Abstract: A display driver includes interface circuitry, image processing circuitry, and drive circuitry. The interface circuitry is configured to receive a full frame image and a foveal image from a source external to the display driver. The image processing circuitry is configured to: upscale the full frame image; render a foveated image from the upscaled full frame image and the foveal image. The foveated image includes a foveal area based on the foveal image, a peripheral are based on the upscaled full frame image, and a border area based on the foveal image and the upscaled full frame image. The border area being located between the foveal area and the peripheral area. The drive circuitry is configured to drive a display panel using the foveated image.

Abstract: A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first ILB electrode is configured to be bonded to an integrated circuit chip using one of the first bonding segment or the second bonding segment.

Abstract: A display driver includes interface circuitry, image processing circuitry, and drive circuitry. The interface circuitry is configured to receive a full frame image and a foveal image from a source external to the display driver. The image processing circuitry is configured to: upscale the full frame image; render a foveated image from the upscaled full frame image and the foveal image. The foveated image includes a foveal area based on the foveal image, a peripheral are based on the upscaled full frame image, and a border area based on the foveal image and the upscaled full frame image. The border area being located between the foveal area and the peripheral area. The drive circuitry is configured to drive a display panel using the foveated image.

Abstract: A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first ILB electrode is configured to be bonded to an integrated circuit chip using one of the first bonding segment or the second bonding segment.

Abstract: A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first bonding segment is configured to be bonded to a first display driver integrated circuit (DDIC) chip, and the second bonding segment is configured to be bonded to a second DDIC chip configured differently from the first DDIC chip.

Abstract: A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first bonding segment is configured to be bonded to a first display driver integrated circuit (DDIC) chip, and the second bonding segment is configured to be bonded to a second DDIC chip configured differently from the first DDIC chip.

Abstract: A display driver includes internal oscillator circuitry, timing controller circuitry, and panel interface circuitry. The internal oscillator circuitry is disposed internal to the display driver and configured to generate an internal oscillation signal. The timing controller circuitry is configured to generate a resultant sync signal using an external sync input received from an entity external to the display driver during a first period of a frame period. The timing controller circuitry is further configured to generate the resultant sync signal using the internal oscillation signal during a second period of the frame period, the second period following the first period. The panel interface circuitry is configured to generate, based on the resultant sync signal, an emission control signal that controls emission scan driver circuitry configured to drive a plurality of emission scan lines of a display panel.

Abstract: A semiconductor device comprises circuitry and a timing generator. The circuitry is configured to generate an emission control signal that controls light emission of pixels of a display panel such that a first vertical sync period comprises a plurality of control cycles for the light emission of the pixels. The timing generator is configured to, when a length of the first vertical sync period is changed, start a next vertical sync period following the first vertical sync period at timing based on a length of the control cycles.

Abstract: An example method of illuminating an optical fingerprint sensor integrated with a display, where the display includes a fingerprint (FP) pixel region and an outer pixel region exclusive of the FP pixel region, is described. The method includes: processing image data in display driver circuitry configured to drive the display to present an image; adjusting a first brightness setting, during the processing of the image data, corresponding to both the FP pixel region and the outer pixel region to provide illumination for the optical fingerprint sensor; and adjusting a second brightness setting, during the processing of the image data, corresponding to only the outer pixel region.

Abstract: A semiconductor device comprises circuitry and a timing generator. The circuitry is configured to generate an emission control signal that controls light emission of pixels of a display panel such that a first vertical sync period comprises a plurality of control cycles for the light emission of the pixels. The timing generator is configured to, when a length of the first vertical sync period is changed, start a next vertical sync period following the first vertical sync period at timing based on a length of the control cycles.

Abstract: Provided is a display driver which can be used in common in any of COF mounting and COG mounting. In the display driver, a position (or write/output position) of display data output by an output circuit can be changed along a direction of an array of external output terminals S1 to S540 according to mode data, whereby an array of external output terminals to use for output can be selected from more than one kind of arrays different in layout pitch. Therefore, the display driver can be used in display panels with signals lines having different pitches serving to receive drive signals from the display driver and in addition, used in common in any of COF mounting and COG mounting which are different from each other in the pitch of mounting wiring lines.

Abstract: An example method of illuminating an optical fingerprint sensor integrated with a display, where the display includes a fingerprint (FP) pixel region and an outer pixel region exclusive of the FP pixel region, is described. The method includes: processing image data in display driver circuitry configured to drive the display to present an image; adjusting a first brightness setting, during the processing of the image data, corresponding to both the FP pixel region and the outer pixel region to provide illumination for the optical fingerprint sensor; and adjusting a second brightness setting, during the processing of the image data, corresponding to only the outer pixel region.

