Abstract: The invention relates to a calibrating device for adapting a measuring device for measuring the thickness of thin layers on an object to be measured, comprising a calibrating surface (12) having a flat upper side and a flat underside, which are provided at a distance with a predetermined thickness, characterized in that the calibrating surface (12) is arranged separate from at least one edge area (18) and the calibrating surface (12) is connected to the at least one edge area (18) via at least one transition area (14).

Abstract: The invention relates to a Measuring probe for a device for the measurement of the thickness of thin layers, with a housing (14) comprising at least one sensor element (17), which is accepted along a longitudinal axis (16) of the housing (14) at least slightly movable to the housing (14) and with a contact spherical cap (21) assigned to the at least one sensor element (17) for setting the measuring probe (11) onto a surface of a measuring object, wereby in that the at least one sensor element (17) is accepted by a holding element (18)—along the longitudinal axis (16) of the housing (14)—which is designed spring-loaded resiliently and which is fastened on the housing (14).

Abstract: The invention relates to a calibration standard, especially for the calibration of devices for the non-destructive measurement of the thickness of thin layers, with a carrier layer (12) consisting of a basic material and a standard (17) applied on the carrier layer (12), said standard having the thickness of the layer to be measured at which the device is to be calibrated, with the carrier layer (12) comprising a plane-parallel measuring surface (16) to its bearing surface (14), that the standard (17) comprises a bearing surface (18) plane-parallel with its measuring surface (19) for bearing on the measuring surface (16) of the carrier layer (12), and that the standard (17) is permanently provided on the carrier layer (12) by means of plating by rubbing.

Abstract: The invention relates to a method for emitting measuring values on a display (27) for a display device. According to said method, the measuring values that are recorded by a measuring device (24) on at least one test object (11) are forwarded to a signal processing device; a measuring value is detected at each measuring point (14-21) on the test object (11), or a plurality of measuring values are detected at each measuring point (14-21) on the test object (11); the average value is determined at each measuring point (14-21), from the number of detected measuring values; the average values of the respective measuring points (14-21) on at least one test object (11) are sorted according to the rank thereof in an evaluation device comprising an electronic calculator; and said average values are represented on the display (27) together with an upper and a lower boundary line.

Abstract: A memory module has a memory cell configuration. For the purpose of testing the memory cell configuration, the memory module has a test structure with at least two test circuits, which are disposed in a distributed fashion on the memory module and are connected to one another via a common test switching bus, which can be connected to an address bus of the memory module via a decoupling circuit during a test operation.

Abstract: A method for producing an integrated memory module containing a command decoding device that responds to external operation commands to set operating states of the memory module for carrying out operations in accordance with a predetermined specification of the memory module. The command decoding device is formed with a decision memory containing memory locations Mi,j, the storage capacity of which suffices to receive, for an arbitrary specification from a plurality of different specifications, a decision information item specifying whether or how the second operation command of selected pairs of two directly successive operation commands is to be executed. After integration of the command decoding device thus formed, the decision information items demanded in the case of the predetermined specification are written to the memory locations of the decision memory.

Abstract: A data memory circuit is provided. In one embodiment, the data memory circuit comprises a plurality of addressable memory cells, a command decoding device for decoding external commands and a control device for controlling or initiating operations for the operation of the data memory circuit in each case in a manner dependent on the decoded commands. The memory circuit has critical operating states in which the execution of specific commands is impermissible resulting in the course of specific operations in the data memory circuit, wherein a command buffer device buffer-stores commands received during the duration of their impermissibility and releases them for execution after the end of their impermissibility.

Abstract: A prestage for generating a control signal for an output driver of an integrated circuit, wherein the integrated circuit can be provided with a reference potential and a supply potential fixed in relation to the reference potential, comprises an input for receiving an input signal from the integrated circuit, a circuitry for generating an output signal based on the received input signal, an output for outputting the generated output signals as control signal for an output driver as well as a current source, which is effectively connected to the circuitry. Thereby, the circuitry for generating an output signal and the current source are connected in series and connected to a first potential and a second potential such that a prestage potential difference across the series circuit is higher than a supply potential difference between the supply potential and the reference potential.

Abstract: The present invention relates to an input circuit for receiving an input signal in an integrated circuit, having a differential amplifier whose first input can have a predetermined reference voltage applied to it and whose second input can have the input signal applied to it, and having a current source for operating the differential amplifier at its operating point, wherein a setting circuit is connected to the current source in order to set the operating point of the differential amplifier in an optimum manner on the basis of the predetermined reference voltage.

Abstract: The invention relates to a calibrating device for adapting a measuring device for measuring the thickness of thin layers on an object to be measured, comprising a calibrating surface (12) having a flat upper side and a flat underside, which are provided at a distance with a predetermined thickness, characterized in that the calibrating surface (12) is arranged separate from at least one edge area (18) and the calibrating surface (12) is connected to the at least one edge area (18) via at least one transition area (14).

Abstract: The invention relates to a semiconductor memory device, a system with a semiconductor memory device, and a method for operating a semiconductor memory device, comprising the steps of reading out a data value, in particular a CAS latency time data value (CL) stored in a memory; activating or deactivating a device provided on said semiconductor memory device in support of a high speed operation, as a function of the data value (CL) stored.

