Abstract: A keyed filler panel with removably-coupleable airflow resistive filler card assembly is disclosed. In one embodiment, the present invention is comprised of a filler panel body. The present embodiment is further comprised of an airflow resistive filler portion removably-coupleable with said filler panel body. The airflow resistive filler portion adapted to couple with the filler panel body without additional hardware.

Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

Abstract: A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board (“PCB”) having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a first to-be-cooled component coupled to said second side of said PCB; and a thermal jumper to thermally couple said first component on said second side to said heat sink on said first side, said jumper being configured to extend physically around a side edge of said PCB.

Abstract: A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the heat transfer device, and compression tabs for securing the fan to the base.

Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

Abstract: A CompactPCI blade assembly includes a main printed circuit assembly (PCA), a mezzanine PCA, an electrical connector, and at least one support structure. The main PCA is couplable to a connector plane of a CompactPCI-based computer system. The electrical connector is coupled between the mezzanine PCA and the main PCA. The at least one support structure is mechanically coupled between the main PCA and the mezzanine PCA and establishes a board-to-board distance between the mezzanine PCA and the main PCA of at least one slot unit width.

Abstract: A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the heat transfer device, and compression tabs for securing the fan to the base.

Abstract: A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the heat transfer device, and compression tabs for securing the fan to the base.

Abstract: A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board (“PCB”) having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a first to-be-cooled component coupled to said second side of said PCB; and a thermal jumper to thermally couple said first component on said second side to said heat sink on said first side, said jumper being configured to extend physically around a side edge of said PCB.

Abstract: A keyed filler panel with removably-coupleable airflow resistive filler card assembly is disclosed. In one embodiment, the present invention is comprised of a filler panel body. The present embodiment is further comprised of an airflow resistive filler portion removably-coupleable with said filler panel body. The airflow resistive filler portion adapted to couple with the filler panel body without additional hardware.

Abstract: The air moving assembly includes at least one air moving device and a stator, said stator being operable to at least reduce one expansion and/or one contraction for airflow passing through the assembly. The stator is also preferably operable to impart or adjust swirl for airflow passing through the stator. In at least one embodiment, the imparted or adjusted swirl rotates in a direction opposite to that of the rotation of an impeller of the air moving device. As a result, in at least one embodiment, airflow exiting the air assembly has no rotational component. The air moving assembly may include additional air moving devices and/or stators. In at least one embodiment, the air moving assembly includes first and second air moving assemblies coupled to a shared strut assembly.

Abstract: The air moving assembly includes at least one air moving device and a stator, said stator being operable to at least reduce one expansion and/or one contraction for airflow passing through the assembly. The stator is also preferably operable to impart or adjust swirl for airflow passing through the stator. In at least one embodiment, the imparted or adjusted swirl rotates in a direction opposite to that of the rotation of an impeller of the air moving device. As a result, in at least one embodiment, airflow exiting the air assembly has no rotational component. The air moving assembly may include additional air moving devices and/or stators. In at least one embodiment, the air moving assembly includes first and second air moving assemblies coupled to a shared strut assembly.

Abstract: A bulkhead plate member for providing an attenuating barrier for electromagnetic interference (EMI) noise in a computer system housing. The bulkhead plate member includes a rectangular shaped main portion having a material thickness. The main portion has a plurality of edge walls defining an opening for receiving a peripheral component connector affixed to a printed circuit board (PCB). The edge walls are adapted to contact side walls of the peripheral component connector to provide contact regions substantially perpendicular to the main portion and greater than the material thickness of the main portion, such that EMI noise is conducted through the bulkhead plate member, at the edge walls of the opening, to a bulkhead wall of the computer system housing thereby suppressing the EMI noise. The edge walls of the opening provides increased surface area contact between the bulkhead plate member and the peripheral component connector to maximize the attenuation of EMI noise around the connector.

Abstract: A combination airflow straightener and finger guard straightens airflow and minimize the chance of fingers or other objects coming into contact with rotating blades of a fan, and includes a plurality of vanes that extend radially outward from a hub to an outer frame of the combination airflow straightener and finger guard. Each vane can be considered as having three portions. The first portion is closest to the fan and is parallel to the airflow leaving the fan. The second portion is farthest from the fan and is aligned with the axis of rotation of the fan (or some other desired exhaust vector). The third portion is curved to link the first portion to the second portion to straighten the airflow to the desired exhaust vector, with the space between each pair of vanes forming a plenum that straightens the airflow by removing the rotational components from the airflow.

Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

Abstract: A mechanism for use in insertion and extraction of a first printed circuit board (PCB) to and from a second PCB so as to engage and disengage an electrical connector of the first PCB to and from a corresponding electrical connector of the second PCB. The insertion and extraction mechanism includes a stiffener bar and a mounting block. The stiffener bar is affixed to the first PCB immediately adjacent to the electrical connector for stiffening the first PCB in the vicinity of the electrical connector. The mounting block is affixed to the second PCB immediately adjacent to the corresponding electrical connector. A threaded fastener is carried by the stiffener bar and is engageable with the mounting block. Rotation of the fastener in a first direction causes the first PCB to be inserted to the second PCB which causes the electrical connector to be engaged with the corresponding electrical connector.