Abstract: The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 &mgr;m, a depth in the range of 25 to 1,000 &mgr;m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 &mgr;m, and the base plate 5 has a thickness in the range of 200 to 2,000 &mgr;m.

Abstract: For manufacturing substrate materials which are needed for the manufacture of electrical circuit carriers, methods are known in which metal layers are applied to a dielectric substrate by means of a glow discharge process and thereafter additional metal layers are applied by means of electroplating processes. These methods however are not suitable for the manufacture of substrate materials which are suitable for high frequency applications in the gigahertz range. The invention starts from the previously-mentioned methods and solves the described problem through the use of fluoropolymers and through coating of these materials by means of a glow discharge process with nickel, since by this means even very smooth surfaces of the substrate can be securely coated. The metallised materials can be coated with additional metal layers from electroless or electrolytic deposition baths.

Abstract: A method of reproducibly manufacturing circuit carriers with very fine circuit structures, more specifically with structure widths of 50 &mgr;m and less, is described in which a substrate provided with a base metal surface is provided, a layer of varnish is applied onto the substrate by an electrophoretic method, the layer of varnish is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed, the base metal surface being laid bare, the bare base metal surface is etched, the layer of varnish being ablated by means of ultraviolet irradiation, more specifically with an ultraviolet laser beam.

Abstract: A process for applying a metal layer to surfaces of light metals is proposed, in which iron is electrolytically deposited on the surfaces from a deposition bath containing Fe(II) compounds using dimensionally stable anodes insoluble in the deposition bath. The process is especially suitable for coating cylinder faces of internal combustion engines and of rotationally symmetrical parts with layers having very high wear resistance, especially of valves, nozzles and other parts of high-pressure injection systems for motor vehicle engines. In addition, the present invention pertains to nanocrystalline iron-phosphorus layers, which can be formed preferably by depositing iron in the presence of compounds containing orthophosphite and/or hypophosphite. These layers also have good corrosion resistance besides the good wear resistance.

Abstract: The invention concerns processes and solutions for the preliminary treatment of copper surfaces which are subsequently to be firmly bonded to organic substrates. The solution is used, in particular, for firmly bonding laminated multilayered printed circuit boards and for firmly bonding resists to the copper surfaces of printed circuit boards.

Abstract: Method of forming a metal pattern on a dielectric substrate A method of reproducibly manufacturing circuit carriers with very fine circuit structures, more specifically with structure widths of 50 &mgr;m and less, is described in which a substrate provided with a base metal surface is provided, a layer of varnish is applied onto the substrate by an electrophoretic method, the layer of varnish is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed, the base metal surface being laid bare, the bare base metal surface is etched, the layer of varnish being ablated by means of ultraviolet irradiation, more specifically with an ultraviolet laser beam.

Abstract: The invention relates to photosensitive compositions, which can be developed positively. Traditional compositions have either inadequate photosensitivity or they are not appropriate for use on the copper surfaces, for example of circuit boards, since the exposed coating sections of the composition cannot be completely removed during developing, which results in problems in subsequent plating or etching. In the photosensitive compositions according to the invention, these disadvantages cannot be observed. Various compositions are described, which contain photo acid generators and a polymer resin with side groups, which can split acid, said polymer resin being formed by polymerizing at least three different acrylate- or methacrylate-monomers.

Abstract: Chemical microreators for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided by means of the microreators and manufacturing methods according to the invention. The microreators are characterized in that the reactors contain fluid ducts in at least one plane as well as feed and return lines for fluids, wherein the fluid ducts are defined by side walls of metal opposing each other and further side walls of metal or plastic extending between said side walls, and in which the planes are connected together and/or with a closure segment closing open fluid ducts by means of appropriate solder or adhesive layers. The manufacturing method is characterized by process sequences in which the individual reactor planes produced by means of electrolytic methods, are connected together by soldering or gluing.

Abstract: Chemical microreactors for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided by means of the microreactors and manufacturing methods according to the invention. The microreactors are characterized in that the reactors contain fluid ducts in at least one plane as well as feed and return lines for fluids, wherein the fluid ducts are defined by side walls of metal opposing each other and further side walls of metal or plastic extending between said side walls, and in which the planes are connected together and/or with a closure segment closing open fluid ducts by means of appropriate solder or adhesive layers. The manufacturing method is characterized by process sequences in which the individual reactor planes produced by means of electrolytic methods, are connected together by soldering or gluing.

Abstract: A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.

