Abstract: Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a non-metal base plate and a silicon-based cover element disposed on the base plate. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the one or more light-emitting devices between the base plate and the cover element with at least a portion of a light-emitting surface of each of the one or more light-emitting devices exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.

Abstract: Embodiments of a silicon-based heat dissipation device and a chip module assembly utilizing the silicon-based heat dissipation device are described. In one aspect, the chip module assembly includes a chip module and a primary heat dissipation module. The chip module includes a board and at least one heat-generating device. The board includes a first primary side and a second primary side opposite the first primary side. The at least one heat-generating device is disposed on the first primary side of the board. The primary heat dissipation module includes at least one silicon-based heat dissipation device disposed on the at least one heat-generating device.

Abstract: Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device.

Abstract: A low cost design for a concentrated photovoltaic (CPV) solar cell device is developed with a 3-D solar cell structure that eliminates the need for sun-ray tracking and with improved electricity conversion efficiency for cooling solar cells. The 3-D solar cell structure can be built with conventional monocrystalline or polycrystalline silicon or with multi-junction III-V solar material, joining two or more solar cell segments perpendicular to a base solar cell. This structure is able to collect all incident sunlight from sunrise to sunset.

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for a gain medium of a laser system are provided. In one aspect, a silicon-based thermal energy transfer apparatus includes silicon-based first and second manifolds each having internal coolant flow channels therein. When the first and second manifolds are coupled together, a first groove on the first manifold and a second groove on the second manifold form a through hole configured to receive the gain medium therein. The through hole has a polygonal cross section when viewed along a longitudinal axis of the gain medium.

Abstract: An apparatus for illumination is provided. In one aspect, the apparatus comprises a light guide device including a hollow light pipe portion, an opening, and a distal end longitudinally opposite from the opening. The opening is configured to receive at least a portion of an illumination device therein. Either or both of the light pipe portion and the distal end has a textured surface thereof.

Abstract: Apparatus and method of color balancing LED-based lighting are provided. In one aspect, an apparatus comprises an image sensor that senses images of objects, an illumination device, and control logic. The illumination device comprises an LED that emits red light, an LED that emits green light, and an LED that emits blue light. The control logic receives an imaging signal from the image sensor related to a sensed image of a first object that is illuminated by the illumination device. The control logic controls color balancing of light emitted by the illumination device according to an optical characteristic of the image of the first object.

Abstract: Embodiments of a mechanism of thermal isolation for multiple heat-generating devices on a substrate are described. In one aspect, a substrate is configured for a plurality of heat-generating devices to be disposed thereon. The substrate comprises an electrically-conductive layer that is electrically coupled to the heat-generating devices when the heat-generating devices are disposed on the substrate. The electrically-conductive layer is configured to thermally isolate the heat-generating devices such that there is no thermal coupling through the electrically-conductive layer amongst the heat-generating devices.

Abstract: Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a silicon-based base plate and a silicon-based cover element disposed on the base plate. The base plate includes a recess to receive a light-emitting device therein. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the light-emitting device between the base plate and the cover element with at least a portion of a light-emitting surface of the light-emitting device exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.

Abstract: In one aspect, an apparatus comprises a substrate, a first electrically-driven device disposed on the substrate, a second electrically-driven device disposed on the substrate, and a composite heat sink device. The composite heat sink device comprises a first thermal conduction member, a second thermal conduction member, and a thermal insulation member. The first thermal conduction member is disposed on the first electrically-driven device such that at least a portion of the heat generated by the first electrically-driven device is transferred to the first thermal conduction member by conduction. The second thermal conduction member is disposed on the second electrically-driven device such that at least a portion of the heat generated by the second electrically-driven device is transferred to the second thermal conduction member by conduction. The thermal insulation member is disposed between and thermally decouples the first thermal conduction member and the second thermal conduction member from one another.

Abstract: A thermal energy transfer device is described. The device includes a silicon-based base plate and a silicon-based plate structure. The base plate includes a first primary surface and a second primary surface opposite the first primary surface. The plate structure includes a first primary surface, a second primary surface opposite and substantially parallel to the first primary surface, and a plurality of edges that are between the first and the second primary surfaces. A first edge of the edges of the plate structure is disposed on the first primary surface of the base plate at an angle greater than 0 degree between the first primary surface of the base plate and the first primary surface of the plate structure.

Abstract: A thermal energy transfer apparatus is described. The apparatus includes a silicon-based support module and a plurality of silicon-based plate modules. The silicon-based support module includes a plurality of grooves on a first primary surface of the support module. The plurality of silicon-based plate modules each includes a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges that are between the first and the second primary surfaces. A first edge of the edges of each plate module is received in a respective one of the grooves of the support module to attach the respective plate module substantially orthogonally to the support module.

Abstract: A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove.

Abstract: An apparatus using a phase-change material for thermal management in portable applications is described. In one aspect, the apparatus includes a phase-change material, a thermal reservoir, and a heat transport element. The thermal reservoir has a cavity therein to contain the phase-change material in the cavity. The heat transport element is made of a thermally conductive material. A first portion of the heat transport element traverses through the thermal reservoir and in contact with the phase-change material. A second portion of the heat transport element extends outside the thermal reservoir. Accordingly, at least part of the thermal energy from an object in contact with the heat transport element can be transported to the phase-change material via the heat transport element and be absorbed by the phase-change material as latent heat. The phase-change material may release at least part of the absorbed thermal energy at a later time.

Abstract: A concentrated photovoltaic device that is capable of generating thermal and electrical energy from solar radiation using a three-dimensional solar cell design structure with no need for a sun-tracking system is provided. The three-dimensional solar cell structure uses liquid cooling to provide maximum energy utilization from both stored thermal and electrical solar energy.

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a silicon-based base portion having a first primary surface and a silicon-based support structure. The silicon-based support structure includes a mounting end and a distal end opposite the mounting end with the mounting end received by the base portion such that the support structure extends from the first primary surface of the base portion. The support structure includes a recess defined therein to receive the edge-emitting laser diode. The support structure further includes a slit connecting the distal end and the recess to expose at least a portion of a light-emitting edge of the edge-emitting laser diode when the edge-emitting laser diode is received in the support structure.

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a base portion and a support portion. The base portion is made of silicon and includes a first primary surface. The first primary surface includes at least first and second V-notch grooves thereon. The support portion is made of silicon and includes at least first and second edges that are interlockingly received in the first and second V-notch grooves when the support portion is mounted on the base portion.

Abstract: A thermal energy storage apparatus that absorbs thermal energy from a heat-generating device is described. In one aspect, the thermal energy storage apparatus comprises a non-metal container and a phase-change material. The non-metal container is configured to receive the heat-generating device thereon. The phase-change material is contained in the non-metal container and configured to absorb at least a portion of heat from the heat-generating device through the non-metal container.

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.