Abstract: The present invention relates to an asphalt composition comprising asphalt or an asphalt mixture and to a silicon carbide-containing binder that can be heated by means of microwaves. The silicon carbide is present in the binder in particle form, the equivalent diameter of silicon carbide particles contained in the binder is less than 60 ?m. The invention also relates to a method for producing and/or renovating road surfaces or asphalt surfaces comprising at least one asphalt surface layer.

Abstract: A conveying and separating method and a device for separating sheet-shaped objects, for example preliminary chewing-gum products or intermediate chewing-gum products in the form of chewing-gum sheets, into strip-shaped or slab-shaped object sub-units. The conveying and separating method and device for separating sheet-shaped objects preferably separates sub-units one after another from each of the sheet-shaped objects at at least one weakened region on each of the sheet-shaped objects by a conveying and separating device that preferably has a revolving conveyor belt with suction elements that can be activated and deactivated. The suction elements pick up, hold, and convey the sheet-shaped object when the suction element is activated and release the sub-units when the suction element is deactivated.

Abstract: An agricultural machine for discharging liquid includes a boom, a frame to which the boom is fixed such that the boom can be rotated about an axis of rotation pointing in the direction of travel, an actuating cylinder for rotating the boom about the axis of rotation, and a measurement and control system for the actuation of the actuating cylinder, wherein the actuating cylinder is mechanically connected to the frame on one side. The actuating cylinder is mechanically connected to the boom on the other side for the direct introduction of force. The actuating cylinder is formed as a double-acting actuating cylinder having a piston, to which pressure can be applied on both sides in order to move the boom in opposite directions of rotation.

Abstract: An aircraft fuselage includes at least one space arranged in the aircraft fuselage and at least one wall. The wall resists burnthrough for a period of at least four minutes from outside the aircraft fuselage towards the space, wherein the region of the aircraft fuselage underneath the space does not include burnthrough-resistant insulation. The space may be a cargo compartment of the aircraft or a passenger cabin, while the wall may be designed as a cargo compartment floor, passenger cabin floor or wing/fuselage fairing (belly fairing). The design of the aircraft fuselage results in burnthrough resistance that meets the requirements of FAR §25.856 (b) without any additional burnthrough-resistant insulation in the aircraft fuselage.

Abstract: The invention relates to a method and a device for producing and packing individual strip-type objects, especially strips of chewing gum, comprising the following method steps and features: provision of rectangular sheets from which the strips are to be formed, the length of the shorter sides of the sheets corresponding to the length of a strip to be formed; formation of individual strips from the sheets provided; packing of the formed individual strips using a first packaging material; formation of a group of the individual packed strips; and packing of the formed group of strips using a second packaging material.

Abstract: The invention provides LM-1 antibodies, functional fragments, modified and variant forms, nucleic acid and other compositions. The invention also provides antibodies, functional fragments, modified and variant forms that bind to LM-1 antigen (e.g., NONO/nmt55). Antibodies, functional fragments, modified and variant forms, nucleic acid and other compositions are useful in treatment and diagnostic methods. One method includes treating metastasis of a neoplasia, tumor or cancer in a subject in need of treatment by administering to the subject an amount of a LM-1 antibody, an antibody that binds to LM-1 antigen, or a functional fragment thereof, effective to treat metastasis of the neoplasia, tumor or cancer in the subject.

Abstract: An insulated building structure, in particular an insulated roof structure or a wall structure of a building, comprises at least one thermal insulation layer. At least one moisture-variable protective layer for the thermal insulation layer is provided on an outer side of the thermal insulation layer and on an inner side of the thermal insulation layer facing a building interior of the building. The protective layers each have a water vapor diffusion equivalent air layer thickness Sd. The water vapor diffusion equivalent air layer thicknesses Sd of the two protective layers deviate from each other by less than 20%, preferably less than 10%, in the range of a relative humidity from 0% to 25% and/or in the range of a relative humidity from 80% to 100%.

Abstract: A method and a device are created according to the invention for conveying piece products on one or several tracks, which are arranged side by side and substantially parallel to one another, in such a manner that the products are conveyed further having been separated out from a product stream into singles on each of the tracks and then aligned at uniform spacings and/or in groups. In this case, the products are first of all fed on each track as a single-row product stream on a first conveying device at a first speed.

