Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.

Abstract: A semiconductor device includes a first substrate. The semiconductor device includes a plurality of metallization layers formed over the first substrate. The semiconductor device includes a plurality of via structures formed over the plurality of metallization layers. The semiconductor device includes a second substrate attached to the first substrate through the plurality of via structures. The semiconductor device includes a first conductive line disposed in a first one of the plurality of metallization layers. The first conductive line, extending along a first lateral direction, is connected to at least a first one of the plurality of via structures that is in electrical contact with a first through via structure of the second substrate, and to at least a second one of the plurality of via structures that is laterally offset from the first through via structure.

Abstract: A drug transfer adapter includes a body having a first end and a second end positioned opposite the first end, a transfer spike extending from the body and defining an opening, with the transfer spike configured to pierce a closure of a container, a connector extending from the body, and a securing member extending from the body. The securing member has a first side and a second side positioned opposite the first side, with the first side of the securing member including an adhesive surface configured to secure the body to a container.

Abstract: An apparatus for facilitating cultivation of plants. The apparatus comprises a top enclosure, a bottom enclosure, a vertical column, a cover, a tray, sensors, environmental actuators, a nutrition container, and a processing device. Further, the top enclosure houses a first component. Further, the bottom enclosure houses a second component. Further, the vertical column is interspersed between the top enclosure and the bottom enclosure is forming an interior space therebetween. Further, the cover is interspersed between the top enclosure and the bottom enclosure, encloses the interior space and allows light to enter from a surrounding of the apparatus into the interior space. Further, the tray holds a plant. Further, the sensors generate sensor data representing variables. Further, the environmental actuators control environmental variables. Further, the nutrition container contains a nutritional medium. Further, the processing device controls the environmental actuators based on the sensor data.

Abstract: A method includes: receiving a layout of an integrated circuit; identifying, based on the layout, at least a first net and at least a second net, wherein the first net extends through the integrated circuit along a vertical direction, and the second net terminates at a middle portion of the integrated circuit along the vertical direction; dividing the integrated circuit into a plurality of grid units, wherein the first net is constituted by a first subset of the plurality of grid units, and the second net is constituted by a second subset of the plurality of grid units; estimating a first thermal conductivity of each of the first subsets of grid units; estimating a second thermal conductivity of each of the second subsets of grid units; and estimating an equivalent thermal conductivity of the integrated circuit based on combining the first thermal conductivity and the second thermal conductivity.

Abstract: A disease management system including a medication delivery pump configured to deliver a medication from a medication pouch to a patient. The medication delivery pump may include one or more plungers configured to interrupt a flow path of medication from a medication reservoir to a patient, one or more muscle wires, and one or more disc shaped springs. The one or more muscle wires and disc shaped springs may be configured to move the one or more plungers to interrupt and uninterrupt the flow path of medication towards a patient from a medication pouch.

Abstract: A semiconductor package includes a first package component comprising: a first semiconductor die; a first encapsulant around the first semiconductor die; and a first redistribution structure electrically connected to the semiconductor die. The semiconductor package further includes a second package component bonded to the first package component, wherein the second package component comprises a second semiconductor die; a heat spreader between the first semiconductor die and the second package component; and a second encapsulant between the first package component and the second package component, wherein the second encapsulant has a lower thermal conductivity than the heat spreader.

Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.

Abstract: An implantable system includes an implantable medical device (IMD) and a non-transvenous lead that is configured to be implanted outside of a heart. The IMD includes an output configured to be connected at least to the lead, a current generator (CG) circuit configured to generate pacing pulses, a switching circuit coupled between the CG circuit and the output, one or more capacitors coupled in parallel with the CG circuit and the switching circuit, and a control circuit coupled to the CG circuit. The control circuit is configured to manage the CG circuit to generate the pacing pulses with a constant current at the output.