Abstract: An integrated circuit with electrostatic discharge protection includes a first transistor with a source terminal, a drain terminal and a gate terminal, and a second transistor with a source terminal, a drain terminal and a gate terminal. The gate terminal for each of the first and second transistors is connected to the drain terminal. The first transistor is connected in series with the second transistor by one of the drain and source terminals of the first transistor being connected to one of the drain and source terminals of the second transistor. The series circuit formed by the transistors is connected to an input terminal of the integrated circuit or to a supply terminal and a terminal that applies the reference potential of the integrated circuit. The series circuit of the transistors is dimensioned by the number of transistors and the setting of the channel length and channel width ratios of the transistors.

Abstract: The invention relates to a method and an apparatus for measurement of the thickness of thin layers by means of a measurement probe (11) which has a housing (14) which holds at least one sensor element (17) whose longitudinal axis lies parallel to or on a longitudinal axis (16) of the housing (14), in which at least during the measurement process, a gaseous medium is supplied to a supply opening (21) of the measurement probe (11) on a measurement surface (28), and is supplied via at least one connection channel (24), which is connected to the supply opening (21), to one or more outlet openings (26) which are provided on an end face (29), pointing towards the measurement surface (28), of the measurement probe (11), and in which at least one mass flow, which flows out of one or more outlet openings (26), of the gaseous medium is directed at the measurement surface (28), and in which the measurement probe (11) is held in a non-contacting manner with respect to the measurement surface (28) during the measurement p

Abstract: The testing of a RAM memory circuit containing a multiplicity of memory cells can in each case be selected in groups of n?1 memory cells by using an applied address information item in order to write in or read out groups of in each case n data. According to the invention, in a test write cycle, a plurality i=j*m of the memory cell groups are selected, where j and m are in each case integers ?2, and the same datum is written into all the memory cells of in each case m selected memory cell groups. In a subsequent read cycle, the i memory cell groups selected in the write cycle are selected and read in a sequence such that the read-out data groups from in each case m memory cell groups at which the same datum was written in are provided simultaneously or in direct succession as a read data block comprising m*n data.

Abstract: The invention provides an integrated device comprising a plurality of non-individually-encapsulated chip arrangements, each of which having a plurality of contact elements for contacting a contact pad, wherein the plurality of chip arrangements are stacked on each other such that the respective contact elements provide electrical connections to the respective chip arrangement, and a common integral mold arranged to encapsulate the plurality of stacked chip arrangements.

Abstract: The invention relates to a Measuring probe for a device for the measurement of the thickness of thin layers, with a housing (14) comprising at least one sensor element (17), which is accepted along a longitudinal axis (16) of the housing (14) at least slightly movable to the housing (14) and with a contact spherical cap (21) assigned to the at least one sensor element (17) for setting the measuring probe (11) onto a surface of a measuring object, whereby in that the at least one sensor element (17) is accepted by a holding element (18)—along the longitudinal axis (16) of the housing (14)—which is designed spring-loaded resiliently and which is fastened on the housing (14).

Abstract: The invention relates to a calibration standard, especially for the calibration of devices for the non-destructive measurement of the thickness of thin layers with a carrier plate (16) of a basic material and a standard (17) applied on the carrier plate (16), said standard having the thickness of the layer at which the device is to be calibrated, wherein that a holding device (22) arranged on the basic body (12) of the calibration standard (11) receives at least the standard (17) to the basic body (12) such that upon setting a measuring probe of the device for the non-destructive measurement of thin layers onto the standard (17), its position will be changeable by at least one degree of freedom.

Abstract: An apparatus for non-destructive measurement of the thickness of thin layers, has a housing and a probe which is connected to an evaluation unit and to which signals are emitted during a measurement for determining the layer thickness, and having a display apparatus which indicates at least the measurement data from the evaluation unit. At least one further display apparatus is positioned on the housing away from the plane of the first display apparatus.

Abstract: A measurement stand for holding a measuring device (26), in particular a measuring arrangement (26) for measuring the thickness of thin layers, said measurement stand comprising a housing (18) in which a cam follower (23) is guided such that it can be moved up and down and the measuring device (26) is arranged at that end of said housing (18) that faces the measuring object (14), wherein a drive unit (29) with an electric drive (28) drives the lifting movement of the cam follower (23), wherein said drive unit (29) initiates in the down movement at least one first movement phase with a rapid motion and at least one further movement phase of the cam follower (23) with a creep motion until the measuring device (26) touches down on the measuring object (14).

Abstract: The invention relates to a calibration standard, especially for the calibration of devices for the non-destructive measurement of the thickness of thin layers, with a carrier layer (12) consisting of a basic material and a standard (17) applied on the carrier layer (12), said standard having the thickness of the layer to be measured at which the device is to be calibrated, with the carrier layer (12) comprising a plane-parallel measuring surface (16) to its bearing surface (14), that the standard (17) comprises a bearing surface (18) plane-parallel with its measuring surface (19) for bearing on the measuring surface (16) of the carrier layer (12), and that the standard (17) is permanently provided on the carrier layer (12) by means of plating by rubbing.