Abstract: In some embodiments, the present disclosure relates to an integrated chip having an inter-layer dielectric (ILD) structure along a first surface of a substrate having a photodetector. An etch stop layer is over the ILD structure, and a reflector is surrounded by the etch stop layer and the ILD structure. The reflector has a curved surface facing the substrate at a location directly over the photodetector. The curved surface is coupled between a first sidewall and a second sidewall of the reflector. The reflector has larger thicknesses along the first sidewall and the second sidewall than at a center of the reflector between the first sidewall and the second sidewall.

Abstract: A laser machining device includes a pulsed laser generator, an accommodation chamber, a bandwidth broadening unit and a pulse compression unit. The pulsed laser generator is configured to emit a pulsed laser. The accommodation chamber has a gas inlet. The bandwidth broadening unit is disposed in the accommodation chamber, and is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser. The pulse compression unit is disposed in the accommodation chamber. The bandwidth broadening unit and the pulse compression unit are arranged in order along a laser propagation path, and the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser.

Abstract: The present disclosure provides a multi-state one-time programmable (MSOTP) memory circuit including a memory cell and a programming voltage driving circuit. The memory cell includes a MOS storage transistor, a first MOS access transistor and a second MOS access transistor electrically connected to store two bits of data. When the memory cell is in a writing state, the programming voltage driving circuit outputs a writing control potential to the gate of the MOS storage transistor, and when the memory cell is in a reading state, the programming voltage driving circuit outputs a reading control potential to the gate of the MOS storage transistor.

Abstract: A semiconductor device includes: a first chip including a plurality of first device features and a plurality of first interconnect structures disposed above the first device features; a second chip including a plurality of second device features and a plurality of second interconnect structures disposed above the second device features; and an interposer bonded to the first chip and the second chip, and disposed on an opposite side from the first and second device features with respect to the first and second interconnect structures; wherein the interposer includes a plurality of power rails configured to deliver power to the first and second chips.

Abstract: Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a lower chamber area of a reactor. Methods, systems, and assemblies can be used to obtain desired etching and purging of the lower chamber area.

Abstract: A method for forming a double-sided capacitor structure includes: providing a base, the base including a substrate, a plurality of capacitor contacts located in the substrate, a stack structure located on a surface of the substrate and a plurality of capacitor holes running through the stack structure and exposing the capacitor contacts, the stack structure including sacrificial layers and support layers which are stacked alternately; successively forming a first electrode layer, a first dielectric layer and a second electrode layer on inner walls of the capacitor holes; forming a first conductive filling layer in the capacitor holes; forming an auxiliary layer for sealing the capacitor holes; removing a part of the auxiliary layers and several of the support layers and the sacrificial layers to expose the first electrode layer; and, forming a second dielectric layer and a third electrode layer.

Abstract: A method of a flash memory controller to be used in a storage device and coupled to a flash memory device of the storage device through a specific communication interface includes: using a set-feature signal, which carries a set-feature command, a macro execution feature address, and corresponding macro execution parameter information, as a macro execution signal and transmitting the macro execution signal to the flash memory device to make the flash memory device execute multiple set-feature operations respectively having unique information defined by the corresponding macro execution parameter information carried in the macro execution signal.

Abstract: A method of manufacturing a semiconductor structure is provided. A conductive layer is formed on a precursor memory structure. A target layer is formed on the conductive layer. A first photoresist with a first opening is formed on the target layer. A spacer is formed on sidewalls of the first opening. A second photoresist with a second opening is formed on the target layer and the spacer. The target layer is patterned by the second photoresist and the spacer to form a first patterned target layer. A third photoresist with a third opening is formed on the first patterned target layer. The first patterned target layer is patterned by the third photoresist to form a second patterned target layer. The conductive layer is patterned by the second patterned target layer to form a patterned conductive layer including a ring structure aligned with a source/drain region.

Abstract: In the present disclosure embodiments, a phosphate phosphor including an activation center of trivalent chromium and a light emitting device are provided. The light emitting device includes a light source and the above mentioned phosphate phosphor, such that the phosphate phosphor is excited by the light source and emits a wide spectrum of the infrared light. The light emitting device with wide emission spectrum of the infrared light may be widely applied in detecting devices.

Abstract: A method of a flash memory controller to be used in a storage device and coupled to a flash memory device of the storage device through a specific communication interface includes: using a set-feature signal, which carries a set-feature command, a macro execution feature address, and corresponding macro execution parameter information, as a macro execution signal and transmitting the macro execution signal to the flash memory device to make the flash memory device execute multiple set-feature operations respectively having unique information defined by the corresponding macro execution parameter information carried in the macro execution signal.

