. In one embodiment, a reflowable electrically conductive first interconnect material is reflowed onto the land pads of a microelectronic die. A reflowable electrically conductive second interconnect material is reflowed between the first interconnect material and corresponding bond pads of a carrier substrate at a temperature below the melting temperature of the first interconnect material. The gap between the microelectronic device and the carrier substrate is provided with underfill material. The first and second interconnect materials are reflowed at or above the reflow temperature of the first interconnect material creating a hybrid material having a melting temperature higher than the second interconnect material.

Abstract: Some embodiments of the present invention include lead-free solders for use in low stress component attachments.

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built to compensate for deformations resulting from (1) physical manipulation during assembly, (2) thermal gradients during operation, and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Abstract: A microelectronic package is disclosed including a microelectronic device, a substrate, and a signaling path coupling the microelectronic device with the substrate. The signaling path includes a conductive material, a solder joint, and a barrier material disposed between the conductive material and the solder joint. The barrier material may include nickel, cobalt, iron, titanium, and combinations thereof.

Abstract: A microelectronic package is disclosed including a microelectronic device, a substrate, and a signaling path coupling the microelectronic device with the substrate. The signaling path includes a conductive material, a solder joint, and a barrier material disposed between the conductive material and the solder joint. The barrier material may include nickel, cobalt, iron, titanium, and combinations thereof.

Abstract: An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

Abstract: A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the filler diffuses into the solder to form a new filler-solder alloy having an increased melting point and added robustness.

Abstract: Lead-free solders comprising 85-96% tin (Sn) and 4-15% Indium (In) by weight percentage (wt. %) and exemplary uses of the same are disclosed. The Sn—In solder undergoes a martensitic phase change when it is cooled from a reflow temperature to room temperature. As a result, residual stresses that would normally occur due to solder strain caused by relative movement between joined components are substantially reduced. Typically, the relative movement results from a coefficient of thermal expansion (CTE) mismatch between the joined components. The disclosed exemplary uses include flip-chip assembly and IC package to circuit board mounting, such as ball grid array packages.

Abstract: A method and apparatus to minimize thermal impedance using copper on the die or chip backside. Some embodiments use deposited copper having a thickness chosen to complement a given chip thickness, in order to reduce or minimize wafer warpage. In some embodiments, the wafer, having a plurality of chips (e.g., silicon), is thinned (e.g., by chemical-mechanical polishing) before deposition of the copper layer, to reduce the thermal resistance of the chip. Some embodiments further deposit copper in a pattern of bumps, raised areas, or pads, e.g., in a checkerboard pattern, to thicken and add copper while reducing or minimizing wafer warpage and chip stress.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a die having a surface and a primary material comprising tin, pure tin, or substantially pure tin coupled to the surface. A heat dissipating element may be coupled to the primary material.

Abstract: A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and mechanical stresses experienced in a microelectronic package. A process of forming the doped tin-indium solder is also disclosed. A microelectronic package is also disclosed that uses the doped tin-indium solder composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the doped tin-indium solder.

Abstract: Methods are provided for interconnecting two electronic components having surface mount technology interconnects. In one embodiment, a reflowable electrically conductive first interconnect material is reflowed onto the land pads of a microelectronic die. A reflowable electrically conductive second interconnect material is reflowed between the first interconnect material and corresponding bond pads of a carrier substrate at a temperature below the melting temperature of the first interconnect material. The gap between the microelectronic device and the carrier substrate is provided with underfill material. The first and second interconnect materials are reflowed at or above the reflow temperature of the first interconnect material creating a hybrid material having a melting temperature higher than the second interconnect material.

Abstract: A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

Abstract: A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the filler diffuses into the solder to form a new filler-solder alloy having an increased melting point and added robustness.

Abstract: Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

Abstract: A thermal interface material made of a binder material and a fusible filler.

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.