Patents by Inventor Heinz Peter

Heinz Peter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961764
    Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: April 16, 2024
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
  • Publication number: 20230418795
    Abstract: Embodiments of the present invention provide computer-implemented methods, computer program products, and computer systems. Specifically, embodiments of the present invention can dynamically adjust individual message retention times in a messaging system is disclosed. Embodiments of the present invention can then receive a plurality of messages, store the plurality of messages in a storage system, determine continuously, by the messaging system, interactions with messages stored by the messaging system, and determine dynamically, by the messaging system, a retention score value for selected messages based on a sum of weighted interactions type count values of the determined interactions. Finally, embodiments of the present invention can delete by the messaging system, messages for which the retention score value is below a predetermined retention threshold value.
    Type: Application
    Filed: June 27, 2022
    Publication date: December 28, 2023
    Inventors: Klaus Rindtorff, Subhi al Hasan, Tareq Al-Maamari, Heinz Peter Hippenstiel
  • Patent number: 11801725
    Abstract: A control device for an oscillating axle suspension, in particular a front axle suspension, includes at least of one hydraulic accumulator device (10), a suspension device (12) and a proportional valve (14) having a valve piston (26). The proportional valve (14) is connected to the accumulator and suspension devices (10, 12) via fluid ports (16, 18, 20, 22). The valve piston (26) is actuatable by an electric motor (28), is longitudinally guided in a valve housing (24) of the proportional valve (14) and controls the fluid ports (16, 18, 20, 22) such that, in at least one functional position of the valve piston (26), the axle oscillation is provided while the suspension is blocked and, in at least one further second functional position of the valve piston (26), the suspension is provided while the axle oscillation is blocked.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: October 31, 2023
    Assignee: HYDAC MOBILHYDRAULIK GMBH
    Inventors: Heinz-Peter Huth, Johannes Merscher
  • Publication number: 20230328158
    Abstract: An apparatus for connecting a field device to a communication system includes a field device interface for connecting the apparatus to the field device, a communication interface for connecting the apparatus to the communication system, a protocol conversion unit, and a switching unit. The switching unit is configured to recognize a protocol used by the field device and to establish a connection between the field device and the communication interface via the protocol conversion unit depending on the recognized protocol. Further, a method of connecting a field device to a communication system includes recognizing a protocol used by the connected field device, performing a protocol conversion depending on the recognized protocol, and establishing a connection between the connected field device and the communication system.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 12, 2023
    Inventor: Heinz-Peter Praske
  • Patent number: 11658864
    Abstract: A method, computer program product, and computer system for retaining messages. Bins for having messages stored for different retention periods are provided. Each message is of a message type. Messages are received and each received message is assigned to a bin. For each message determined to have an age exceeding a retention period of the message's assigned bin, the message is reassigned to a bin having a next higher retention period.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: May 23, 2023
    Assignee: International Business Machines Corporation
    Inventors: Heinz Peter Hippenstiel, Klaus Rindtorff, Andreas Arning, Raiko Nitzsche, Tareq Al-Maamari
  • Publication number: 20230153147
    Abstract: Provided is an ad-hoc proxy for a batch processing task within a cloud environment. The proxy may reduce overhead that results from authentication between a jobs of the processing task and a third-party service. An example operation may include one or more of dividing a processing task for a target service into a plurality of jobs that each access data from the target service, establishing an authenticated communication channel between one or more proxies on a host platform and the target service, executing, via the one or more proxies, the plurality of jobs in parallel and accessing data from the target service via the authenticated communication channel established between the one or more proxies and the target service, and returning results of the execution to the plurality of jobs.
