Abstract: Three-dimensional (3D) neuromorphic computing systems are provided. A system includes a logic wafer having a plurality of processors. The system further includes a double-sided interposer bonded to the logic wafer and incorporating a signal port ring for sending and receiving signals. The system also includes a plurality of 3D memory modules bonded to the double-sided interposer. The double-sided interposer is a wafer scale or a panel scale providing communication between the plurality of processors and the plurality of 3D memory modules.

Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.

Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.

Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.

Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.

Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.

Abstract: Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path.

Abstract: Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path. Heating at least one of the solder paste beads by an electrical resistive heating, wherein the electrical resistive heating is generated by an electrical current flowing through the electrical conducting path.

Abstract: An apparatus and process are disclosed that relates to a thermoelectric converter for converting thermal energy into electric energy. The apparatus includes at least one magnetic circuit including magnetic flux; at least one electric coil coupled to the at least one magnetic circuit; a magnetic switch coupled to the at least one magnetic circuit which loads the at least one electric coil with magnetic flux of the at least one magnetic circuit depending on a temperature of the magnetic switch, wherein the magnetic switch has a ferromagnetic state below a critical temperature (Tc) and a paramagnetic state above the critical temperature (Tc).

Abstract: Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path.

Abstract: Generating a physical circuit board design. The physical circuit board is designed based on a design data set containing multiple electronic components. In a first step, the electronic components are classified by assigning them either to a group of so-called Core Components or to a group of Application Specific Components. Subsequently, a circuit board layer structure is generated. The layer structure includes a Core Layer Structure located in the center of this layer structure. The components are placed onto the board's layer structure in such a way that the Core Components are placed onto the Core Layer Structure. Finally, a design macro of the resulting physical design is generated and the circuit board is assembled.

Abstract: The invention relates to a design method and tool for designing electronic circuits on a printed circuit board, wherein at least one self-contained, pre-composed domain is used, wherein the domain is a module chosen from a pre-composed architecture library, including self-contained pre-designed electronic modules represented by logical architecture and corresponding physical architecture.

Abstract: The invention relates to an electronic-board arrangement, comprising at least two electronic boards, particularly integrated circuit boards, which are attached to a backplane which provides electrical interconnection between the at least two electronic boards. An electronic interconnect board providing electrical interconnect between the at least two electronic boards is arranged in a space in between the at least two electronic boards and the backplane.

Abstract: Generating a physical circuit board design. The physical circuit board is designed based on a design data set containing multiple electronic components. In a first step, the electronic components are classified by assigning them either to a group of so-called Core Components or to a group of Application Specific Components. Subsequently, a circuit board layer structure is generated. The layer structure includes a Core Layer Structure located in the center of this layer structure. The components are placed onto the board's layer structure in such a way that the Core Components are placed onto the Core Layer Structure. Finally, a design macro of the resulting physical design is generated and the circuit board is assembled.

Abstract: The invention relates to a design method and tool for designing electronic circuits on a printed circuit board, wherein at least one self-contained, pre-composed domain is used, wherein the domain is a module chosen from a pre-composed architecture library, including self-contained pre-designed electronic modules represented by logical architecture and corresponding physical architecture.

Abstract: The invention relates to a design method and tool for designing electronic circuits on a printed circuit board, wherein at least one self-contained, pre-composed domain is used, wherein the domain is a module chosen from a pre-composed architecture library, including self-contained pre-designed electronic modules represented by logical architecture and corresponding physical architecture.

Abstract: An apparatus and process are disclosed that relates to a thermoelectric converter for converting thermal energy into electric energy. The apparatus includes at least one magnetic circuit including magnetic flux; at least one electric coil coupled to the at least one magnetic circuit; a magnetic switch coupled to the at least one magnetic circuit which loads the at least one electric coil with magnetic flux of the at least one magnetic circuit depending on a temperature of the magnetic switch, wherein the magnetic switch has a ferromagnetic state below a critical temperature (Tc) and a paramagnetic state above the critical temperature (Tc).

Abstract: A heat exchange system for blade server systems is disclosed, wherein said blade server system contains a plurality of server blades arranged in a blade center, wherein the heat exchange system comprises first heat sink associated to each of said plurality of server blades, and whereby the first heat sink are adapted to collect heat emitted from heat emitting devices on said associated server blade; means for transferring heat from the heat emitting devices to the first heat sink; and a liquid cooled second heat sink associated to said blade center, whereby said first heat sink are connected to said second heat sink by thermal coupling.

Abstract: The invention relates to a design method and tool for designing electronic circuits on a printed circuit board (10), wherein at least one self-contained, pre-composed domain is used, wherein the domain (110, 120, 130, 140, 150, 150, 160) is a module chosen from a pre-composed architecture library, comprising self-contained pre-designed electronic modules represented by logical architecture and corresponding physical architecture.

Abstract: The invention relates to a design method and tool for designing electronic circuits on a printed circuit board, wherein at least one self-contained, pre-composed domain is used, wherein the domain is a module chosen from a pre-composed architecture library, including self-contained pre-designed electronic modules represented by logical architecture and corresponding physical architecture.