Patents by Inventor Hajime Sasaki

Hajime Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220009446
    Abstract: A biometric authentication system is configured to perform a biometric authentication operation based on biometric information of an occupant in a passenger compartment of a vehicle and is configured to permit starting of a travel driving force source in the vehicle based on a condition that biometric authentication is established in the biometric authentication operation. The biometric authentication system includes: a biometric information detecting unit configured to detect the biometric information; and a notification unit configured to issue a notification dependent on non-establishment of biometric authentication in the biometric authentication operation to the occupant. The notification unit is configured to issue the notification dependent on the non-establishment of the biometric authentication based on a condition that a brake pedal is depressed at the time of detecting the biometric information by the biometric information detecting unit when the biometric authentication is not established.
    Type: Application
    Filed: July 6, 2021
    Publication date: January 13, 2022
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
    Inventors: Yuya GOTO, Naoyuki TAKADA, Hajime SASAKI, Hirokazu ITAKURA, Takahiko ANDO, Daisuke OGAWA
  • Publication number: 20210102872
    Abstract: In a method of producing a test-sample for a transmission electron microscope, it is so arranged that a massive body in a rectangular parallelepiped shape including a multiple quantum well active layer is cut out from a laser diode being a workpiece; thereafter, a test-sample is produced in which tilting oblique cutoff portions are formed at corner portions contiguously bordering on an upper surface of the massive body, so that surface-part active layers can be visually identified thereat; and thereafter, the test-sample is made thinner, and also an observation test-sample is cut out therefrom by taking on, as references, two surface-part active layers visually identifiable at the tilting oblique cutoff portions.
    Type: Application
    Filed: May 25, 2018
    Publication date: April 8, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventor: Hajime SASAKI
  • Patent number: 10957770
    Abstract: A semiconductor layer (2,3) is provided on a substrate (1). A gate electrode (4), a source electrode (5) and a drain electrode (6) are provided on the semiconductor layer (3). A first passivation film (7) covers the gate electrode (4) and the semiconductor layer (3). A source field plate (9) is provided on the first passivation film (7), and extends from the source electrode (5) to a space between the gate electrode (4) and the drain electrode (6). A second passivation film (10) covers the first passivation film (7) and the source field plate (9). An end portion on the drain electrode (6) side of the source field plate (9) is curved to be rounded.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: March 23, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventor: Hajime Sasaki
  • Publication number: 20200319055
    Abstract: A test method for a semiconductor device having a package with airtight space, which is formed between a substrate wafer on which an element is formed and a cap wafer which is provided being opposite to the substrate wafer, comprises an applying water process in which the semiconductor device is exposed to high moisture atmosphere and cooled and a leak discrimination process in which power is supplied to the element which is formed on the substrate wafer and leak of the package is discriminated by detecting a sound wave which is generated by the semiconductor device.
    Type: Application
    Filed: November 2, 2017
    Publication date: October 8, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Hajime SASAKI
  • Publication number: 20200295144
    Abstract: A semiconductor layer (2,3) is provided on a substrate (1). A gate electrode (4), a source electrode (5) and a drain electrode (6) are provided on the semiconductor layer (3). A first passivation film (7) covers the gate electrode (4) and the semiconductor layer (3). A source field plate (9) is provided on the first passivation film (7), and extends from the source electrode (5) to a space between the gate electrode (4) and the drain electrode (6). A second passivation film (10) covers the first passivation film (7) and the source field plate (9). An end portion on the drain electrode (6) side of the source field plate (9) is curved to be rounded.
    Type: Application
    Filed: December 22, 2016
    Publication date: September 17, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Hajime SASAKI
  • Patent number: 10746435
    Abstract: In order to enable a drain pan to be visually checked for contamination without requiring a complicated operation, the present invention is configured so as to be equipped with: a housing; a drain pan provided inside the housing; a drain pump for pumping up drain water accumulated in the drain pan; an opening provided in a side surface of the housing; and a cover member attached to the opening and covering the opening. When the cover member is detached from the opening at least a portion of the drain pan can be viewed from the opening.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: August 18, 2020
    Assignee: HITACHI-JOHNSON CONTROLS AIR CONDITIONING, INC.
    Inventors: Naoki Muramatsu, Hajime Sasaki, Kouji Yonekura, Kazuho Hirao, Ryou Shibusawa, Hiroki Kinoshita
  • Publication number: 20200220079
    Abstract: A semiconductor layer (2,3) is provided on a substrate (1). A gate electrode (4), a source electrode (5) and a drain electrode (6) are provided on the semiconductor layer (3). A strongly correlated electron system material (12) is connected between the gate electrode (4) and the source electrode (5).
