Patents by Inventor Harald Huels
Harald Huels has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11316713Abstract: A computer-implemented method comprises receiving an index number for each of a plurality of physical processing units, each of the plurality of physical processing units communicatively coupled to each of a plurality of switch chips in a leaf-spine topology; assigning at least one of the plurality of physical processing units to a first virtual drawer by updating an entry in a virtual drawer table indicating an association between the respective index number of the at least one physical processing unit and an index of the first virtual drawer; and performing a drawer management function based on the virtual drawer table.Type: GrantFiled: November 25, 2019Date of Patent: April 26, 2022Assignee: International Business Machines CorporationInventors: Burkhard Steinmacher-Burow, Harald Huels
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Publication number: 20210160100Abstract: A computer-implemented method comprises receiving an index number for each of a plurality of physical processing units, each of the plurality of physical processing units communicatively coupled to each of a plurality of switch chips in a leaf-spine topology; assigning at least one of the plurality of physical processing units to a first virtual drawer by updating an entry in a virtual drawer table indicating an association between the respective index number of the at least one physical processing unit and an index of the first virtual drawer; and performing a drawer management function based on the virtual drawer table.Type: ApplicationFiled: November 25, 2019Publication date: May 27, 2021Inventors: Burkhard Steinmacher-Burow, Harald Huels
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Patent number: 10959339Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.Type: GrantFiled: January 15, 2018Date of Patent: March 23, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas-Michael Winkel
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Patent number: 10734317Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: GrantFiled: June 12, 2019Date of Patent: August 4, 2020Assignee: International Business Machines CorporationInventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 10546809Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-silicon vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.Type: GrantFiled: October 3, 2018Date of Patent: January 28, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles E. Cox, Harald Huels, Arvind Kumar, Xiao Hu Liu, Ahmet S. Ozcan, Winfried W. Wilcke
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Publication number: 20190295938Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: ApplicationFiled: June 12, 2019Publication date: September 26, 2019Inventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 10423877Abstract: Three-dimensional (3D) neuromorphic computing systems are provided. A system includes a logic wafer having a plurality of processors. The system further includes a double-sided interposer bonded to the logic wafer and incorporating a signal port ring for sending and receiving signals. The system also includes a plurality of 3D memory modules bonded to the double-sided interposer. The double-sided interposer is a wafer scale or a panel scale providing communication between the plurality of processors and the plurality of 3D memory modules.Type: GrantFiled: August 15, 2016Date of Patent: September 24, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles E. Cox, Harald Huels, Arvind Kumar, Pritish Narayanan, Ahmet S. Ozcan, J. Campbell Scott, Winfried W. Wilcke
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Patent number: 10354946Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: GrantFiled: April 5, 2018Date of Patent: July 16, 2019Assignee: International Business Machines CorporationInventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 10209890Abstract: A computing system includes a host processor, an access processor having a command port, a near memory accelerator, and a memory unit. The system is adapted to run a software program on the host processor and to offload an acceleration task of the software program to the near memory accelerator. The system is further adapted to provide, via the command port, a first communication path for direct communication between the software program and the near memory accelerator, and to provide, via the command port and the access processor, a second communication path for indirect communication between the software program and the near memory accelerator. A related computer implemented method and a related computer program product are also disclosed.Type: GrantFiled: March 28, 2017Date of Patent: February 19, 2019Assignee: International Business Machines CorporationInventors: Angelo Haller, Harald Huels, Jan Van Lunteren, Joerg-Stephan Vogt
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Patent number: 10203878Abstract: A computing system includes a host processor, an access processor having a command port, a near memory accelerator, and a memory unit. The system is adapted to run a software program on the host processor and to offload an acceleration task of the software program to the near memory accelerator. The system is further adapted to provide, via the command port, a first communication path for direct communication between the software program and the near memory accelerator, and to provide, via the command port and the access processor, a second communication path for indirect communication between the software program and the near memory accelerator. A related computer implemented method and a related computer program product are also disclosed.Type: GrantFiled: December 30, 2017Date of Patent: February 12, 2019Assignee: International Business Machines CorporationInventors: Angelo Haller, Harald Huels, Jan Van Lunteren, Joerg-Stephan Vogt
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Publication number: 20190035722Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-silicon vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.Type: ApplicationFiled: October 3, 2018Publication date: January 31, 2019Inventors: Charles E. Cox, Harald Huels, Arvind Kumar, Xiao Hu Liu, Ahmet S. Ozcan, Winfried W. Wilcke
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Patent number: 10147676Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-hole vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.Type: GrantFiled: May 15, 2017Date of Patent: December 4, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles E. Cox, Harald Huels, Arvind Kumar, Xiao Hu Liu, Ahmet S. Ozcan, Winfried W. Wilcke
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Patent number: 10149388Abstract: A method for embedding a discrete electrical device in a printed circuit board (PCB) is provided, which includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to a conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first device contact and the conductive structure in the first layer; and establishing a second electrical connection between a second device contact and a second layer, the second layer being one of the conductive layers of a second horizontal core section.Type: GrantFiled: June 7, 2016Date of Patent: December 4, 2018Assignee: INTERNATIONAL BUSINESS MACHINES, CORPORATIONInventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas Strach, Thomas-Michael Winkel
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Publication number: 20180331028Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-hole vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.Type: ApplicationFiled: May 15, 2017Publication date: November 15, 2018Inventors: Charles E. Cox, Harald Huels, Arvind Kumar, Xiao Hu Liu, Ahmet S. Ozcan, Winfried W. Wilcke
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Publication number: 20180284992Abstract: A computing system includes a host processor, an access processor having a command port, a near memory accelerator, and a memory unit. The system is adapted to run a software program on the host processor and to offload an acceleration task of the software program to the near memory accelerator. The system is further adapted to provide, via the command port, a first communication path for direct communication between the software program and the near memory accelerator, and to provide, via the command port and the access processor, a second communication path for indirect communication between the software program and the near memory accelerator. A related computer implemented method and a related computer program product are also disclosed.Type: ApplicationFiled: March 28, 2017Publication date: October 4, 2018Inventors: Angelo Haller, Harald Huels, Jan Van Lunteren, Joerg-Stephan Vogt
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Publication number: 20180284994Abstract: A computing system includes a host processor, an access processor having a command port, a near memory accelerator, and a memory unit. The system is adapted to run a software program on the host processor and to offload an acceleration task of the software program to the near memory accelerator. The system is further adapted to provide, via the command port, a first communication path for direct communication between the software program and the near memory accelerator, and to provide, via the command port and the access processor, a second communication path for indirect communication between the software program and the near memory accelerator. A related computer implemented method and a related computer program product are also disclosed.Type: ApplicationFiled: December 30, 2017Publication date: October 4, 2018Inventors: Angelo Haller, Harald Huels, Jan Van Lunteren, Joerg-Stephan Vogt
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Publication number: 20180228028Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: ApplicationFiled: April 5, 2018Publication date: August 9, 2018Inventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 10010000Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.Type: GrantFiled: May 19, 2016Date of Patent: June 26, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas-Michael Winkel
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Patent number: 9980385Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: GrantFiled: April 24, 2017Date of Patent: May 22, 2018Assignee: International Business Machines CorporationInventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Publication number: 20180139851Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.Type: ApplicationFiled: January 15, 2018Publication date: May 17, 2018Inventors: Bruce J. CHAMBERLIN, Andreas HUBER, Harald HUELS, Thomas-Michael WINKEL