    Type: Application
    Filed: November 15, 2021
    Publication date: May 18, 2023
    Inventors: Tareq Al-Maamari, Klaus Rindtorff, Andreas Arning, Heinz Peter Hippenstiel, Raiko Nitzsche
  • Publication number: 20230143249
    Abstract: A furnace heating device is provided for the heating a furnace chamber, comprising: at least one radiant tube, configured to heat the furnace chamber and which can be heated using a burner, which can be operated in a first operating mode with a flame and in a second operating mode with flameless combustion, a burner control device, configured to control on and off states and operating mode setting for the burner of the radiant tube, wherein said burner control device is configured to determine when a temperature (T) of the furnace chamber lies above a critical temperature (Tk), which must at least be present in a combustion chamber for safe operation of flameless combustion, wherein there is a single safety monitor for monitoring the temperature within said furnace chamber and communicating said temperature to said burner control device and wherein said burner control device is configured to send a signal to not send a signal to start said flameless combustion when it is determined that said temperature (T) o
    Type: Application
    Filed: November 8, 2021
    Publication date: May 11, 2023
    Inventors: Heinz-Peter Gitzinger, Thomas Huning, Martin Knostmann
  • Publication number: 20230134327
    Abstract: A method, computer program product, and computer system for retaining messages. Bins for having messages stored for different retention periods are provided. Each message is of a message type. Messages are received and each received message is assigned to a bin. For each message determined to have an age exceeding a retention period of the message's assigned bin, the message is reassigned to a bin having a next higher retention period.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 4, 2023
    Inventors: Heinz Peter Hippenstiel, Klaus Rindtorff, Andreas Arning, Raiko Nitzsche, Tareq Al-Maamari
  • Publication number: 20230089947
    Abstract: An control device for an oscillating axle suspension, in particular a front axle suspension, consisting at least of one hydraulic accumulator device (10), a suspension device (12) and a proportional valve (14) having a valve piston (26), wherein to said proportional valve (14) the two devices (10, 12) are connected via fluid ports (16, 18, 20, 22), is characterized in that the valve piston (26), actuatable by an electric motor (28), is longitudinally guided in a valve housing (24) of the proportional valve (14) and controls the fluid ports (16, 18, 20, 22) such that, in at least one functional position (1) of the valve piston (26), the axle oscillation is provided while the suspension is blocked and, in at least one further second functional position (2) of the valve piston (26), the suspension is provided while the axle oscillation is blocked.
    Type: Application
    Filed: February 23, 2021
    Publication date: March 23, 2023
    Inventors: Heinz-Peter HUTH, Johannes MERSCHER
  • Publication number: 20220093417
    Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.
    Type: Application
    Filed: December 6, 2021
    Publication date: March 24, 2022
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
  • Patent number: 11222793
    Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: January 11, 2022
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
  • Publication number: 20220001713
    Abstract: A mobile working machine, in particular an agricultural device such as a self-propelled sprayer, comprising a structure which is hydraulically supported with respect to an undercarriage by means of cylinders (2, 4) having a piston chamber (6) and a rod chamber (8), wherein a switching device (18, 22, 36, 38) is provided which, in a switching position, fluidically connects the piston chamber (6) of a cylinder (2, 4) to the rod chamber (8) of another cylinder (2, 4), and vice versa, characterised in that, as part of the switching device, first valves (18, 22) and second valves (36, 38) are connected on the fluid-conveying connection (12, 14) between the piston chamber (6) of the one cylinder (2, 4) and the rod chamber (8) of the other cylinder (2, 4), the first valves (18, 22) each being connected on the input side to the piston chamber (6) and to a first hydraulic accumulator (28, 30) and the second valves (36, 38) being connected on the input side to the rod chamber (8) and on the output side to a second hydr
    Type: Application
    Filed: January 12, 2018
    Publication date: January 6, 2022
    Inventors: Heinz-Peter HUTH, Marc ANTON
  • Patent number: 11168710
    Abstract: A control apparatus for supplying at least one hydraulic consumer with fluid has a variable displacement pump (10) controlled by a load-sensing pressure (LS). For a case-by-case increase in the volume flow in the supply of fluid (22) to the hydraulic consumer, the load-sensing pressure (LS) is passed via a control line (28) to a control circuit (2) that ensures the increase in the supply (22) by connecting in a constant-displacement pump (16) as soon as an operator calls for the relevant function by operating the control circuit (2).
