Abstract: A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate.

Abstract: A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.

Abstract: In an active heat sink, a heat sink comprises a plurality of heat sink fins and multiple fans configured in a redundant arrangement coupled to the heat sink.

Abstract: An apparatus in one example comprises a reversible fan of an electronic module that rotates in a clockwise direction if the electronic module is communicatively coupled in a first position and a counterclockwise direction if the electronic module is communicatively coupled in a second position.

Abstract: An electronics cooling fan comprises a centrifugal clutch adapted to disengage and freewheel upon fan failure.

Abstract: An electronics cooling fan comprises at least one collapsible fan blade driven by centrifugal force to extend radially as the fan spins and driven by elastic force to retract as spinning slows or stops.

Abstract: A cooling apparatus comprises a printed circuit board and an air duct positioned adjacent the printed circuit board spanning space and forming an air-guiding channel from at least one system fan to at least one heat sink. The air-guiding channel is bounded on one side by the printed circuit board and on remaining sides by the air duct that compresses against the printed circuit board in a substantially airtight seal.

Abstract: A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movement of the moveable cold plate.

Abstract: A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability.

Abstract: A heat sink surface mounts to a printed circuit board in direct separation, thermal and physical, from components on the board. The heat sink cools the components by conducting heat from the components through the printed circuit board to the heat sink.

Abstract: An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cold plate is in thermal communication with at least one of the computer components, and convectively removes heat from that component using a liquid coolant. A heat exchanger dissipates heat from the liquid coolant, and provides liquid coolant back to the cold plate. An air mover within the chassis cools the heat exchanger, blows air across other components needing cooling, and removes heated air from the chassis. The air mover may extend substantially across the chassis, or it may blow crosswise from an outlet-ventilating direction.

Abstract: A printed circuit board connector engagement apparatus includes a four-bar linkage capable of coupling to an electronics system housing and is configured to accept and enable a printed circuit board to travel in a first direction until a connector on the printed circuit board and a corresponding connector coupled to the housing are aligned. The four-bar linkage further enables the printed circuit board to travel essentially orthogonal to the first direction to engage the printed circuit board and housing connectors.

Abstract: A heat exchanger includes a tube, and a plurality of fins coupled to the tube having a curved fan-stator shape that facilitates straightening of airflow from a fan.

Abstract: An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.

Abstract: A fan rotor system for cooling an electronic system includes a rotor body configured to be rotated by a fan motor and at least one collapsible fan blade mounted on the rotor body for moving cooling air through the electronic system. The at least one collapsible fan blade has a first air driving position, wherein the fan blade moves cooling air in a desired direction for cooling the electronic system, and a second air passage position, wherein the at least one collapsible fan blade is collapsed to allow cooling air to pass the at least one collapsible fan blade with less drag than when the at least one collapsible fan blade is in the first air driving position. The at least one collapsible fan blade is movable between the first air driving position when the rotor body is rotating and the second air passage position when the rotor body is not rotating.

Abstract: A CompactPCI blade assembly includes a main printed circuit assembly (PCA), a mezzanine PCA, an electrical connector, and at least one support structure. The main PCA is couplable to a connector plane of a CompactPCI-based computer system. The electrical connector is coupled between the mezzanine PCA and the main PCA. The at least one support structure is mechanically coupled between the main PCA and the mezzanine PCA and establishes a board-to-board distance between the mezzanine PCA and the main PCA of at least one slot unit width.

Abstract: A cooling apparatus for usage in an electronic system, a liquid loop heat exchanger body is configured for attachment to an exterior surface of an electronic system chassis.

Abstract: In a liquid loop cooling device, a heat exchanger includes a tube arranged in a multiple-pass configuration including a plurality of substantially parallel tube segments. The heat exchanger further includes a plurality of fins coupled to the tube segments. The fins for adjacent tube segments are separated by a gap.

Abstract: A cylindrical tubing hinge extends around and couples two segments of rigid or semi-rigid tubing and enables rotational motion of one segment relative to the other.

Abstract: An airflow management apparatus is used in an electronic system and includes a flexible air baffle that mounts on a chassis of an electronic device in an arrangement and obstructs air flow between an air inlet vent and an air exhaust vent of the electronic device. The flexible air baffle has a thickness that extends across a gap to contact an adjacent vertically-stacked electronic device.