Abstract: A position-sensing sensor of a position-sensing system includes first and a second radio transponders that each have a transmitter/receiver connected to an antenna and has a memory for persistent data storage, wherein the first radio transponder has an energy supply source and is selectively switchable into a reduced energy consumption idle state and into an active operating state with complete range of functionality, where during the active operating state, a radio connection to a first radio transponder reader is established for position sensing, where the second radio transponder, which is inductively supplyable with energy by a radio transponder reader, upon entering a range of a second radio transponder reading unit, transfers the first radio transponder from the idle state into the active operating state or transfers position information associated with the second radio transponder to a server of the position-sensing system via the second radio transponder reader.

Abstract: A position-sensing sensor of a position-sensing system includes first and a second radio transponders that each have a transmitter/receiver connected to an antenna and has a memory for persistent data storage, wherein the first radio transponder has an energy supply source and is selectively switchable into a reduced energy consumption idle state and into an active operating state with complete range of functionality, where during the active operating state, a radio connection to a first radio transponder reader is established for position sensing, where the second radio transponder, which is inductively supplyable with energy by a radio transponder reader, upon entering a range of a second radio transponder reading unit, transfers the first radio transponder from the idle state into the active operating state or transfers position information associated with the second radio transponder to a server of the position-sensing system via the second radio transponder reader.

Abstract: A method for configuring a communication module of at least one RFID reader that is connected via the communication module to a communication network, wherein the at least one RFID reader is connected to the communication module via a serial interface, wherein configuration information comprising at least communication network address information and device type information is stored in a configuration storage unit of the communication module, where the configuration information stored in the configuration storage unit of the communication module is conveyed via the serial interface to the at least one RFID reader and stored there in a predetermined configuration storage area, and where the configuration information stored in the predetermined configuration storage area of the RFID reader is loaded during a device start of a replacement communication module used instead of the communication module after a successful validity check for configuration of the replacement communication device.

Abstract: A method for configuring a communication module of at least one RFID reader that is connected via the communication module to a communication network, wherein the at least one RFID reader is connected to the communication module via a serial interface, wherein configuration information comprising at least communication network address information and device type information is stored in a configuration storage unit of the communication module, where the configuration information stored in the configuration storage unit of the communication module is conveyed via the serial interface to the at least one RFID reader and stored there in a predetermined configuration storage area, and where the configuration information stored in the predetermined configuration storage area of the RFID reader is loaded during a device start of a replacement communication module used instead of the communication module after a successful validity check for configuration of the replacement communication device.

Abstract: A processing device, comprising one or more functional units and a hardware-serviced watchdog timer connected to the functional units is described. The functional units are capable of generating service events which are hardware events of said one or more functional units. The functional units are arranged to generate the signals in response to an application executed on the processing device and making use of the functionality thereof. The watchdog timer is arranged to start a new timeout period in response to any one of said signals. The service events may include, for example, a start or an end of a data transfer operation to or from one of the functional units. A method of operating a processing device is described as well.

Abstract: Axially damping hydraulic mount is provided, relating to elastomer mounts for engine mounts for damping the vibrations transmitted from internal combustion engine to the body and for acoustic decoupling. The hydraulic mount includes a frustoconical elastomer support spring, between mount core and upper part of outer jacket, with a working chamber and a compensating chamber for fluid damping medium. Chambers are separated from one another by a separator extending transversely to the mount axis and includes a coupling diaphragm, wherein the working chamber is enclosed by support spring and separating element. Compensating chamber is enclosed by separating element and elastomer bellows. A duct on the separating element is enclosed by a duct part. To counteract excessive increase in dynamic spring rate when frequencies of axially acting vibrations are present, the duct part is occupied by an additional mass. Then the duct part is rigidly connected to a mass element.

Abstract: Axially damping hydraulic mount is provided, relating to elastomer mounts for engine mounts for damping the vibrations transmitted from internal combustion engine to the body and for acoustic decoupling. The hydraulic mount includes a frustoconical elastomer support spring, between mount core and upper part of outer jacket, with a working chamber and a compensating chamber for fluid damping medium. Chambers are separated from one another by a separator extending transversely to the mount axis and includes a coupling diaphragm, wherein the working chamber is enclosed by support spring and separating element. Compensating chamber is enclosed by separating element and elastomer bellows. A duct on the separating element is enclosed by a duct part. To counteract excessive increase in dynamic spring rate when frequencies of axially acting vibrations are present, the duct part is occupied by an additional mass. Then the duct part is rigidly connected to a mass element.

Abstract: A hydraulic engine bearing for motor vehicles has a fluid-filled working chamber (4) surrounded by a rubber-elastic circumferential wall (3). A compensating chamber (7) is provided which is in connection with the working chamber (4) via an overflow duct (6) in a baffle plate (5) between the working chamber (4) and the compensating chamber (7). Another compensating chamber (10) is connected to the working chamber (4) via a bypass duct (9). The additional compensating chamber (10) is formed from an elastic bellows (11), which is surrounded on its outside by a fixed wall (12) and wherein an intermediate space (13) is arranged between the bellows (11) and the wall (12). The intermediate space can be filled with a compressible medium, preferably air, and the medium can be emptied by means of a switching device, wherein the switching device is formed from at least one non-return valve (14) and at least one on-off valve (15).

Abstract: For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.

