Abstract: Embodiments of a semiconductor memory device include a substrate having a first region with peripheral devices, a second region with one or more memory arrays, and a third region between the first and the second regions. The semiconductor memory device also includes a protective structure for peripheral devices. The protective structure for peripheral devices of the semiconductor memory device includes a first dielectric layer and a barrier layer disposed on the first dielectric layer. The protective structure for peripheral devices of the semiconductor memory device further includes a dielectric spacer formed on a sidewall of the barrier layer and a sidewall of the first dielectric layer, wherein the protective structure is disposed over the first region and at least a portion of the third region.

Abstract: An optical imaging lens may include a first, a second, a third, a fourth and a fifth lens elements positioned in an order from an object side to an image side. Through designing concave and/or convex surfaces of the five lens elements, the improved optical imaging lens may provide better imaging quality while the effective focal length may be enlarged, and the f-number may be maintained.

Abstract: A connection system for a linear lighting system has channels of adjacent luminaires coupled together by a coupling arrangement having a first plate, a second plate and fixings for clamping the first and second plates around wall portions of the two channels. The fixings are slidable along slots so that the coupling arrangement can be slid into an operable position or to an out-of-the way position for disassembly. One of the first and second plates comprises a spring member having sprung projections for projecting into the apertures, to provide an automatic clamping function when the coupling arrangement is tightened. For example, there may be an outer coupling plate and an inner spring plate which forms the spring member.

Abstract: An optical imaging lens may include a first, a second, a third, a fourth, a fifth, and a sixth lens elements positioned in an order from an object side to an image side. Through designing concave and/or convex surfaces of the six lens elements, the improved optical imaging lens may provide better imaging quality while the length of the lens may be shortened, the F-number may be reduced, and the field of view may be extended.

Abstract: An optical imaging lens may include a first, a second, a third, a fourth, a fifth, a sixth, a seventh, and an eighth lens elements positioned in an order from an object side to an image side. Through designing concave and/or convex surfaces of the eight lens elements, the improved optical imaging lens may provide better imaging quality while the system length may be shortened, the F-number may be reduced, the field of view may be extended, and the image height may be increased.

Abstract: The present invention provides an optical imaging lens. The optical imaging lens comprises eight lens elements positioned in an order from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements, the optical imaging lens may enlarge aperture stop and image height and increase resolution.

Abstract: Disclosed herein is a novel, compact, real time optical particle identification and characterization system and method of use within both gaseous and liquid media. The system can implement elastic and/or inelastic light scattering techniques simultaneously and complimentarily under the same sensor platform. By separating the sensing components from the electro-optical unit and using optical fibers for interconnection, only the sensing components need to be exposed to the environmental conditions. This reduces the design constraints on the electro-optical unit and permits the incorporation of optical components into the sensor probe that can withstand high-temperature, high-pressure, and corrosive environments. Thus, the system can be used in benign, moderate, and harsh environments.

Abstract: The present invention provides an optical imaging lens. The optical imaging lens comprises seven lens elements positioned in an order from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements, the optical imaging lens may shorten system length, enlarge aperture size and promote image height.

Abstract: An optical imaging lens including first, second, third, fourth, fifth and sixth lens elements sequentially along an optical axis from an object side to an image side is provided. The first to sixth lens elements each includes an object-side surface facing toward the object side and allowing imaging rays to pass through and an image-side surface facing toward the image side and allowing imaging rays to pass through. The optical imaging lens has only the six lens elements and satisfies condition expressions of Li11t42/L42t62?2.400 and V3+V4+V5?120.000.

Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

Abstract: A method for dividing communication services in smart substation into different priorities, the method including: determining the priority of a message to be sent according to the service type and its priority definition; the communication services includes trip message, state change message, sampled value message, device status message, time synchronization message, and file transfer message; the corresponding priority is respectively defined as 7, 6, 5, 4, 3, 1; and filling the user priority field of IEEE802.1Q label in a message header with a binary value corresponding to its priority.

Abstract: An optical imaging lens includes a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element arranged in order from an object side to an image side along an optical axis. Each lens element has an object-side surface and an image-side surface. The object-side surface of the third lens element has a convex portion in a vicinity of a periphery of the third lens element; the object-side surface of the fourth lens element has a convex portion in a vicinity of the optical axis; the object-side surface of the fifth lens element has a convex portion in a vicinity of the optical axis; the image-side surface of the fifth lens element has a convex portion in a vicinity of a periphery of the fifth lens element; and the seventh lens element has negative refracting power.

Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

Abstract: The underwater acoustic test system comprises an underwater acoustic transmitting unit, an underwater acoustic parabolic reflector, an underwater acoustic receiving unit, an orientation control system, and a computer measurement and control system. The underwater acoustic transmitting unit comprises an underwater acoustic signal generator and a transmitting transducer. The underwater acoustic parabolic reflector comprises a central main reflecting area and an edge diffraction processing area, wherein the central main reflecting area is configured for reflecting acoustic wave signals, and the edge diffraction processing area is configured for reducing the influence of the underwater acoustic parabolic reflector on a test area. The underwater acoustic receiving unit comprises a receiving transducer and an underwater acoustic signal receiver. The orientation control system comprises a traveling crane and a test turntable.

Abstract: An optical imaging lens includes a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element arranged in order from an object side to an image side along an optical axis. Each lens element has an object-side surface and an image-side surface.

Abstract: The invention is also directed to a coextruded film comprising a core layer which comprises between 20 wt. % and 99 wt % znLLDPE or HDPE, wherein the core layer further comprises filler materials; and outer layers on each side of the core layer comprising between 50 and 99 wt % of one of LLDPE, LDPE, blends of LLDPE and LDPE, or mLLDPE; wherein the film contains relatively opaque embossed regions and relatively clear unembossed regions, wherein the opaque embossed regions comprise embossment-induced cavities and the filler materials.

Abstract: An optical imaging lens includes a first lens element to a seventh lens element, and each lens element has an object-side surface and an image-side surface. The second lens element has negative refracting power, a periphery region of the object-side surface of the third lens element is concave, an optical axis region of the image-side surface of the third lens element is convex, the fifth lens element has positive refracting power, an optical axis region of the image-side surface of the fifth lens element is convex, an optical axis region of the image-side surface of the sixth lens element is concave, an optical axis region of the image-side surface of the seventh lens element is concave, a periphery region of the image-side surface of the seventh lens element is convex. The optical imaging lens satisfies the following conditions: D11t42/AAG37?1.700 and D11t31/G34?12.000.

Abstract: A method of processing a semiconductor wafer is provided. The method includes installing upper lid. The installation of the upper lid includes placing an inlet manifold on a water box; inserting a jig into a lower gas channel in the water box and inserting into an upper gas channel in the inlet manifold; fastening the water box to the inlet manifold; and removing the jig after the water box engaging with the inlet manifold. The method also includes connecting a shower head on a lower side of the water box; and connecting the upper lid to a housing. The method further includes placing a semiconductor wafer into the housing. In addition, the method includes supplying a process gas over the semiconductor wafer through the upper gas channel, the lower gas channel and the shower head.

Abstract: A package for storing perishable goods. Film forming the package has an inner layer that defines an interior surface of the package and is formed from a polyethylene and a tack agent that has migrated to the interior surface to provide tackiness. The tackiness permits cold resealing of the package after it has been opened, without substantially adhering to the perishable goods so that the perishable goods can be non-destructively removed from the package. An outer layer of the film defines an exterior surface of the package and is formed from another polyethylene. The polyethylene of the outer layer is configured to block migration of the tack agent through the outer layer such that the exterior surface is substantially non-tacky.