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 9, 2021
    Assignee: HYDAC SYSTEMS & SERVICES GMBH
    Inventors: Heinz-Peter Huth, Marc Anton
  • Patent number: 11084757
    Abstract: The present invention relates to an asphalt composition comprising asphalt or an asphalt mixture and to a silicon carbide-containing binder that can be heated by means of microwaves. The silicon carbide is present in the binder in particle form, the equivalent diameter of silicon carbide particles contained in the binder is less than 60 ?m. The invention also relates to a method for producing and/or renovating road surfaces or asphalt surfaces comprising at least one asphalt surface layer.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: August 10, 2021
    Inventor: Harald Heinz Peter Benoit
  • Publication number: 20210233815
    Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.
    Type: Application
    Filed: April 15, 2021
    Publication date: July 29, 2021
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
  • Publication number: 20210188469
    Abstract: Apparatus and method for filling bulk materials into open-mouth bags, including the following steps: a) an open-mouth bag is appended from beneath to a filling spout of a filling station by way of an at least partially upwardly motion, so that the bottom end of the open-mouth bag is freely suspended; b) the filling process is started and bulk material is introduced into the open-mouth bag so that the freely suspended bottom end of the open-mouth bag unfolds; and c) the filling spout is lowered, so that the unfolded bottom end of the open-mouth bag is supported.
    Type: Application
    Filed: May 2, 2019
    Publication date: June 24, 2021
    Inventors: Christian ROLF, Dominik BLESS, Heinz-Peter FELLING, Christian HINSE
  • Patent number: 11011423
    Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: May 18, 2021
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
  • Publication number: 20210131662
    Abstract: A recuperative gas burner for industrial applications can include a combustion chamber and a burner tip providing an outlet opening of the combustion chamber. The gas burner includes a gas supply for combustion gas having a first gas supply duct and a second gas supply duct. The combustion gas can be provided to the combustion chamber through the first gas supply duct. The combustion gas can also be provided to the burner tip through the second gas supply duct. The gas burner can include an air supply for combustion air and an exhaust gas flow channel for exhaust gas, wherein the exhaust gas flow channel and the air supply are configured such that combustion air can be heated by the exhaust gas.
    Type: Application
    Filed: October 30, 2019
    Publication date: May 6, 2021
    Inventors: Sabine von Gersum, Heinz-Peter Gitzinger, Sandra Runde, Lars Schröder
  • Patent number: 10975582
    Abstract: A decoupling sheet (1) having a carrier plate (2) and a plurality of nubs (4) protruding from the carrier plate plane (3), wherein adjacent nubs (4) are arranged transversely to the lengthwise direction (5) and in the lengthwise direction (5) of the carrier plate (2). It is provided according to the invention that immediately adjacent nubs (4) transversely to the lengthwise direction (5) and in the lengthwise direction (5) of the carrier plate (2) have a nub base (10) of triaxial shape, especially with at least three leg sides (6b).
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: April 13, 2021
    Assignee: EWALD DÖRKEN AG
    Inventors: Uwe Kaiser, Birgit Strieder, Heinz Peter Raidt, Ulrich Goerke, Thomas Bachon
  • Publication number: 20200370307
    Abstract: A decoupling sheet (1) having a carrier plate (2) and a plurality of nubs (4) protruding from the carrier plate plane (3), wherein adjacent nubs (4) are arranged transversely to the lengthwise direction (5) and in the lengthwise direction (5) of the carrier plate (2). It is provided according to the invention that immediately adjacent nubs (4) transversely to the lengthwise direction (5) and in the lengthwise direction (5) of the carrier plate (2) have a nub base (10) of triaxial shape, especially with at least three leg sides (6b).
    Type: Application
    Filed: April 17, 2018
    Publication date: November 26, 2020
    Inventors: Uwe KAISER, Birgit STRIEDER, Heinz Peter RAIDT, Ulrich GOERKE, Thomas BACHON