Abstract: A press device for the energy-efficient curing of a sandwich component for an aircraft, includes an open and mechanically adequately loadable core structure with cover layers applied to one side or to both sides. The sandwich component is restrained between a pressure piston, an abutment and sidewalls of the press device, thus forming an essentially closed interior space. At least one of at least one cover layer and the core structure includes a curable duroplastic plastic material. A conveying device feeds heated air through the core structure of the sandwich component in a closed heated-air circuit or preferably in an open heated-air circuit in order to ensure energy-efficient curing of the sandwich component from the inside out. The heated air is temperature-controlled by a heater. In the case of an open heated-air circuit, heat recovery by a heat exchanger is provided.

Abstract: The invention relates to a method and a device for producing and packing individual strip-type objects, especially strips of chewing gum, comprising the following method steps and features: provision of rectangular sheets from which the strips are to be formed, the length of the shorter sides of the sheets corresponding to the length of a strip to be formed; formation of individual strips from the sheets provided; packing of the formed individual strips using a first packaging material; formation of a group of the individual packed strips; and packing of the formed group of strips using a second packaging material.

Abstract: The present invention relates to a polymerizate in the form of an aqueous polymer dispersion, the polymerizate being obtainable by radical polymerization of monomers in an aqueous medium in the presence of a free radical initiator and a protective colloid, wherein the monomers comprise a) 50-99.99 wt. % of at least one vinyl monomer chosen from the group of vinyl esters, (meth)acrylic esters, vinyl aromatic compounds, vinyl halides, and olefins, and b) 0.01-30 wt. % of at least one macromonomer M, the macromonomer M being a reaction product of components (i), (ii), and (iii), said —component (i) having at least one olefinically unsaturated group and at least one hydroxyl, amine and/or thiol group, —component (ii) being a di- or triisocyanate, and —component (iii) having at least two terminal groups selected from hydroxyl, amine and/or thiol groups, c) 0-20 wt % of at least one vinyl monomer with at least one functional group, wherein the monomers a), b), and c) sum up to 100 wt. % of total monomers employed.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: The invention relates to a packing method, according to which a packaging is produced, wherein a plurality of stacks (20) or layers of individual packed strip-type objects (12) are packed as a group (10) in a second packaging material (52). One of the front surfaces (16) of the individual strips (12) is stuck to the bottom (54) of the formed packaging (50). The strip packaging material and the adhesive are produced such that respectively one strip (12) can be removed from the external packaging (50). The remaining strips (12) remain arranged in the original position thereof in the packaging (50) without sliding and falling into each other, when individual strips (12) have already been removed from the packaging (50). A package band or a half-wrapper for holding and fixing the strips (12) inside the packaging (50) is rendered superfluous. The strips (12) are preferably respectively packed in a piece of packaging material that has a perforation (32) for separation into a first part and a second part.

Abstract: A fastening device is provided that includes a semiconductor body with an integrated circuit, and a dielectric passivation layer formed on the surface of the semiconductor body, and a trace formed underneath the passivation layer, and an oxide layer formed beneath the trace, and a connecting component that forms a frictional connection between a component formed above the passivation layer and the semiconductor body, wherein a formation passing through the passivation layer and the oxide layer and having a bottom surface is formed, and a conductive layer is formed on the bottom surface and the connecting component forms an electrical connection between the conductive layer and the component.

Abstract: The invention relates to a method for the production of sandwich components with an open core structure and a cover layer applied to each side, wherein the cover layers are formed with a curable plastic material, and the sandwich component is cured in a closed device under pressure. A charging gas, which may be nitrogen or air, is introduced to the core structure prior to at least partial solidification of the cover layers, wherein a charging gas pressure p Charging gas is selected that is less than or equal to an operating pressure p operating of the closed device in order to, in particular, at least largely prevent the formation of sink marks in the cover layers. Furthermore, the invention relates to a press for implementing the method.

Abstract: A heating system according to the invention comprises a heating layer that is integrated into a prepreg layer of a high-resistance prepreg material. The heating layer may comprise a bonded heating fabric, a metal oxide coating or electrically conductive threads. According to the invention, the heating system is integrated into a component to be heated. This component may consist, for example, of a floor panel for an aircraft.

Abstract: A humidity sensor has, on a substrate, at least one voltage sensor with a sensor region and at least one control electrode. The control electrode is connected to a signal source which is designed such that a variable control voltage can be applied to the control electrode. A moisture-permeable sensor layer whose dielectric constant depends on humidity is located on the sensor region. The control electrode is adjacent to the sensor layer in such a manner that the measured voltage signal of the voltage sensor depends on the control voltage and the humidity. The voltage sensor is connected to an analysis unit for ascertaining the humidity on the basis of the measured voltage signal. In the vertical projection onto the plane in which the substrate extends, the control electrode is located laterally next to the sensor region.