Abstract: The present disclosure provides a novel Streptococcus thermophilus strain, and the probiotic composition thereof and the use thereof for producing sialic acid and hyaluronic acid, anti-oxidation, anti-inflammatory, and alleviating dry eye syndrome. The novel Streptococcus thermophilus strain and/or metabolites thereof of the present disclosure can be used to prepare medicaments, food products, health food, and/or external products for anti-oxidation, anti-inflammation, and alleviating dry eye syndrome.

Abstract: A method of a flash memory controller to be used in a storage device and coupled to a flash memory device of the storage device through a specific communication interface includes: using a set-feature signal, which carries a set-feature command, a macro execution feature address, and corresponding macro execution parameter information, as a macro execution signal and transmitting the macro execution signal to the flash memory device to make the flash memory device execute multiple set-feature operations respectively having unique information defined by the corresponding macro execution parameter information carried in the macro execution signal.

Abstract: A flash memory scheme simplifies the command sequences transmitted between a flash memory device and a flash memory controller into a simplified command sequence so as to reduce the waiting time period of the command transmission and improve the performance of flash memory.

Abstract: A circuit includes a multiplier circuit that receives a signed mantissa of each data element of pluralities of input and weight data elements and generates two's complement products by performing multiplication and reformatting operations on some or all of the input data element signed mantissas and some or all of the weight data element signed mantissas, a summing circuit that receives an exponent of each data element of the pluralities of input and weight data elements and generates sums by adding each input data element exponent to each weight data element exponent, a shifting circuit that shifts each product by an amount equal to a difference between a corresponding sum and a maximum sum, and an adder tree that generates a mantissa sum from the shifted products.

Abstract: A dynamic asset spawning engine is provided in a data processing system for dynamically spawning assets in a video game based on one or more news feeds. The dynamic asset spawning engine semantically tags a library of video game assets with game tag descriptors. The dynamic asset spawning engine parses and processes the one or more news feeds to identify supplemental tag descriptors and spawning parameters for one or more video game assets in the library of video game assets. The dynamic spawning engine assigns the identified supplemental tag descriptors and spawning parameters to the one or more video game assets. The video game spawns the one or more game assets in the video game in accordance with the supplemental tag descriptors and spawning parameters.

Abstract: Semiconductor device structure and methods of forming the same are described. The structure includes a first dielectric layer including a first portion disposed over a source/drain region in an active region of a substrate and a modulation portion over an interlayer dielectric (ILD) in a resistor region of the substrate, the first portion of the first dielectric layer has a first composition, and the modulation portion of the first dielectric layer has a second composition different from the first composition. The structure further includes a resistor layer disposed on the modulation portion of the first dielectric layer in the resistor region and a second dielectric layer disposed over the first dielectric layer in the active region and over the resistor layer in the resistor region.

Abstract: A transformer-transducer model for unifying streaming and non-streaming speech recognition includes an audio encoder, a label encoder, and a joint network. The audio encoder receives a sequence of acoustic frames, and generates, at each of a plurality of time steps, a higher order feature representation for a corresponding acoustic frame. The label encoder receives a sequence of non-blank symbols output by a final softmax layer, and generates, at each of the plurality of time steps, a dense representation. The joint network receives the higher order feature representation and the dense representation at each of the plurality of time steps, and generates a probability distribution over possible speech recognition hypothesis. The audio encoder of the model further includes a neural network having an initial stack of transformer layers trained with zero look ahead audio context, and a final stack of transformer layers trained with a variable look ahead audio context.

Abstract: A test structure for use in a dynamic random access memory is provided. A first gate structure is disposed in a semiconductor substrate. First and second source/drain regions are disposed in the semiconductor substrate and at two sides of the first gate structure. A bit line structure is disposed on the first source/drain region. A dielectric layer is disposed on the semiconductor substrate and the bit line structure. A first landing pad is disposed on the dielectric layer. A first contact plug is disposed in the dielectric layer and electrically connects the second source/drain region and the first landing pad. A conductive layer is disposed on and electrically connected to the first landing pad, in which a first upper surface of the first landing pad is entirely covered by the conductive layer, and the conductive layer has a substantially planar upper surface.

Abstract: The present invention provides a control method of a flash memory controller, wherein the flash memory controller is configured to access a flash memory module, the flash memory module includes a plurality of planes, and each plane includes a plurality of blocks; and the control method includes the steps of: after the flash memory controller is powered on, reading a first code bank from a specific block of the plurality of blocks; storing the first code bank into a buffer memory; executing the first code bank to manage the flash memory module; when the flash memory controller starts a code bank swapping operation, trying to read a second code bank from a super block; if the second code bank is read successfully, storing the second code bank into the buffer memory to replace the first code bank; and executing the second code bank to manage the flash memory module.