Abstract: A flip-chip package includes a light source, a silicon base plate, a silicon reflector, and a cover. The light source includes a piece of Light-Emitting Diode (LED) in flip-chip configuration. The silicon base plate includes a piece of silicon with electrical pads to bond the light source, two etched, square, via-holes to provide electrical connection to the bottom of the silicon base plate, and filling port for liquid epoxy. The silicon reflector includes a chemically etched silicon piece to form an angled reflector where the light radiation from the light source reflects on the surface of the angled reflector and a recess forms on the top surface of the silicon reflector. The cover includes a piece of window material that transmits the light radiation of the light source.

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: An ultraviolet C (UV-C) disinfection device includes a UV-C light-emitting diode (LED) illuminator which includes a UV-C source module and a UV-C LED coupling module. The UV-C source module includes a heat spreader and a UV LED chip that is mounted on the heat spreader which is configured to be mounted on a printed circuit board (PCB). The UV-C LED coupling module includes a holder and a rod configured to carry a UV-C light emitted from the UV-C LED chip from a first distal end of the rod to an opposite second distal end of the rod such that the UV-C light gets leaks out from a side of the rod to deliver at least a portion of the UV-C light to a surrounding of the rod, with the rod secured with the holder positioning the rod onto the UV-C chip.

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: An interface device includes a double-trench structure configured to bond to a flip-chip device electrically and thermally. The double-trench structure is at least partially metalized and configured to allow a soldering material to flow along each of at least two trenches of the double-trench structure. The two trenches are closely located adjacent to each other to minimize an electrical separation gap between a cathode and an anode of the flip-chip device while providing electrical isolation therebetween.

Abstract: A self-disinfection device includes an ultraviolet C (UVC) light-emitting diode (LED) illuminator, which includes a UVC LED chip and a screen. The UVC LED chip that is mounted on a UVC LED package or a heat spreader, which is mounted to a frame of an electronic device. A UVC light emitted by the UVC LED chip is coupled into the screen as a waveguide structure and the UVC light is extracted by a coating or organic medium.

Abstract: A portable self-contained disinfection device includes an enclosure and one or more ultraviolet C (UVC) light-emitting diode (LED) illuminators. The enclosure is configured to at least partially surround at least a portion of a user. The one or more UVC LED illuminators are disposed on the enclosure and configured to emit a UVC light toward the portion of the user surrounded by the enclosure.

Abstract: Embodiments of an apparatus and method for sealing and cutting of tissue during surgeries, especially in general, endoscopic, laparoscopic and robotic, are described. In one aspect, an apparatus comprises a laser system and a laser beam delivery unit. The laser system comprises a tissue cutting laser configured to emit a first laser beam to cut a tissue. The laser system also comprises a tissue sealing laser configured to emit a second laser beam to seal the tissue. The laser beam delivery unit is detachably coupled to the laser system and is configured to guide and direct the first and second laser beams to cut and seal the tissue.

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

Abstract: An ultraviolet C (UV-C) disinfection device includes a UV-C light-emitting diode (LED) illuminator which includes a UV-C source module and a UV-C LED coupling module. The UV-C source module includes a heat spreader and a UV LED chip that is mounted on the heat spreader which is configured to be mounted on a printed circuit board (PCB). The UV-C LED coupling module includes a holder and a rod configured to carry a UV-C light emitted from the UV-C LED chip from a first distal end of the rod to an opposite second distal end of the rod such that the UV-C light gets leaks out from a side of the rod to deliver at least a portion of the UV-C light to a surrounding of the rod, with the rod secured with the holder positioning the rod onto the UV-C chip.

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

Abstract: Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

Abstract: An ultraviolet C (UV-C) illumination system includes a central disinfection unit (CDU), a heating, ventilation and air conditioning (HVAC) illuminator unit (HIU), and a beam scanning device. The CDU includes a fiber-coupled UV-C unit (FCU) configured to provide a UV-C light, a microcontroller, and a smart control unit (SCU) that controls each of the one or more FCUs by adjusting UV-C illumination by each of the one or more FCUs. The SMU communicates to the microcontroller to adjust energy consumption based on environmental data. The HIU includes fused silica rod to uniformly scatter the UV-C light to disinfect a surrounding area, with a light intensity controlled by the SCU of the CDU. The beam scanning device is coupled to the one or more FCUs. The beam scanning device includes a fiber and a lens disposed at a fiber tip of the fiber and configured to collimate the UV-C light.

Abstract: Examples of combining multiple laser beams into a single laser beam by using a circular or spiral diffraction grating are described. The multiple laser beams can be combined coherently or incoherently depending on the geometrical layout of the laser beams.

Abstract: Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

Abstract: Embodiments of a silicon-based heat dissipation device and a chip module assembly are described. An apparatus includes a chip module assembly that includes a silicon-based heat dissipation device and an extended device coupled to the silicon-based heat dissipation device. The silicon-based heat dissipation device includes a base portion having a first primary side and a second primary side opposite the first primary side. The silicon-based heat dissipation device also includes a protrusion portion on the first primary side of the base portion and protruding therefrom, with the protrusion portion having a plurality of fins. The extended device includes an extended layer. The second primary side of the base portion is configured to receive one or more heat-generating devices thereon such that at least a portion of heat generated by the one or more heat-generating devices is dissipated to the silicon-based heat-dissipation device by conduction.