Abstract: A substrate structure may include a base substrate, a plurality of unit substrate regions arranged on the base substrate in one or more rows and one or more columns and spaced apart from one another, and dummy substrate regions between the unit substrate regions. In a row direction or a column direction, a first pitch between central points of two adjacent unit substrate regions among the unit substrate regions and a second pitch between central points of two adjacent second unit substrate regions among the unit substrate regions are different from each other.

Abstract: An adjustable hang ladder includes a main ladder section and a hang ladder section secured to the main ladder section. The hang ladder section has a hang ladder insert pivotally secured to an attachment section and locked in place by a locking mechanism. The hang ladder section is provided with a fall arresting and damping arrangement designed for connection to a roofer using the ladder for providing a cushioning effect in the event the roofer falls from the ladder.

Abstract: Provided is an electronic device which may include a first structure having a first surface, a first land region on the first surface, a second structure having a second surface facing the first surface, a second land region on the second surface, and a connection structure between the first and second structures electrically connecting the first land region to the second land region. As provided, the first land region may have a major axis and a minor axis on the first surface and the second land region may have a major axis and a minor axis on the second surface. Furthermore, the major axes of the first and second land regions may have different orientations with respect to one another.

Abstract: An adjustable hang ladder includes a main ladder section and a hang ladder section secured to the main ladder section. The hang ladder section has a hang ladder insert pivotally secured to an attachment section and locked in place by a locking mechanism. The hang ladder section is provided with a fall arresting and damping arrangement designed for connection to a roofer using the ladder for providing a cushioning effect in the event the roofer falls from the ladder.

Abstract: In one embodiment, a semiconductor device includes a semiconductor substrate and a bonding pad disposed thereon. The semiconductor device also includes a passivation layer, a buffer layer, and an insulating layer sequentially stacked on the semiconductor substrate. According to one aspect, a first recess is defined within the passivation layer, the buffer layer, and the insulating layer to expose at least a region of the bonding pad and a second recess is defined within the insulating layer to expose at least a region of the buffer layer and spaced apart from the first recess such that a portion of the insulating layer is interposed therebetween. Further, the semiconductor device includes a conductive solder bump disposed within the first and second recesses. The conductive solder bump may be connected to the bonding pad in the first recess and supported by the buffer layer through a protrusion of the conductive solder bump extending into the second recess.

Abstract: Provided is an electronic device which may include a first structure having a first surface, a first land region on the first surface, a second structure having a second surface facing the first surface, a second land region on the second surface, and a connection structure between the first and second structures electrically connecting the first land region to the second land region. As provided, the first land region may have a major axis and a minor axis on the first surface and the second land region may have a major axis and a minor axis on the second surface. Furthermore, the major axes of the first and second land regions may have different orientations with respect to one another.

Abstract: In one embodiment, a semiconductor device includes a semiconductor substrate and a bonding pad disposed thereon. The semiconductor device also includes a passivation layer, a buffer layer, and an insulating layer sequentially stacked on the semiconductor substrate. According to one aspect, a first recess is defined within the passivation layer, the buffer layer, and the insulating layer to expose at least a region of the bonding pad and a second recess is defined within the insulating layer to expose at least a region of the buffer layer and spaced apart from the first recess such that a portion of the insulating layer is interposed therebetween. Further, the semiconductor device includes a conductive solder bump disposed within the first and second recesses. The conductive solder bump may be connected to the bonding pad in the first recess and supported by the buffer layer through a protrusion of the conductive solder bump extending into the second recess.

Abstract: An electro-optical modulator includes a structural substrate, having an insulating layer on top. A waveguide layer, disposed on the insulating layer. A curving resonant MOS device, disposed on the insulating layer and having an optical coupling region with the waveguide layer.

Abstract: An optical interconnection module includes at least one optoelectronic element, at least one substrate, and at least one optical coupling element. A plurality of matching elements is formed on one side of the optical coupling element opposite to the optoelectronic element and the substrate. A plurality of alignment elements is formed in the optoelectronic element and the substrate at positions corresponding to the matching elements. The matching elements and alignment elements are engaged with each other for alignment, such that the optoelectronic element, the substrate and the optical coupling element are directly aligned during assembly. Moreover, the optical coupling element is used to increase the optical coupling efficiency of the optoelectronic element and an optical waveguide formed on the substrate.

Abstract: A hybrid electro-optical circuit board including a plate, a light guiding hole and a light-guide device. The light guiding hole is formed in the plate to be connected to an upper surface and a lower surface of the plate. The light-guide device is formed on the lower surface and covers and contacts the light guiding hole. An optical signal is transmitted between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is further formed on an inner wall of the light guiding hole, to reduce the roughness of the inner wall and reflects the optical signal by the reflection characteristics of metal. Further, the light guiding hole is filled with a transparent substance to transmit the optical signal and to stop foreign material from entering the light guiding hole.

Abstract: The present invention is an optical fiber system and method for carrying both CATV and Ethernet signals. The digital signals are translated into higher band by a direct up/down conversion so that analog signals and digital signals are treated as different frequency bands of electrical signals. Then, all the signals are mixed/divided by a power combiner/divider. And then, by using optoelectronic devices, the signals are processed with optoelectronic conversion. The converted optical signals are transmitted in a fiber or a related optical channel having low channel loss yet high capacity. To sum up, the present invention can transmit digital signals together with analog signals in a single wavelength to save the cost of an optical signal system and to provide a convenience on rearranging the system.

