Abstract: Methods and apparatuses for adjusting and controlling conditions within the environment of a workpiece handling module include sensors for detecting humidity and concentration of harmful gasses. Signals generated by these sensors are utilized to generate signals that control the flow of air into the environment and/or the flow of air and gases out of the environment. By controlling the humidity, negative impacts on processes carried out in the environment are avoided. By controlling the gas concentration, exposure of workers to harmful gases is avoided.

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

Abstract: A method of a flash memory controller includes: providing an input/output (I/O) circuit coupled to the flash memory device; and sending a data toggle set-feature signal to the flash memory device to enable, disable, or configure a data toggle operation of the flash memory device; the data toggle operation of the flash memory device is arranged to make the flash memory device control the flash memory device's data register selecting and transferring a first data unit and a second data unit to the flash memory device's I/O control circuit to make the I/O control circuit sequentially transmit the first data unit and the second data unit to the flash memory controller through the specific communication interface in response to a specific read command or a data toggle command transmitted by the flash memory controller.

Abstract: A flash memory device is disclosed. The memory cell array has a first plane and a second plane and stores a first data unit and a second data unit. The data register buffers the first data unit and the second data unit transmitted from the memory cell array when a read command or a data toggle command is received and stored by the command register. The control circuit performs a data toggle operation to control the data register selecting and transferring the first data unit and the second data unit to the I/O control circuit to make the I/O control circuit sequentially transmit the first data unit and the second data unit to the flash memory controller through a specific communication interface in response to the read command or the data toggle command. The transmission of the first data unit is followed by the transmission of the second data unit.

Abstract: A semiconductor device includes a gate structure, a drift region, a source region, a drain region, and a doped region. The gate structure is over a semiconductor substrate. The drift region is in the semiconductor substrate and laterally extends past a first side of the gate structure. The source region is in the semiconductor substrate and adjacent a second side of the gate structure opposite the first side. The drain region is in the drift region. The doped region is in the drift region and between the drain region and the gate structure. From a top view the doped region has a strip pattern extending in parallel with a strip pattern of the gate structure.

Abstract: A method, computer system, and a computer program product for projecting a 3D model defined by x, y, z coordinates onto the surface of a 2D image defined by u, v coordinates is provided. The present invention may include receiving a 3D model having a plurality of polygons, wherein certain edges are marked as seams. The present invention may include receiving input from a user, wherein the input comprises painting one or more parts of the 3D model in different colors, wherein the colors correspond with a weight of the area painted. The present invention may include unwrapping, by a processor, a 2D texture from the 3D model using a projection algorithm. The present invention may include generating a rectangular boundary around each island. The present invention may include scaling each island according to a gradient score.

Abstract: A first device performs periodic scanning alternately, where a first scanning periodicity is used for a first-type Bluetooth connection, and a second scanning periodicity is used for a second-type Bluetooth connection; the first device receives a first-type data packet from a second device in a first scan window of any first scanning periodicity, where the first-type data packet is used to establish the first-type Bluetooth connection; the first device obtains, based on the first-type data packet, a second connection parameter for establishing the second-type Bluetooth connection to the second device; and the first device establishes the second-type Bluetooth connection to the second device based on the second connection parameter.

Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.

Abstract: A method of a flash memory controller includes: providing an input/output (I/O) circuit coupled to a flash memory device through a specific communication interface; and, controlling a processor sending a specific read command or a data toggle command through the I/O circuit and the specific communication interface into the flash memory device, to make the flash memory device perform a data toggle operation to control the flash memory device's data register selecting and transferring a first data unit and a second data unit to the flash memory device's I/O control circuit to make the I/O control circuit sequentially transmit the first data unit and the second data unit to the flash memory controller through the specific communication interface in response to the specific read command or the data toggle command.

Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film, wherein in the ultraviolet band, the difference of between the wavelength with the transmittance at 80% of the absorbing film and the wavelength with the reflectivity at 80% of the first multilayer film falls in the range between 25 nm and 37 nm, the difference of between the wavelength with the transmittance at 50% of the absorbing film and the wavelength with the reflectivity at 50% of the first multilayer film falls in the range between 6 nm and 14 nm, and the difference of between the wavelength with the transmittance at 20% of the absorbing film and the wavelength with the reflectivity at 20% of the first multilayer film falls in the range between ?6 nm and 2.5 nm.

Abstract: A method includes obtaining a multi-utterance training sample that includes audio data characterizing utterances spoken by two or more different speakers and obtaining ground-truth speaker change intervals indicating time intervals in the audio data where speaker changes among the two or more different speakers occur. The method also includes processing the audio data to generate a sequence of predicted speaker change tokens using a sequence transduction model. For each corresponding predicted speaker change token, the method includes labeling the corresponding predicted speaker change token as correct when the predicted speaker change token overlaps with one of the ground-truth speaker change intervals. The method also includes determining a precision metric of the sequence transduction model based on a number of the predicted speaker change tokens labeled as correct and a total number of the predicted speaker change tokens in the sequence of predicted speaker change tokens.

