Abstract: An optical transmitter module includes light-emitting devices with coaxial type packaging. Coplanar anode and cathode electrodes of one light-emitting device are mounted on a substrate so that heat generated from the light-emitting device can be effectively dissipated through the substrate. Furthermore, the direct electric connection between the light-emitting device and the substrate eliminates the requirement of wire boding for electric connection, increasing the performance of the optical transmitter module in high speed signal operation.

Abstract: A receiver optical subassembly for transforming received optical signal into electrical signal includes at least a ceramic substrate, a photo receiver and a transimpedance amplifier. There are high-speed traces formed on the substrate. The positive and negative pads of the photo receiver are coplanar and connected to the traces without wire bonding so as to reduce the parasitic impedance effect and improve the high-speed performance of the optical subassembly. The transimpedance amplifier is electrically connected to the traces via flip chip, wire bonding or other methods. The photo receiver and the transimpedance amplifier are connected via the high-speed traces formed on the substrate.

Abstract: An apparatus and method is provided for processing an electronic device, particularly the molding and cleaning of the device. Molding means encapsulate the electronic device with a molding compound. Thereafter, stain from one or more surfaces of the electronic device is removed by a stain removal device adapted to impact the electronic device with a polishing agent. A residue removal system then removes residue from the one or more surfaces of the electronic device.

Abstract: A high accurate SOI optical waveguide Michelson interferometer sensor for temperature monitoring combines a waveguide coupler, waveguide, or splitter with two silicon-on-insulator Bragg gratings.

Abstract: A high accurate SOI optical waveguide Michelson interferometer sensor for temperature monitoring has designed and analyzed in this invention. According to the numerical analysis of power reflective spectra of waveguide Michelson interferometers, the temperature sensing of waveguide SOI Michelson interferometer sensor can improve at least 20 times than fiber Bragg grating temperature sensor. Moreover, the SOI Waveguide interferometer sensor we designed presents high sensitivity than pure single waveguide Bragg grating sensor and fiber Bragg grating sensor by adjusting the length of the two interferometric arms. The full wavelength half maximum (FWHM) of our designed SOI optical waveguide Michelson interferometer can be narrowed much smaller than fiber Bragg grating and waveguide Bragg grating sensors for sensitivity improvement. The invention of this optical SOI waveguid sensing devices shows promising results for developing integrated OEIC sensors in the future.