Abstract: An electro-optical modulator includes a structural substrate, having an insulating layer on top. A waveguide layer, disposed on the insulating layer. A curving resonant MOS device, disposed on the insulating layer and having an optical coupling region with the waveguide layer.

Abstract: An electro-optical modulator includes a structural substrate having insulating layer. A waveguide layer is on the insulating layer. A resonant layer on the insulating layer has a curving rim adjacent to the waveguide layer to form an optical coupling region. A gate dielectric layer covers part of the resonant layer. A dielectric layer over the resonant layer covers the gate dielectric layer. The dielectric layer has a first opening exposing part of the resonant layer and a second opening exposing the gate dielectric layer. Part of the second opening is adjacent to the curving rim of the resonant layer. A first polysilicon layer on the exposed region of the resonant layer serves as an electrode. A second polysilicon layer over the dielectric layer fills the second opening and is in contact with the gate dielectric layer. Part of the second polysilicon layer covering the dielectric layer serves as an electrode.

Abstract: A hybrid electro-optical circuit board and a method for fabricating the same are provided. The hybrid electro-optical circuit board includes a plate, and a light guiding hole is formed in the plate for connecting an upper surface and a lower surface of the plate. A light-guide device is formed on the lower surface and covers the light guiding hole for transmitting an optical signal between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is formed on an inner wall of the light guiding hole to reduce the roughness of the inner wall and reflects optical signal by the reflection characteristics of metal. Thus, the decay of the intensity of optical signal is reduced. A transparent substance is filled into the light guiding hole for transmitting the optical signal and stopping invaders from entering the light guiding hole.

Abstract: Provided is a semiconductor device package comprising a printed circuit board, the printed circuit board including a window at a central portion and a connection part, a semiconductor chip including center-type bonding pads, wherein the semiconductor chip is mounted on an upper surface of the printed circuit board such that the center-type bonding pads are exposed by the window, bonding wires electrically connecting the center-type bonding pads with the printed circuit board through the window, a lower molding material at a lower surface of the printed circuit board, the lower molding material encapsulating the center-type bonding pads and the bonding wires, and an upper molding material encapsulating the semiconductor chip and the upper surface of the printed circuit board, wherein the lower molding material and the upper molding material are connected to each other through the connection part of the printed circuit board.

Abstract: An optical interconnection module includes at least one optoelectronic element, at least one substrate, and at least one optical coupling element. A plurality of matching elements is formed on one side of the optical coupling element opposite to the optoelectronic element and the substrate. A plurality of alignment elements is formed in the optoelectronic element and the substrate at positions corresponding to the matching elements. The matching elements and alignment elements are engaged with each other for alignment, such that the optoelectronic element, the substrate and the optical coupling element are directly aligned during assembly. Moreover, the optical coupling element is used to increase the optical coupling efficiency of the optoelectronic element and an optical waveguide formed on the substrate.

Abstract: An electro-optical modulator includes a structural substrate having insulating layer. A waveguide layer is on the insulating layer. A resonant layer on the insulating layer has a curving rim adjacent to the waveguide layer to form an optical coupling region. A gate dielectric layer covers part of the resonant layer. A dielectric layer over the resonant layer covers the gate dielectric layer. The dielectric layer has a first opening exposing part of the resonant layer and a second opening exposing the gate dielectric layer. Part of the second opening is adjacent to the curving rim of the resonant layer. A first polysilicon layer on the exposed region of the resonant layer serves as an electrode. A second polysilicon layer over the dielectric layer fills the second opening and is in contact with the gate dielectric layer. Part of the second polysilicon layer covering the dielectric layer serves as an electrode.

Abstract: An electro-optical circuit board is provided, which includes an electrical wiring board and an optical wiring board. The optical wiring board includes a first metal substrate, an optical guiding layer formed on the first metal substrate, and a metal supporting structure formed around the optical guiding layer, wherein the optical guiding layer includes an optical waveguide and a clad wrapping the optical waveguide. When the electrical wiring board is joined with the optical wiring board through a laminating process, the metal supporting structure absorbs the pressure applied to the electro-optical circuit board.

Abstract: An optical transmitter module includes light-emitting devices with coaxial type packaging. Coplanar anode and cathode electrodes of one light-emitting device are mounted on a substrate so that heat generated from the light-emitting device can be effectively dissipated through the substrate. Furthermore, the direct electric connection between the light-emitting device and the substrate eliminates the requirement of wire boding for electric connection, increasing the performance of the optical transmitter module in high speed signal operation.

Abstract: The present invention is an optical fiber system and method for carrying both CATV and Ethernet signals. The digital signals are translated into higher band by a direct up/down conversion so that analog signals and digital signals are treated as different frequency bands of electrical signals. Then, all the signals are mixed/divided by a power combiner/divider. And then, by using optoelectronic devices, the signals are processed with optoelectronic conversion. The converted optical signals are transmitted in a fiber or a related optical channel having low channel loss yet high capacity. To sum up, the present invention can transmit digital signals together with analog signals in a single wavelength to save the cost of an optical signal system and to provide a convenience on rearranging the system.