Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

Abstract: A method for forming and installing a retaining ring comprises: feeding a wire in a linear path into a forming die having a circular bore; forming, using the forming die, the wire into a formed ring having a ring shape; transferring the formed ring from the forming die to a transfer puck; and installing the formed ring, as a retaining ring, in a tube of a product assembly. The formed ring is maintained in a constrained state between forming in the forming die and installation in the product assembly. A system for forming and installing a retaining ring into a product assembly includes a forming die configured to form a wire into a formed ring having a ring shape; and a transfer puck to transfer the formed ring from the forming die. The formed ring is maintained in a constrained state from forming through installation.

Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.

Abstract: An implantable system includes an implantable medical device (IMD) and a non-transvenous lead that is configured to be implanted outside of a heart. The IMD includes an output configured to be connected at least to the lead, a current generator (CG) circuit configured to generate pacing pulses, a switching circuit coupled between the CG circuit and the output, one or more capacitors coupled in parallel with the CG circuit and the switching circuit, and a control circuit coupled to the CG circuit. The control circuit is configured to manage the CG circuit to generate the pacing pulses with a constant current at the output.

Abstract: Systems and methods for adjusting operating parameters of at least one pipelined software asset. Within a pipelined environment, an agent software asset is inserted immediately preceding a software asset whose operating parameters are to be adjusted. The agent software asset receives data and/or data sets from a user and such data and data sets are inserted/used by the software asset. The agent software asset also allows for a reporting of the output of other software assets to thereby provide users with intermediate outputs from the pipelined environment.

Abstract: A system, method and computer product for managing distributed transactions of a database. A transaction manager is provided for each of a plurality of transactions of the database. Each transaction manager is configured to perform functions that include generating a transaction token that specifies data to be visible for a transaction on the database. The database contains both row and column storage engines, and the transaction token includes a transaction identifier (TID) for identifying committed transactions and uncommitted transactions. A last computed transaction is designated with a computed identifier (CID), record-level locking of records of the database is performed using the TID and CID to execute the transaction, and the plurality of transactions of the database are executed with each transaction manager.

Abstract: The present disclosure relates to a cartridge for an aerosol delivery device such as a smoking article. The cartridge may include a base, a reservoir substrate, and an atomizer. The reservoir substrate may define a cavity therethrough. The atomizer may comprise a liquid transport element and a heating element extending at least partially about the liquid transport element. The atomizer may extend through the cavity through the reservoir substrate such that the heating element is positioned proximate an end of the reservoir substrate. Ends of the liquid transport element may extend to an opposing end of the reservoir substrate. A related method for assembling a cartridge for a smoking article is also provided.

Abstract: A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.

Abstract: A system, method and computer product for managing distributed transactions of a database. A transaction manager is provided for each of a plurality of transactions of the database. Each transaction manager is configured to perform functions that include generating a transaction token that specifies data to be visible for a transaction on the database. The database contains both row and column storage engines, and the transaction token includes a transaction identifier (TID) for identifying committed transactions and uncommitted transactions. A last computed transaction is designated with a computed identifier (CID), record-level locking of records of the database is performed using the TID and CID to execute the transaction, and the plurality of transactions of the database are executed with each transaction manager.

Abstract: A system includes first, second and third input data sets. The first input data set includes demographic information characterizing a patient. The second and third input data sets characterize a healthcare treatment history of the patient. A neural network includes first, second and third neural subnetworks. The first neural subnetwork is configured to process the first input data set to produce a first output data set. The second neural subnetwork is configured to process the second input data set to produce a second output data set. The third neural subnetwork is configured to process the third input data set to produce a third output data set. An autoencoder layer has an input layer comprising the first, second and third output data sets and is configured to process the first, second and third output data sets to produce a secondary output data set.

Abstract: Certain applications analyze data using a spreadsheet/tabular format consisting of rows and columns with a plurality of cells. Each column has a header that describes the content of the cells in that column. Spreadsheets are particularly suited to the storage or large amounts of information that can be evaluated and analyzed. However, one of the challenges of storing large amounts of date in a spreadsheet format is that the analysis of the data can be overwhelming without a visual reference. This application allows its user to “visualize” the information in a spreadsheet and to manipulate that data visually through the use of icons that can be moved on the screen. Changes made using this visual editor appear as changes to the data in the spreadsheet and changes to the data made using the spreadsheet are reflected in the visual editor. The visual editor can extend the capability of existing spreadsheets and enable online collaboration, for example during online meetings.

Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.

Abstract: Among other things, beverages are dispensed from one or more beverage dispensers based on selections made by users. Information about the dispensing of the beverages is sent to a central server where it is used to manage a variety of functions including replacement of depleted supplies of components. Various features of the beverage dispensers enable the beverages that are dispensed to be uniform and appealing to users.

Abstract: Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution structure; a first die over and electrically coupled to the first redistribution structure; a first through via over and electrically coupled to the first redistribution structure; an insulation layer extending along the first redistribution structure, the first die, and the first through via; and an encapsulant over the insulation layer, the encapsulant surrounding portions of the first through via and the first die, the encapsulant including conductive fillers at a concentration ranging from 70% to about 95% by volume.

Abstract: Systems, methods, and apparatuses for enabling a plurality of non-invasive, physiological sensors to obtain physiological measurements from essentially the same, overlapping, or proximate regions of tissue of a patient are disclosed. Each of a plurality of sensors can be integrated with or attached to a multi-sensor apparatus and can be oriented such that each sensor is directed towards, or can obtain a measurement from, the same or a similar location.

Abstract: A semiconductor device includes an integrated passive device coupled to a redistribution structure by a plurality of first bumps, and having a plurality of second bumps disposed opposite the plurality of first bumps, wherein the plurality of first and second bumps are thermally and/or electrically connected, and thus enable further thermal and/or electrical connections within or comprising the semiconductor device.

Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.

Abstract: A semiconductor device includes a first substrate. The semiconductor device includes a plurality of metallization layers formed over the first substrate. The semiconductor device includes a plurality of via structures formed over the plurality of metallization layers. The semiconductor device includes a second substrate attached to the first substrate through the plurality of via structures. The semiconductor device includes a first conductive line disposed in a first one of the plurality of metallization layers. The first conductive line, extending along a first lateral direction, is connected to at least a first one of the plurality of via structures that is in electrical contact with a first through via structure of the second substrate, and to at least a second one of the plurality of via structures that is laterally offset from the first through via structure.

Abstract: A drug transfer adapter includes a body having a first end and a second end positioned opposite the first end, a transfer spike extending from the body and defining an opening, with the transfer spike configured to pierce a closure of a container, a connector extending from the body, and a securing member extending from the body. The securing member has a first side and a second side positioned opposite the first side, with the first side of the securing member including an adhesive surface configured to secure the body to a container.