Abstract: Integrated circuit packages and methods of forming the same are provided. In an embodiment, a device includes: a power distribution interposer including: a first bonding layer; a first die connector in the first bonding layer; and a back-side interconnect structure including a power rail connected to the first die connector; and an integrated circuit die including: a second bonding layer directly bonded to the first bonding layer by dielectric-to-dielectric bonds; a second die connector in the second bonding layer, the second die connector directly bonded to the first die connector by metal-to-metal bonds; and a device layer on the second bonding layer, the device layer including a contact and a transistor, the transistor including a first source/drain region, the contact connecting a back-side of the first source/drain region to the second die connector.

Abstract: A method includes receiving a plurality of unlabeled audio samples corresponding to spoken utterances not paired with corresponding transcriptions. At a target branch of a contrastive Siamese network, the method also includes generating a sequence of encoder outputs for the plurality of unlabeled audio samples and modifying time characteristics of the encoder outputs to generate a sequence of target branch outputs. At an augmentation branch of a contrastive Siamese network, the method also includes performing augmentation on the unlabeled audio samples, generating a sequence of augmented encoder outputs for the augmented unlabeled audio samples, and generating predictions of the sequence of target branch outputs generated at the target branch. The method also includes determining an unsupervised loss term based on target branch outputs and predictions of the sequence of target branch outputs. The method also includes updating parameters of the audio encoder based on the unsupervised loss term.

Abstract: A semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent one another. The semiconductor package includes a semiconductor bridge overlapping a first corner of the first semiconductor die and a second corner of the second semiconductor die. The semiconductor bridge electrically couples the first semiconductor to the second semiconductor die. The semiconductor package includes a third semiconductor die and a fourth semiconductor die electrically coupled to the first semiconductor die and the second semiconductor die, respectively. The semiconductor bridge is interposed between the third semiconductor die and the fourth semiconductor die.

Abstract: A gear module includes a rotating cylinder, a first planetary gear set, a second planetary gear set, a concave-convex structure, and a limit bearing set. The first planetary gear set is accommodated in the rotating cylinder and includes a driven gear; the second planetary gear set includes a positioning frame, second planetary gears pivoted to a positioning frame, a driven gear engaged with the second planetary gears, and the positioning frame has a through hole; the concave-convex structure includes a convex column extended from the rotating cylinder and a concave hole formed on the positioning frame, the convex column is plugged into the concave hole; the limit bearing set includes a first ball bearing sheathing the driven gear and mounted between the driven gear and the through hole, and a second ball bearing sheathing the convex column and mounted between the convex column and the concave hole.

Abstract: A coherent Raman spectro-microscopy system is configured for generating a spectro-microscopic image of a sample and includes a light source, a supercontinuum spectrum generator, a color filter assembly, and a spectro-microscopic assembly. The light source is for emitting at least one pulsed laser beam. The supercontinuum spectrum generator is for broadening the bandwidth of at least one pulsed laser beam. The color filter assembly is for filtering the bandwidth of at least one pulsed laser beam according to a predetermined bandwidth and converting at least one pulsed laser beam into a coherent spectro-microscopic laser beam. The sample is disposed in the spectro-microscopic assembly, and the spectro-microscopic assembly receives the coherent spectro-microscopic laser beam so that the coherent spectro-microscopic laser beam passes through the sample to generate the spectro-microscopic image of the sample.

Abstract: A computer-implemented method according to one embodiment includes performing object detection on a frame to identify a set of objects within the frame, and determining a location of each object of the set of objects within the frame. The method further includes constructing a code tree structure for the frame. The code tree structure defines the determined locations. A rule defining modifications to make to at least some of the objects is received and the code tree structure is crawled. The rule is applied to the objects during the crawling. The method further includes layering the modifications defined in the rule on the set of objects within the frame. A computer program product according to another embodiment includes a computer readable storage medium having program instructions embodied therewith. The program instructions are readable and/or executable by a computer to cause the computer to perform the foregoing method.

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: A method of a flash memory controller includes: controlling an I/O circuit using a set-feature signal, which carries a set-feature command, feature address, and parameter information, and transmitting the set-feature signal to a flash memory device; the feature address corresponds to a valid data portion or a dummy data portion following the valid data portion, and both the valid data portion and dummy data portion are comprised in a full page data which is to be written into a physical page unit of the flash memory device or to be read out from the physical page unit; the corresponding parameter information is used to record the valid data portion's column address and data length, the dummy data portion's column address and data length, the dummy data portion's column address and the valid data portion's, or the dummy data portion's data length and the valid data portion's data length.

Abstract: A method of manufacturing a semiconductor structure is provided. A conductive layer is formed on a precursor memory structure. A target layer is formed on the conductive layer. A first photoresist with a first opening is formed on the target layer. A spacer is formed on sidewalls of the first opening. A second photoresist with a second opening is formed on the target layer and the spacer. The target layer is patterned by the second photoresist and the spacer to form a first patterned target layer. A third photoresist with a third opening is formed on the first patterned target layer. The first patterned target layer is patterned by the third photoresist to form a second patterned target layer. The conductive layer is patterned by the second patterned target layer to form a patterned conductive layer including a ring structure aligned with a source/drain region.