Abstract: A hydraulically-damping engine bearing includes a restrictedly deflectable diaphragm separating first and second fluid-filled primary chambers that are bordered at least partially by elastic walls. At least one channel is connected between the first and second primary chambers. An arrangement is connected for adjusting a characteristic of the bearing. The arrangement includes an auxiliary suspension spring that, with the wall of one of the chambers, forms an auxiliary chamber, whereby one of the primary chambers is connectable to the auxiliary chamber via a controllable flow connection.

Abstract: A hydraulic damping rubber support with at least one chamber filled with damping fluid, includes fixing elements for fixing the rubber support to a vehicle, and at least one flexible diaphragm which interacts with at least one perforated plate and is used to decouple vibrations. The diaphragm further includes an uneven portion disposed over at least part of its surface.

Abstract: The invention relates to a palladium colloid solution, which, in addition to a palladium compound, a protective colloid for stabilizing the colloid and a reducing agent, additionally contains noble metals from the group rhodium, iridium and platinum. The solution can be used to treat electrically non-conductive substrate surfaces, particularly in order to metallize the substrate surfaces directly and electrolytically. By means of this method, the nonconductive areas of the holes in printed circuit boards can be directly electrolytically metallized.

Abstract: The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying substrate parts (2), mechanical substrate parts (7), as well as the arrangement of components (4) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (19, 2), components (4) and mechanical stiffening elements (7) has the following structure.

Abstract: A hydraulically damping engine bearing includes fluid-filled chambers defined at least partially by an elastic wall. A dividing wall with a diaphragm divides the chambers. The diaphragm is deflectable in a limited manner and defines an intermediate space with the dividing wall. At least one channel is arranged through the dividing wall for connecting the chambers. A bearing characteristic is adjustable by changing the rigidity of the diaphragm such that the diaphragm works against a gas volume enclosed in the intermediate space when the diaphragm as a low rigidity and the diaphragm rests at least partially at a stop on the dividing wall when the diaphragm as a high rigidity. A switch is arranged for opening a flow connection to the atmosphere or a pressure accumulator for aerating the intermediate space.

Abstract: There are known for use in the electronics industry polyimide substrates with copper coatings, which are produced by decomposition of organometallic compounds by means of a glow discharge process and subsequent electroless metallization of the resulting metal film. From deposition of the first metal coating there results, without addition of oxygen, carbon-containing layers which have a low conductivity and low catalytic activity. If only alkaline metallizing baths are used, initially securely adhering metal coatings are in fact deposited on the polyimide surfaces, the secure adhesion of the metal coatings on the polyimide however is considerably impaired upon contact of the metal with aqueous-alkaline solutions. If operation is in an oxygen atmosphere, palladium layers result which must be subsequently reduced. Such layers provide no or very small adhesion, when they are exposed to chemical or electrochemical process solutions.

Abstract: The treatment, for example the cleaning of holes or recesses in workpieces, is problematic when the holes or recesses have an opening width of below 0.5 mm, and especially when the latter do not penetrate the workpiece (blind bores). In known methods, gas bubbles adhering to the side-walls of holes of this type cannot be removed or liquids situated within the holes cannot be effectively exchanged. With the method according to the invention an effective exchange of the liquid contained in the holes and situated outwith the holes is made possible. For this purpose the liquid treatment means is sprayed as a jet into the holes, said jet having a diameter which is smaller than that of the holes. Furthermore, a device is described for carrying out this method which is characterised by a nozzle with one or several nozzle discharge openings with a diameter below 0.

Abstract: A solution for the pretreatment of electrically non-conductive surfaces and a method for coating surfaces with solid matter particles, for example carbon black, graphite, silicon dioxide, aluminum oxides, transition metal chalcogenides and titanium dioxide. Furthermore, the invention relates to a production method for the solution also. The solution contains a solvent, polyelectrolytic compound as a coagulation trigger, and a charged surfactant which has opposite polarity relative to the polyelectrolytic compound. After pretreatment of surfaces with the solution, the surfaces are then brought into contact with a dispersion containing the solid matter particles.

Abstract: A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.

Abstract: A hydraulically damping engine bearing having fluid-filled chambers bordered at least partially by elastic walls, a limitedly deflectable diaphragm separating the chambers, and at least one channel connecting the chambers. A bearing spring rate characteristic is adjustable by an arrangement that includes an additional suspension spring arranged outside of one of the chambers. An intermediate space is bordered by the suspension spring together with an outer wall of one of the chambers. A valve, in communication with the intermediate space, enables the space to be aerated and de-aerated.