Abstract: A semiconductor gas sensor is provided that includes a semiconductor body with a passivation layer formed on a surface of thereof. A gas-sensitive control electrode is separated from a channel region by a gap or a control electrode is arranged as a first plate of a capacitor with a gap and a second plate of the capacitor is connected to a gate of the field effect transistor implemented as a Capacitively Controlled Field Effect Transistor. The control electrode has is connected to a reference voltage. A support area is provided with a first support structure and a second support structure. A contact area is provided on the surface of the semiconductor body. A first contact region has a frictional connection and an electrical connection with the control electrode and the second contact region has at least a frictional connection with the control electrode.

Abstract: A facing arrangement for a hold of an aircraft or spacecraft. The facing arrangement comprises a first and a second panel which form a gap between them; a first mounting part which is to be attached to a primary structure of the hold and which has at least one locking arrangement, and a second mounting part which has at least one counter locking arrangement. The locking arrangement and/or the counter locking arrangement passing, at least in portions, through the gap between the first and the second panel. The locking arrangement and the counter locking arrangement being locked together in order to connect the first mounting part to the second mounting part for holding the first and second panels between the first mounting part and the second mounting part.

Abstract: The present invention features polypeptides, such as antibodies, and their use in the treatment and diagnosis of neoplasms.

Abstract: The invention relates to a tray loading packaging machine that carries out a method for filling a multi-row packaging tray (Tray T) with piece-form products (P) at a high performance level, having the following steps: dividing up (100) a single-row stream (S1) of piece-form products (P) onto a plurality of lanes (SM; SM1, SM2, SM3) arranged substantially parallel to one another in order to convey the products (P) further; synchronizing (200) the individual streams of products (P) on the plurality or lanes (SM; SM1, SM2, SM3) with one another such that in each case one product (P) from one lane (SM1, SM2, SM3) can be transferred to the packaging tray (T) substantially at the same time as in each case one product (P) from the other lanes (SM1, SM2, SM3); and transferring (300) the produces (P) to the packaging tray (T), wherein in each case one product (P) from one lane (SM1, SM2, SM3) is transferred to one row of the packaging tray (T).

Abstract: The invention relates to a device for determining biological, chemical and/or physical parameters in living biological tissue, comprising an energy supply unit, a laser operating unit with at least one laser source directed at the biological tissue, at least one sensor unit for detecting the light scattered back and/or absorbed by the biological tissue, a control unit, a storing and processing unit and an interface for an external data processing unit.

Abstract: The invention relates to a process for preparing the corticosteroid ciclesonide, used for the treatment of respiratory complaints, in epimerically pure form of formula 1:

Abstract: The invention provides polypeptide, nucleic acid and other compositions. Polypeptide, nucleic acid and other compositions are useful in treatment and diagnostic methods. One treatment method includes inhibiting growth or proliferation of hyperproliferative cells or inducing regression of hyperproliferative cells, such as cells of a cellular hyperproliferative disorder, or reducing levels of LDL or oxLDL.

Abstract: In a foundation assembly, a moisture barrier is placed on a footing and a foundation wall is on the moisture barrier. The moisture barrier thus isolates the foundation wall from the footing. The footing defines a keyway. The moisture barrier comprises a waterproof layer, a bottom layer attached to bottom side of the waterproof layer, and a top layer attached to the top side of the waterproof layer. The waterproof layer blocks passage of water therethrough. The bottom layer is for attaching the moisture barrier to the footing, and comprises a material that attracts water and binds to cement. The moisture barrier comprises a keyway portion sufficiently flexible and configured to fit the keyway in the footing. When the keyway portion fits to the keyway on the footing, it defines a secondary keyway for receiving a key portion of the foundation wall.

Abstract: Purified polypeptide is proposed, the amino acid sequence of which is essentially identical to the amino acid sequence of SEQ ID NO:1 and SEQ ID NO:3, the polypeptide binding low density lipoproteins (LDL) and/or oxidized LDL (oxLDL), in particular LDL cholesterol and/or oxidized LDL cholesterol (oxLDL cholesterol). The invention includes the use of the polypeptide in combination with conventional adjuvants and/or carrier substances for producing a drug having a fat-reducing effect and for producing drugs for treating renal diseases.

Abstract: The invention relates to a process for preparing an optionally substituted 4-benzimidazol-2-ylmethylamino)-benzamidine, characterized in that (a) an optionally correspondingly substituted diaminobenzene is condensed with 2-[4-(1,2,4-oxadiazol-5-on-3-yl)-phenylamino]-acetic acid, (b) i) the product thus obtained is hydrogenated and ii) optionally the amidino group is carbonylated, without isolating the intermediate product of the hydrogenation beforehand; as well as a process for preparing a salt of an optionally substituted 4-(benzimidazol-2-ylmethylamino)-benzamidine, wherein (a) an optionally correspondingly substituted diaminobenzene is condensed with 2-[4-(1,2,4-oxadiazol-5-on-3-yl)-phenylamino]-acetic acid, (b) the product thus obtained is hydrogenated, and (c) i) optionally the amidino group is carbonylated and ii) without prior isolation of the intermediate product of the carbonylation the desired salt is isolated.