    Type: Application
    Filed: December 22, 2016
    Publication date: July 9, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Hajime SASAKI
  • Patent number: 10689167
    Abstract: In the container, when the cap is capped on the container opening portion, an inner wall surface of a cylindrical sub-fitting wall portion of the cap and an outer wall surface of a large diameter opening portion of the container opening portion closely contact each other, and an outer wall surface of a cylindrical main fitting wall portion of the cap and an inner wall surface of a small diameter opening portion of the container opening portion closely contact each other. In this way, pressing force that is applied to the outer wall surface of the cylindrical main fitting wall portion of the cap from the inner wall surface of the small diameter opening portion of the container opening portion is increased.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: June 23, 2020
    Assignees: TOKYO LIGHT INDUSTRY CO., LTD., KYORAKU CO., LTD.
    Inventors: Takaaki Sakimura, Masashi Sasaki, Masashi Mizuochi, Hajime Sasaki, Satoshi Ichikawa
  • Patent number: 10644119
    Abstract: A semiconductor layer (2,3) is provided on a substrate (1). A gate electrode (4), a source electrode (5) and a drain electrode (6) are provided on the semiconductor layer (3). A first passivation film (7) covers the gate electrode (4) and the semiconductor layer (3). A source field plate (9) is provided on the first passivation film (7), and extends from the source electrode (5) to a space between the gate electrode (4) and the drain electrode (6). A second passivation film (10) covers the first passivation film (7) and the source field plate (9). The first passivation film (7) has a quasi-conductive thin film (8) provided at least between the gate electrode (4) and the drain electrode (6) and having an electric resistivity of 1.0 ?cm to 1010 ?cm.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: May 5, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventor: Hajime Sasaki
  • Publication number: 20200124492
    Abstract: A test method for a semiconductor device comprising a substrate wafer in which an element is formed and a material through which an infrared ray can be transmitted and a package having airtight space between a cap wafer which is provided being opposite to the substrate wafer, and which includes an applying water process in which a semiconductor device is exposed to high moisture atmosphere and a leak discrimination process in which an infrared ray from the semiconductor device is detected and leak of the package is discriminated based on absorption of the infrared ray by water molecules.
    Type: Application
    Filed: October 10, 2017
    Publication date: April 23, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Hajime SASAKI
  • Publication number: 20190273140
    Abstract: A semiconductor layer (2,3) is provided on a substrate (1). A gate electrode (4), a source electrode (5) and a drain electrode (6) are provided on the semiconductor layer (3). A first passivation film (7) covers the gate electrode (4) and the semiconductor layer (3). A source field plate (9) is provided on the first passivation film (7), and extends from the source electrode (5) to a space between the gate electrode (4) and the drain electrode (6). A second passivation film (10) covers the first passivation film (7) and the source field plate (9). The first passivation film (7) has a quasi-conductive thin film (8) provided at least between the gate electrode (4) and the drain electrode (6) and having an electric resistivity of 1.0 ?cm to 1010 ?cm.
    Type: Application
    Filed: January 10, 2017
    Publication date: September 5, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventor: Hajime SASAKI
  • Cap
    Patent number: 10259624
    Abstract: An annular protruding portion (17) is provided around an inner plug (13) at a radial interval on an annular horizontal wall portion (20) of a cap body 4. Between an annular flange portion (43a) of the inner plug (13) and the annular protruding portion (17), an annular accumulating groove portion (33) is provided. Particularly in the case of a liquid content, the liquid content may be scattered from within a cylindrical guide portion (42) when a lid member (5) is placed after use. The liquid content, however, is blocked by the annular protruding portion (17) and prevented from flowing further outward, while interfering with a top surface portion (51) and a cylindrical scattering suppression portion (55) of the lid member (5). Thus, downward flow of the liquid content along the outer wall surface of the annular horizontal wall portion (20) of a main cap member (11) can be suppressed.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: April 16, 2019
    Assignees: TOKYO LIGHT INDUSTRY CO., LTD., KYORAKU CO., LTD.
    Inventors: Takaaki Sakimura, Masashi Sasaki, Masashi Mizuochi, Hajime Sasaki, Satoshi Ichikawa
  • Publication number: 20190041088
    Abstract: In order to enable a drain pan to be visually checked for contamination without requiring a complicated operation, the present invention is configured so as to be equipped with: a housing; a drain pan provided inside the housing; a drain pump for pumping up drain water accumulated in the drain pan; an opening provided in a side surface of the housing; and a cover member attached to the opening and covering the opening. When the cover member is detached from the opening at least a portion of the drain pan can be viewed from the opening.