Abstract: A moisture-variable protective layer is to be used in particular for protecting a thermal insulating layer in insulated building structures, such as roof and/or wall structures of a building. The protective layer has a water vapor diffusion-dependent air layer thickness Sd that is dependent on the ambient humidity. The protective layer at least partly consists of and/or comprises a material that has a water vapor diffusion equivalent air layer thickness Sd of greater than 10 m at a relative humidity of the atmosphere surrounding the protective layer in the range from 0% to 25% and has a water vapor diffusion equivalent air layer thickness Sd of less than 0.4 m at a relative humidity of the atmosphere surrounding the protective layer in the range from 90% to 100%.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: A tray loading packaging machine that carries out a method for filling a multi-row packaging tray with piece-form products at a high performance level, having the following steps: dividing up a single-row stream of piece-form products onto a plurality of lanes arranged substantially parallel to one another in order to convey the products further; synchronizing the individual streams of products on the plurality or lanes with one another such that in each case one product from one lane can be transferred to the packaging tray substantially at the same time as in each case one product from the other lanes; and transferring the produces to the packaging tray, wherein in each case one product from one lane is transferred to one row of the packaging tray.

Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: An insulated building structure, in particular an insulated roof structure or a wall structure of a building, comprises at least one thermal insulation layer. At least one moisture-variable protective layer for the thermal insulation layer is provided on an outer side of the thermal insulation layer and on an inner side of the thermal insulation layer facing a building interior of the building. The protective layers each have a water vapor diffusion equivalent air layer thickness Sd. The water vapor diffusion equivalent air layer thicknesses Sd of the two protective layers deviate from each other by less than 20%, preferably less than 10%, in the range of a relative humidity from 0% to 25% and/or in the range of a relative humidity from 80% to 100%.

Abstract: The invention relates to a method for controlling track-bound toys, in particular electromotively operated model railways and model trains, wherein memory modules which can be read in a contactless manner and store unique identification data are situated on or in the vicinity of the installed tracks, track sections, signals or points. At least one memory module reader which is situated on or in the toy is also provided. When the respective memory modules are approached or driven over, the data stored there are acquired by the memory reader. According to the invention a module for wireless communication and for establishing a local radio network is provided on or in the toy, in particular a rail car or locomotive.

Abstract: A facing arrangement for a hold of an aircraft or spacecraft. The facing arrangement comprises a first and a second panel which form a gap between them; a first mounting part which is to be attached to a primary structure of the hold and which has at least one locking arrangement, and a second mounting part which has at least one counter locking arrangement. The locking arrangement and/or the counter locking arrangement passing, at least in portions, through the gap between the first and the second panel. The locking arrangement and the counter locking arrangement being locked together in order to connect the first mounting part to the second mounting part for holding the first and second panels between the first mounting part and the second mounting part.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.

Abstract: A method and device for conveying and grouping products by supplying the products in a first conveying direction on a track by a first conveying device, wherein the products are located one behind another at arbitrary spacings; grouping the products on the track by a grouping device so that a defined number of products are arranged at defined spacings one behind another in a formed product group on the track behind the grouping device in the conveying direction; and transferring the formed product group to a second conveying device for forwarding in a second conveying direction so that the products maintain their relative alignment at the defined spacings with respect to one another in the formed product group and are essentially located side by side in a row. In a multiple-track embodiment, a product matrix is formed from several product groups which are located side by side.

Abstract: The invention relates to an apparatus (10) for blocking and for adjusting a pressure for a hydraulically controllable actuator mechanism (12), in particular in the form of a lifting unit (16) of a machine (18). Said apparatus (10) allows at least one working chamber (20, 22) to be selectively connected to a pressure supply unit (94) comprising a storage device (34) or to a discharge end (66), in particular a reservoir end, by means of a valve unit (38). The apparatus (10) of the invention is characterized in that in a controlling position of the valve unit (38), when the storage pressure in the storage device (34) is greater than the working pressure in the at least one working chamber (20) of the actuator mechanism (12), the storage pressure is relieved in the direction of the discharge end (66) until the working pressure has been reached.

Abstract: The invention creates a single-track or multiple-track device and a corresponding method for conveying lumpy products in such a way that the products are separated from a product stream on each of the tracks and are subsequently conveyed further spaced apart uniformly and/or in groups. For this purpose, arrangements for supplying the products as a single-row product stream are provided in each track as well as arrangements for discharging the separated products distanced from one another in a row, wherein the products are transferred from the supplying arrangements to the discharging arrangements.