Abstract: In one embodiment, a method can include coupling a gate and a source of a first die to a lead frame. The first die can include the gate and the source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. In addition, the method can include coupling a source of a second die to the drain of the first die. The second die can include a gate and the source that are located on a first surface of the second die and a drain that is located on a second surface of the second die that is opposite the first surface.

Abstract: A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time.

Abstract: In one embodiment, a stack die package can include a lead frame and a first die including a gate and a source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. The gate and source are flip chip coupled to the lead frame. The stack die package can include a second die including a gate and a drain that are located on a first surface of the second die and a source that is located on a second surface of the second die that is opposite the first surface. The source of the second die is facing the drain of the first die.

Abstract: A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time.

Abstract: In one embodiment, a method can include coupling a gate and a source of a first die to a lead frame. The first die can include the gate and the source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. In addition, the method can include coupling a source of a second die to the drain of the first die. The second die can include a gate and the source that are located on a first surface of the second die and a drain that is located on a second surface of the second die that is opposite the first surface.

Abstract: A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time.

Abstract: In one embodiment, a method can include coupling a gate and a source of a first die to a lead frame. The first die can include the gate and the source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. In addition, the method can include coupling a source of a second die to the drain of the first die. The second die can include a gate and a drain that are located on a first surface of the second die and the source that is located on a second surface of the second die that is opposite the first surface.

Abstract: A bicycle seat post height adjustment mechanism, in a state of locking, has a lower valve packing ring blocking a lower valve port. Moreover, based on demands, an upper valve packing ring is allowed selectively to block an upper valve port or to be away from the upper valve port to stay on top of the upper valve port. Thus, a pin is driven to axially move down to enable a seat post to make fine adjustment, stepless adjustment or stepped adjustment in height. Moreover, the seat post may self-return to the assigned position (an upper position, a middle position or a lower position) to prevent the height of the seat from altering.

Abstract: A direction restricting device, for the inner and outer tubes of a bicycle seat post, includes at least one axial groove arranged on the wall of one of the tubes, and a direction restricting element fastened to the other tube at the position relative to the axial groove wall. The direction restricting element may be inserted into the axial groove and at least includes an elastic slider provided with an axial opening in the middle. The direction restricting element may be inserted into the axial groove to enable the axial outer walls of the direction restricting element to engage with the axial inner walls of the axial groove to eliminate the interspace between the slider and the axial groove to prevent deflection and wobbling and to reinforce the steadiness of both tubes when the inner and outer tubes rotate relative to each other.

Abstract: A control device of the height adjustment for a bicycle seat post is a pull-down control device secured to the bottom end of the lower outer tube of the seat post. A linkage mechanism is managed by a controlling wire driving the main pin of the oil hydraulic mechanism to axially move upwards to adjust the height of the seat post. Besides, the control device includes the linkage mechanism instead of an oil hydraulic mechanism, so it requires less elements and avoids oil leaking as well as working hours consumed occurring in the prior art control mechanism of the height adjustment for a bicycle seat post. Consequently the control device increases the stability in operation and the speed in assembling.

Abstract: A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

Abstract: A control mechanism of the adjustable seat post for a bicycle is fixed to the bottom end of the lower outer tube of the seat post. The control mechanism is managed by a controlling wire to drive a pin within the seat post to move axially to adjust the position of the seat post supporting the seat, so that the controlling wire will not move up and down with the seat post for seat height adjustments. Thus, the control mechanism will not generate a residual wire occurring in a prior art seat height adjusting device. It is because the controlling wire of the prior art device is disposed to the top end of the seat post. Therefore, the drawback of a prior art device can be ameliorated by arranging the control mechanism to the bottom end of the lower outer tube of the seat post.

Abstract: A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time.

Abstract: The present invention provides a bicycle seat post height adjustment mechanism. When said bicycle seat post height adjustment mechanism is in a state of locking, said lower valve packing ring may block said lower valve port, and moreover, based on demands, said upper valve packing ring is allowed selectively to block said upper valve port or to be away from said upper valve port so as to stay on top of said upper valve port. Thus, said pin is driven to axially move down so as to enable said seat post to make fine adjustment, stepless adjustment or stepped adjustment in height; moreover, said seat post may self-return to the assigned position (upper position, middle position or lower position) to prevent the height of the seat from altering.

Abstract: A control mechanism of the adjustable seat post for a bicycle is fixed to the bottom end of the lower outer tube of the seat post. The control mechanism is managed by a controlling wire to drive a pin within the seat post to move axially to adjust the position of the seat post supporting the seat, so that the controlling wire will not move up and down with the seat post for seat height adjustments. Thus, the control mechanism will not generate a residual wire occurring in a prior art seat height adjusting device. It is because the controlling wire of the prior art device is disposed to the top end of the seat post. Therefore, the drawback of a prior art device can be ameliorated by arranging the control mechanism to the bottom end of the lower outer tube of the seat post.

Abstract: The present invention relates to a bicycle seat post structure, and more particularly, to a structure provided with a hydraulic actuator within which is configured with an upper oil compartment, an intermediate oil compartment, and a lower oil compartment; the three oil compartments intercommunicate. It is characterized in that the bicycle seat post structure provides an upper valve moving simultaneously with the pin and configured between the upper oil compartment and the intermediate oil compartment; the upper valve will be closed to disconnect the upper oil compartment from the intermediate oil compartment when the pin is in a state of locking. Thus, the valve will stop moving up because it is positioned above the upper and the intermediate oil compartments and consequently controlled by the oil within the compartments, so as to stop the seat sliding upward and further to be combined with the bicycle frame as a whole.

Abstract: A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

Abstract: An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting the dice to a plurality of conducting portions (412-414) of the leadframe; and (c) longitudinally injecting molding material into the cavities along the columns via a plurality of longitudinal gates (46-49, 56-59) of the leadframe to package the dice in the cavities, the longitudinal gates situated between the cavities along the columns.

Abstract: A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

Abstract: A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time.