Abstract: A method of cooling a complex electronic system includes preventing system air from passing through a front side and a rear side of a server system main board, organizing a plurality of electronic segments of the server system main board, providing cool air horizontally to the server system main board through a cool air intake provided at a position located underneath the front side and at a bottom side of the server system main board, using the cool air intake to provide the cool air to a plurality of cooling segments that redirect the cool air vertically at a 90° angle, and using a hot air exhaust after the hot air reaches the top side of the server system main board to redirect the hot air horizontally at a 90° angle and exhaust the hot air.

Abstract: The invention relates to a coupler assembly for electrically coupling at least two boards (200a, 200b, 200c, 200d) comprising interconnected integrated circuits, which coupler assembly provides high-speed constrained electrical interconnection (130) between the coupled boards (200a, 200b, 200c, 200d), for example CPU-busses, SMP-busses and IO-busses. The electrical interconnection (130) provides signal timing alignment and signal integrity for signals exchanged between the coupled boards (200a, 200b, 200c, 200d).

Abstract: The invention relates to an electronic-board arrangement, comprising at least two electronic boards (110, 110a-110n), particularly integrated circuit boards, which are attached to a backplane (10) which provides electrical interconnection between the at least two electronic boards (110, 110a-110n). An electronic interconnect board (40) providing electrical interconnect between the at least two electronic boards (110, 110a-110n) is arranged in a space (90) in between the at least two electronic boards (110, 110a-110n) and the backplane (10).

Abstract: A heat exchange system for blade server systems is disclosed, wherein said blade server system contains a plurality of server blades arranged in a blade center, wherein the heat exchange system comprises first heat sinks associated to each of said plurality of server blades, and whereby the first heat sinks are adapted to collect heat emitted from heat emitting devices on said associated server blade; means for transferring heat from the heat emitting devices to the first heat sinks; and a liquid cooled second heat sink associated to said blade center, whereby said first heat sinks are connected to said second heat sink by thermal coupling.

Abstract: The invention relates to a design method and tool for designing electronic circuits on a printed circuit board (10), wherein at least one self-contained, pre-composed domain is used, wherein the domain (110, 120, 130, 140, 150, 150, 160) is a module chosen from a pre-composed architecture library, comprising self-contained pre-designed electronic modules represented by logical architecture and corresponding physical architecture.

Abstract: A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.

Abstract: A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.