Abstract: One example relates to an optical engine comprising an optical waveguide. The optical waveguide can comprise a total internal reflection (TIR) edge to change direction of an optical light beam to an angle parallel to a top surface and a bottom surface of the optical waveguide. The optical waveguide can also comprise a plurality of aligning holes extending from the top surface to the bottom surface of the optical waveguide. The optical engine can comprise a substantially transparent slab underlying the optical waveguide. The slab can also comprise a micro lens to collimate the optical light beam. The slab can further comprise a plurality of aligning pins extending perpendicular from a top surface and bottom surface of the slab. Each of the plurality of aligning pins can extend through a respective one of the plurality of aligning holes.

Abstract: Example embodiments disclosed herein relate to the estimation of temperature based on a fan control signal. Example embodiments include the estimation of temperature based on a fan control signal having a value based on a temperature reading of a temperature sensor.

Abstract: One example relates to an optical engine comprising an optical waveguide. The optical waveguide can comprise a total internal reflection (TIR) edge to change direction of an optical light beam to an angle parallel to a top surface and a bottom surface of the optical waveguide. The optical waveguide can also comprise a plurality of aligning holes extending from the top surface to the bottom surface of the optical waveguide. The optical engine can comprise a substantially transparent slab underlying the optical waveguide. The slab can also comprise a micro lens to collimate the optical light beam. The slab can further comprise a plurality of aligning pins extending perpendicular from a top surface and bottom surface of the slab. Each of the plurality of aligning pins can extend through a respective one of the plurality of aligning holes.

Abstract: A system includes an optical transmitter package comprising an optical transmitter to generate optical transmission signals based on electrical transmission signals. The system also includes an optical receiver package comprising an optical receiver to generate electrical reception signals based on optical reception signals. The system further includes a printed circuit board (PCB) on which the optical transmitter package and the optical receiver package are mounted. The PCB includes a heat generating circuit component. The optical transmitter package can be mounted to the PCB to subjected to less heat from the heat generating circuit component than the optical receiver package.

Abstract: A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.

Abstract: An airflow control apparatus includes a controllable airflow resistance aligned with an airflow path of a plurality of airflow paths, a sensor capable of detecting an airflow condition in at least one of the plurality of airflow paths, and a controller. The controller is coupled to the controllable airflow resistance and to the sensor, and can control the controllable airflow resistance to manage airflow recirculation based on the airflow condition detected by the sensor.

Abstract: An apparatus includes a chassis that further includes at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion of a first electronic device outside the enclosure by preventing further insertion of the first electronic device into the enclosure.

Abstract: A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.

Abstract: A cold plate has blades arranged to be interleaved with memory modules, with clips coupling blades to memory modules. A liquid cooling loop is thermally coupled to the blades of the cold plate.

Abstract: An apparatus includes a chassis including at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion electronic devices outside the enclosure by preventing further insertion of the electronic devices into the enclosure.

Abstract: A chassis card cage includes a front panel, a backplane opposite the front panel, opposing sides extending between the front panel and the backplane, a series of module slots extending between opposing sides, each of the series of module slots configured to accommodate a card module, and a module slot divider including a first portion extending perpendicularly from the backplane and a second portion connectable to the first portion and extending from the second portion toward the front panel, wherein at least the second portion of the module slot divider has a divider height substantially equal to a height of a single module slot and is configured to divide one of the series of module slots into side-by-side module slots.

Abstract: A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate.

Abstract: A wire defining a repeating pattern is removably joined to a flange having apertures defined therein. The wire includes contact portions to make electrically-conductive contact with a device supported by a chassis. The device can be cooled by air flow through the apertures of the flange while being protected against electromagnetic interference (EMI). The wire and the flange can be respectively formed from various metals and are separable from each other for recycling or other purposes.

Abstract: A fan assembly includes a housing; a plurality of fan units mounted in the housing; and a flex printed circuit board (PCB) having a first portion, the first portion of the flex PCB electrically connected to each of the plurality of fan units, the flex PCB having a second portion, the second portion of the flex PCB including a printed circuit assembly (PCA), the PCA having mounted thereon a connector to connect to a PCA disposed within a chassis.

Abstract: Example embodiments disclosed herein relate to the estimation of temperature based on a fan control signal. Example embodiments include the estimation of temperature based on a fan control signal having a value based on a temperature reading of a temperature sensor.

Abstract: A pump assembly includes inlet and outlet interfaces capable of coupling to a liquid cooling loop tubing, a plurality of pump connectors coupled to the inlet and outlet interfaces enabling pluggable connection of a plurality of pumps to the inlet and outlet interfaces, and a controller. The controller is coupled to the plurality of pumps and controls power levels of the individual pumps, enabling control of fluid flow rate in the liquid cooling loop.

Abstract: A fluid cooling module includes tubing and a turbulence structure. The tubing is configured to contain a flowing fluid. The turbulence structure disposed inside the tubing and configured to increase fluid movement within the tubing as the flowing fluid flows over the turbulence structure to thereby generate turbulence in the flowing fluid.

Abstract: An air filter for electrical equipment includes metallic filter media including a first outer layer, an opposing second outer layer, and at least one inner layer disposed between the first outer layer and the opposing second outer layer, and a frame disposed along a perimeter edge of the filter media configured to retain the filter media.

Abstract: A fan assembly includes a housing; a plurality of fan units mounted in the housing; and a flex printed circuit board (PCB) having a first portion, the first portion of the flex PCB electrically connected to each of the plurality of fan units, the flex PCB having a second portion, the second portion of the flex PCB including a printed circuit assembly (PCA), the PCA having mounted thereon a connector to connect to a PCA disposed within a chassis.

Abstract: An apparatus includes a pushbutton member; a receiving member movable by the pushbutton member; and a latching member affixed to an electronic module and latchable to the receiving member. When the latching member is latched, the electronic module is movable via the receiving member. Alternatively, an apparatus is provided including a pushbutton members and a receiving section having a protruding receiving member, and movable by the pushbutton members. The receiving member may receive a latching member affixed to an electronic module. When the latching member is latched, the electronic module is movable via the receiving member. Alternatively, an apparatus includes an electronic module; and a latching member affixed to the electronic module, the latching member to latch to a receiving member. When the latching member is latched to the receiving member, the electronic module is movable via the receiving member in a direction of movement of the receiving member.