Abstract: A hydraulic engine bearing for motor vehicles has a fluid-filled working chamber (4) surrounded by a rubber-elastic circumferential wall (3). A compensating chamber (7) is provided which is in connection with the working chamber (4) via an overflow duct (6) in a baffle plate (7) between the working chamber (4) and the compensating chamber (7). Another compensating chamber (10) is connected to the working chamber (4) via a bypass duct (9). The additional compensating chamber (10) is formed from an elastic bellows (11), which is surrounded on its outside by a fixed wall (12) and wherein an intermediate space (13) is arranged between the bellows (11) and the wall (12). The intermediate space can be filled with a compressible medium, preferably air, and the medium can be emptied by means of a switching device, wherein the switching device is formed from at least one non-return valve (14) and at least one on-off valve (15).

Abstract: A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.

Abstract: A process for applying a metal layer to surfaces of light metals is proposed, in which iron is electrolytically deposited on the surfaces from a deposition bath containing Fe(II) compounds using dimensionally stable anodes insoluble in the deposition bath. The process is especially suitable for coating cylinder faces of internal combustion engines and of rotationally symmetrical parts with layers having very high wear resistance, especially of valves, nozzles and other parts of high-pressure injection systems for motor vehicle engines. In addition, the present invention pertains to nanocrystalline iron-phosphorus layers, which can be formed preferably by depositing iron in the presence of compounds containing orthophosphite and/or hypophosphite. These layers also have good corrosion resistance besides the good wear resistance.

Abstract: An object tracking system includes a plurality of tags. Each tag includes a mechanism for transmitting a triangulation signal and a position signal that is indicative of a change of position of the respective tag in a time period since a respective reset event. A plurality of triangulation stations receive the triangulation signals from the tags. At least one antenna receives the position signals from the tags. A computer is coupled to the triangulation stations and to the antenna. The computer is programmed to switch between (a) a first tag location algorithm to determine a current location of one of the tags using a differential time of arrival procedure based on the triangulation signal, and (b) a second tag location algorithm to determine a current location of the tag based on the position signal transmitted by the tag and a previous known location of the tag.

Abstract: An object tracking system includes a plurality of tags. Each tag includes a mechanism for transmitting a triangulation signal and a position signal that is indicative of a change of position of the respective tag in a time period since a respective reset event. A plurality of triangulation stations receive the triangulation signals from the tags. At least one antenna receives the position signals from the tags. A computer is coupled to the triangulation stations and to the antenna. The computer is programmed to switch between (a) a first tag location algorithm to determine a current location of one of the tags using a differential time of arrival procedure based on the triangulation signal, and (b) a second tag location algorithm to determine a current location of the tag based on the position signal transmitted by the tag and a previous known location of the tag.

Abstract: The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 ?m, a depth in the range of 25 to 1,000 ?m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 ?m, and the base plate 5 has a thickness in the range of 200 to 2,000 ?m.

Abstract: A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing integrated circuits. The method includes the steps of coating the surfaces of the semiconductor substrates with a full-surface basic metal layer in order to achieve sufficient conductance for the electrolytic depositions, depositing full-surface deposition of copper layers of uniform layer thickness on the basic metal layer by an electrolytic metal deposition method, and structuring the copper layer.

Abstract: Micro-components having at least one individual layer are produced according to the method, which have functional layers 3 on the walls of inner structures, for example of flow channels. The micro-components are intended to be suitable for a large number of different applications in chemical reaction technology, for heat exchanging, for mixing substances or for evaporating liquids. In particular, the micro-components are intended to have no problems in respect of leaks in the flow channels. The method has the following method steps: A. producing the at least one individual layer by: a. producing a first metal layer or a metal foil 1; b. forming the inner structures in and/or on the first metal layer or metal foil 1 by suitable etching methods and/or metal deposition methods; and c. forming the functional layers 3 solely on the walls of the inner structures and thereafter B.

Abstract: Known manufacturing methods for microstructure components, in particular for microreactors, micro-heat exchangers, and micromixers, are not reliable enough to ensure that the component's pressure and corrosion resistance is high enough, that the component's tightness against fluid exiting from the component or fluid spilling over into adjacent microchannels is high enough, and that the microchannels have a sufficiently low flow resistance. In addition, known manufacturing methods are not cost-effective enough that the microstructured components can be employed in a wide variety of applications.

Abstract: A process to pretreat copper surfaces for tight bonding to organic substrates as those found in multilayer printed circuit boards includes first treating the copper with a solution containing hydrogen peroxide, and at least one acid, and at least one nitrogen-containing five-member heterocyclic compound which does not contain sulfur, selenium or tellurium atoms in the heterocycle. Thereafter the copper surfaces are brought into contact with a second solution containing at least one adhesion-promoting compound from the group consisting of sufinic acid, selinic acid, telluric acid, and heterocyclic compounds that contain at least one sulfur, and/or selenium and/or tellurium atom in the heterocycie and also sulfonium, selenonium and telluronium salts.

Abstract: A method of reproducibly manufacturing circuit carriers with very fine circuit structures and an electrophoretic varnish to be applied in this method are described in which a dielectric substrate comprising a base metal surface is provide, a varnish layer is applied onto the substrate surface electrodepositing the electrophoretic varnish, thereafter the varnish layer is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed by means of ultraviolet radiation, the base metal surface being laid bare, and finally the bare base metal surface is etched.