Abstract: A semiconductor package includes a first package component comprising: a first semiconductor die; a first encapsulant around the first semiconductor die; and a first redistribution structure electrically connected to the semiconductor die. The semiconductor package further includes a second package component bonded to the first package component, wherein the second package component comprises a second semiconductor die; a heat spreader between the first semiconductor die and the second package component; and a second encapsulant between the first package component and the second package component, wherein the second encapsulant has a lower thermal conductivity than the heat spreader.

Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.

Abstract: Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution structure; a first die over and electrically coupled to the first redistribution structure; a first through via over and electrically coupled to the first redistribution structure; an insulation layer extending along the first redistribution structure, the first die, and the first through via; and an encapsulant over the insulation layer, the encapsulant surrounding portions of the first through via and the first die, the encapsulant including conductive fillers at a concentration ranging from 70% to about 95% by volume.

Abstract: Systems and methods for managing tasks in a multi-platform environment are provided. The methods include allocating a set of tasks to a server device; receiving a request for servicing one or more tasks; determining whether rules that are applicable to the tasks have been satisfied; and, based on the determination regarding the rules, either automatically servicing the tasks or transmitting the tasks to the server device for servicing and then receiving a notification of completion of the tasks. Additional tasks may be allocated to additional server devices.

Abstract: A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.

Abstract: Described herein are external devices, and methods for use therewith, that are configured to communicate with one or more implantable medical devices (IMDs) implanted within a patient using conductive communication, wherein the external device includes or is communicatively coupled to at least three external electrodes that are in contact with the patient. Certain such methods involve the external device identifying, for each IMD, of the plurality of IMDs, which one of the plurality of communication vectors is a preferred communication vector for communicating with the IMD, based on respective indicators of conductive communication quality that are determined for the plurality of communication vectors. Certain embodiments involve determining when there should be a reassessment of which one of the plurality of communication vectors is the preferred communication vector for communicating with an IMD, and in response thereto, identifying an updated preferred communication vector for communicating with the IMD.

Abstract: A package structure includes a solder feature, a first redistribution layer structure on the solder feature, and a die mounted on and electrically coupled to the first redistribution layer structure. The first redistribution layer structure includes one or more dielectric layers filled with a heat conductive dielectric material.

Abstract: A drug transfer adapter includes a body having a first end and a second end positioned opposite the first end, a transfer spike extending from the body and defining an opening, with the transfer spike configured to pierce a closure of a container, a connector extending from the body, and a securing member extending from the body. The securing member has a first side and a second side positioned opposite the first side, with the first side of the securing member including an adhesive surface configured to secure the body to a container.

Abstract: A semiconductor package includes a first package component comprising: a first semiconductor die; a first encapsulant around the first semiconductor die; and a first redistribution structure electrically connected to the semiconductor die. The semiconductor package further includes a second package component bonded to the first package component, wherein the second package component comprises a second semiconductor die; a heat spreader between the first semiconductor die and the second package component; and a second encapsulant between the first package component and the second package component, wherein the second encapsulant has a lower thermal conductivity than the heat spreader.

Abstract: Various spirometer-inhaler systems and devices are disclosed. The spirometer-inhaler system may estimate physiological parameters of a user based on the user's inhaled and/or exhaled breaths received by the spirometer-inhaler device. The spirometer-inhaler device may comprise one or more flow paths. A first flow path may direct medication from a medicine canister to an opening of the device. A second flow path may direct a user's exhaled breath from the opening of the device to one or more flow measurement devices.

Abstract: The disease management system can determine a measurement of one or more physiological parameters and can determine a disease event based on the one or more measurements. Furthermore, the disease management system can determine a pose of an individual using a pose sensor. Based on an identification of a disease event and a determination that the pose of the individual corresponds to a first pose, the disease management system can cause at least one of an audible, visual, or vibratory alarm. Based on an identification of a disease event and a determination that the pose of the individual does not correspond to the first pose, the disease management system can cause administration of a medication to the individual.