    Type: Application
    Filed: December 20, 2016
    Publication date: February 7, 2019
    Inventors: Naoki MURAMATSU, Hajime SASAKI, Kouji YONEKURA, Kazuho HIRAO, Ryou SHIBUSAWA, Hiroki KINOSHITA
  • Patent number: 10112579
    Abstract: A vehicle antitheft system includes a house security device and a vehicle security device. The house security device includes a detection unit and a transmission unit configured to transmit a notification when a state change of a predetermined security unit is detected by the detection unit. The vehicle security device includes a reception unit configured to receive the notification transmitted from the transmission unit and a function control unit configured to control a vehicle antitheft function depending on whether the notification is received by the reception unit. The function control unit is configured to release the vehicle antitheft function when the notification is not received and a regular vehicle key is used to operate a vehicle, and to restrict releasing of the vehicle antitheft function when the notification is received and the regular vehicle key is used to operate the vehicle.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: October 30, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Hajime Sasaki
  • Publication number: 20180111724
    Abstract: In the container, when the cap is capped on the container opening portion, an inner wall surface of a cylindrical sub-fitting wall portion of the cap and an outer wall surface of a large diameter opening portion of the container opening portion closely contact each other, and an outer wall surface of a cylindrical main fitting wall portion of the cap and an inner wall surface of a small diameter opening portion of the container opening portion closely contact each other. In this way, pressing force that is applied to the outer wall surface of the cylindrical main fitting wall portion of the cap from the inner wall surface of the small diameter opening portion of the container opening portion is increased.
    Type: Application
    Filed: March 25, 2016
    Publication date: April 26, 2018
    Inventors: Takaaki SAKIMURA, Masashi SASAKI, Masashi MIZUOCHI, Hajime SASAKI, Satoshi ICHIKAWA
  • CAP
    Publication number: 20180086516
    Abstract: An annular protruding portion (17) is provided around an inner plug (13) at a radial interval on an annular horizontal wall portion (20) of a cap body 4. Between an annular flange portion (43a) of the inner plug (13) and the annular protruding portion (17), an annular accumulating groove portion (33) is provided. Particularly in the case of a liquid content, the liquid content may be scattered from within a cylindrical guide portion (42) when a lid member (5) is placed after use. The liquid content, however, is blocked by the annular protruding portion (17) and prevented from flowing further outward, while interfering with a top surface portion (51) and a cylindrical scattering suppression portion (55) of the lid member (5). Thus, downward flow of the liquid content along the outer wall surface of the annular horizontal wall portion (20) of a main cap member (11) can be suppressed.
    Type: Application
    Filed: March 25, 2016
    Publication date: March 29, 2018
    Inventors: Takaaki SAKIMURA, Masashi SASAKI, Masashi MIZUOCHI, Hajime SASAKI, Satoshi ICHIKAWA
  • Publication number: 20170259784
    Abstract: A vehicle antitheft system includes a house security device and a vehicle security device. The house security device includes a detection unit and a transmission unit configured to transmit a notification when a state change of a predetermined security unit is detected by the detection unit. The vehicle security device includes a reception unit configured to receive the notification transmitted from the transmission unit and a function control unit configured to control a vehicle antitheft function depending on whether the notification is received by the reception unit. The function control unit is configured to release the vehicle antitheft function when the notification is not received and a regular vehicle key is used to operate a vehicle, and to restrict releasing of the vehicle antitheft function when the notification is received and the regular vehicle key is used to operate the vehicle.
    Type: Application
    Filed: March 7, 2017
    Publication date: September 14, 2017
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Hajime SASAKI
  • Patent number: 9691875
    Abstract: A method of manufacturing a nitride semiconductor device includes: forming a transistor having a gate electrode Schottky-joined to a nitride semiconductor layer; performing high-temperature annealing at a temperature of 200 to 360° C. for 8 to 240 hours on the transistor; and after the high-temperature annealing, performing RF burn-in by applying radiofrequency power to the transistor at a channel temperature of 180 to 360° C.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: June 27, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventor: Hajime Sasaki
  • Cap
    Patent number: 9637282
    Abstract: A cap body of a cap includes: a cylindrical inner wall section to be fitted into an inner wall surface of a container mouth section; an annular wall section that extends obliquely in an upper direction toward a radial-direction center integrally from an inner wall surface of the cylindrical inner wall section, has a lower wall surface of a truncated conical shape, and has a discharge hole in a radial-direction center portion; a check valve disposed above the annular wall section to open or close the discharge hole in such a manner that a valve section is detached from or seated on an annular valve seat around the discharge hole; and a guiding tubular body disposed above the check valve and having a discharge passage of contents from the discharge hole. Therefore, at the time of using the contents, the contents can be smoothly discharged to the outside.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: May 2, 2017
    Assignee: TOKYO LIGHT INDUSTRY CO., LTD.
    Inventors: Takaaki Sakimura, Masashi Sasaki, Masashi Mizuochi, Hajime Sasaki, Satoshi Ichikawa
  • Publication number: 20160141385
    Abstract: A method of manufacturing a nitride semiconductor device includes: forming a transistor having a gate electrode Schottky-joined to a nitride semiconductor layer; performing high-temperature annealing at a temperature of 200 to 360° C. for 8 to 240 hours on the transistor; and after the high-temperature annealing, performing RF burn-in by applying radiofrequency power to the transistor at a channel temperature of 180 to 360° C.
    Type: Application
    Filed: June 23, 2015
    Publication date: May 19, 2016
    Applicant: Mitsubishi Electric Corporation
    Inventor: Hajime SASAKI