Abstract: Provided is a display driver which can be used in common in any of COF mounting and COG mounting. In the display driver, a position (or write/output position) of display data output by an output circuit can be changed along a direction of an array of external output terminals S1 to S540 according to mode data, whereby an array of external output terminals to use for output can be selected from more than one kind of arrays different in layout pitch. Therefore, the display driver can be used in display panels with signals lines having different pitches serving to receive drive signals from the display driver and in addition, used in common in any of COF mounting and COG mounting which are different from each other in the pitch of mounting wiring lines.

Abstract: Provided is a display driver which can be used in common in any of COF mounting and COG mounting. In the display driver, a position (or write/output position) of display data output by an output circuit can be changed along a direction of an array of external output terminals S1 to S540 according to mode data, whereby an array of external output terminals to use for output can be selected from more than one kind of arrays different in layout pitch. Therefore, the display driver can be used in display panels with signals lines having different pitches serving to receive drive signals from the display driver and in addition, used in common in any of COF mounting and COG mounting which are different from each other in the pitch of mounting wiring lines.

Abstract: The present invention is to provide a semiconductor device that can correctly switch endians on the outside even if the endian of a parallel interface is not recognized on the outside. The semiconductor device includes a switching circuit and a first register. The switching circuit switches between whether a parallel interface with the outside is to be used as a big endian or a little endian. A first register holds control data of the switching circuit. The switching circuit regards the parallel interface as the little endian when first predetermined control information, that is unchanged in the values of specific bit positions even if its high-order and low-order bit positions are transposed, is supplied to the first register, and regards the parallel interface as the big endian when second predetermined control information, that is unchanged in the values of specific bit positions even if its high-order and low-order bit positions are transposed, is supplied to the first register.

Abstract: The present invention is to provide a semiconductor device that can correctly switch endians on the outside even if the endian of a parallel interface is not recognized on the outside. The semiconductor device includes a switching circuit and a first register. The switching circuit switches between whether a parallel interface with the outside is to be used as a big endian or a little endian. A first register holds control data of the switching circuit. The switching circuit regards the parallel interface as the little endian when first predetermined control information, that is unchanged in the values of specific bit positions even if its high-order and low-order bit positions are transposed, is supplied to the first register, and regards the parallel interface as the big endian when second predetermined control information, that is unchanged in the values of specific bit positions even if its high-order and low-order bit positions are transposed, is supplied to the first register.

Abstract: The present invention is to provide a semiconductor device that can correctly switch endians on the outside even if the endian of a parallel interface is not recognized on the outside. The semiconductor device includes a switching circuit and a first register. The switching circuit switches between whether a parallel interface with the outside is to be used as a big endian or a little endian. A first register holds control data of the switching circuit. The switching circuit regards the parallel interface as the little endian when first predetermined control information, that is unchanged in the values of specific bit positions even if its high-order and low-order bit positions are transposed, is supplied to the first register, and regards the parallel interface as the big endian when second predetermined control information, that is unchanged in the values of specific bit positions even if its high-order and low-order bit positions are transposed, is supplied to the first register.

Abstract: Provided is a display driver which can be used in common in any of COF mounting and COG mounting. In the display driver, a position (or write/output position) of display data output by an output circuit can be changed along a direction of an array of external output terminals S1 to S540 according to mode data, whereby an array of external output terminals to use for output can be selected from more than one kind of arrays different in layout pitch. Therefore, the display driver can be used in display panels with signals lines having different pitches serving to receive drive signals from the display driver and in addition, used in common in any of COF mounting and COG mounting which are different from each other in the pitch of mounting wiring lines.

Abstract: In a display driver, a first backlight control unit using a histogram and a second backlight control unit using an optical sensor can be used in combination. The display driver includes a PWM generating unit setting a control signal value consisting of a product of a luminance rate of X % and a luminance rate of Y % as a luminance rate of a control signal for controlling a backlight with respect to maximum backlight luminance when a luminance rate of a control signal obtained by first backlight control with respect to the maximum backlight luminance is X % and a luminance rate of a control signal obtained by second backlight control with respect to the maximum backlight luminance is Y %.

Abstract: The present invention is to provide a semiconductor device that can correctly switch endians on the outside even if the endian of a parallel interface is not recognized on the outside. The semiconductor device includes a switching circuit and a first register. The switching circuit switches between whether a parallel interface with the outside is to be used as a big endian or a little endian. A first register holds control data of the switching circuit. The switching circuit regards the parallel interface as the little endian when first predetermined control information, that is unchanged in the values of specific bit positions even if its high-order and low-order bit positions are transposed, is supplied to the first register, and regards the parallel interface as the big endian when second predetermined control information, that is unchanged in the values of specific bit positions even if its high-order and low-order bit positions are transposed, is supplied to the first register.