Abstract: The optical device comprises a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion. The device furthermore comprises non-transparent material applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

Abstract: An optoelectronic module includes a cover substrate including a passive optical element, a base substrate including an optoelectronic device, and a spacer layer joining the cover substrate to the base substrate. The spacer layer includes multiple first spacer elements fixed to a surface of the cover substrate and multiple second spacer elements fixed to a surface of the base substrate, in which each first spacer element is joined to a corresponding second spacer element through an adhesive layer, and in which the cover substrate, base substrate, and spacer layer define an interior region of the module in which the optical element is aligned with the optoelectronic device.

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract: The optical module (1) comprises—a first member (O) having a first face (F1) which is substantially planar;—a second member (P) having a second face (F2) facing the first face (F1), which is substantially planar and is aligned substantially parallel to the first face;—a third member (S) comprised in the first member (O) or comprised in the second member (P) or distinct from and located between these, which comprises an opening (4);—a mirror element (31?; 31??) present on the second face (F2); and—an active optical component (26) present on the second face (F2) and electrically connected to the second member (P); wherein at least one of the first and second members comprises one or more transparent portions (t) through which light can pass. The method for manufacturing the optical module (1) comprises the steps of a) providing a first wafer; b) providing a second wafer on which the mirror elements (31?. . .

Abstract: The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.

Abstract: An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).

Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.

Abstract: The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.

Abstract: A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.

Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

Abstract: The present disclosure describes imaging techniques and devices having improved autofocus capabilities. The imaging techniques can include actively illuminating a scene and determining distances over the entire scene and so that a respective distance to each object or point in the scene can be determined. Thus, distances to all objects in a scene (within a particular range) at any given instant can be stored. A preview of the image can be displayed so as to allow a user to select a region of the scene of interest. In response to the user's selection, the imager's optical assembly can be adjusted automatically, for example, to a position that corresponds to optimal image capture of objects at the particular distance of the selected region of the scene.

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.