Abstract: A semiconductor storage device includes a first word line, a second word line provided in the same layer with the first word line and configured to be controlled independently from the first word line, a plurality of memory pillars between the first word line and the second word line, each of the plurality of memory pillars including a first memory cell facing to the first word line and a second memory cell facing to the second word line, the plurality of memory pillars being arranged in a first direction and a second direction intersecting to the first direction and a control circuit. The control circuit is configured to perform a write operation to the second memory cell included in the plurality of memory pillars after performing a write operation to the first memory cell included in each of the plurality of memory pillars.

Abstract: A semiconductor storage device includes a semiconductor pillar, a first string having first memory cells connected in series, first word lines connected to the first memory cells, a second string having second memory cells connected in series, and second word lines connected to the second memory cells. Each of the first memory cells faces, and shares a channel in the semiconductor pillar with, one of the second memory cells. When reading data of the k-th first memory cell, a voltage of the first word line connected to the k-th first memory cell reaches a first voltage at a first timing, and a voltage of the second word line connected to at least one of the second memory cells other than the k-th second memory cell in the second string facing the k-th first memory cell reaches the first voltage at a second timing that is later than the first timing.

Abstract: According to one embodiment, a memory device includes: a third layer between first and a second layers above a substrate; a pillar being adjacent to the first to third layers and including a ferroelectric layer; a memory cell between the third layer and the pillar; and a circuit which executes a first operation for a programming, a second operation for an erasing using a first voltage, and a third operation of applying a second voltage between the third layer and the pillar. The first voltage has a first potential difference, the second voltage has a second potential difference smaller than the first potential difference. A potential of the third conductive layer is lower than a potential of the pillar in each of the first and second voltages. The third operation is executed between the first operation and the second operation.

Abstract: According to one embodiment, a memory device includes: a third layer between first and a second layers above a substrate; a pillar being adjacent to the first to third layers and including a ferroelectric layer; a memory cell between the third layer and the pillar; and a circuit which executes a first operation for a programming, a second operation for an erasing using a first voltage, and a third operation of applying a second voltage between the third layer and the pillar. The first voltage has a first potential difference, the second voltage has a second potential difference smaller than the first potential difference. A potential of the third conductive layer is lower than a potential of the pillar in each of the first and second voltages. The third operation is executed between the first operation and the second operation.

Abstract: A semiconductor memory device includes separate first and second word lines respectively facing first and second portions of a semiconductor and sandwiching the semiconductor; and first and second cell transistors respectively located in the first and second portions and respectively coupled to the first and second word lines. In a first operation, a first read is executed on the second cell transistor while a first voltage and a higher second voltage are being respectively applied to the first and second word lines. In a second operation, a second read is executed on the first cell transistor while a third voltage between the first and second voltages is being applied to the second word line.

Abstract: A nonvolatile semiconductor storage device includes a first channel layer including a first drain-side select transistor, a first source-side select transistor, and a first memory cell transistor, a second channel layer including a second drain-side select transistor, a second source-side select transistor, and a second memory cell transistor, a word line that functions as a gate electrode of the first and second memory cell transistors, and a controller. When a read operation is executed on the first memory cell transistor, the controller turns on the second drain-side select transistor and the second source-side select transistor, supplies a first voltage to the word line in a state where the first drain-side select transistor and the first source-side select transistor are turned off, and then, supplies a second voltage to the word line in a state where the first drain-side select transistor and the first source-side select transistor are turned on.

Abstract: A nonvolatile semiconductor storage device includes a first channel layer including a first drain-side select transistor, a first source-side select transistor, and a first memory cell transistor, a second channel layer including a second drain-side select transistor, a second source-side select transistor, and a second memory cell transistor, a word line that functions as a gate electrode of the first and second memory cell transistors, and a controller. When a read operation is executed on the first memory cell transistor, the controller turns on the second drain-side select transistor and the second source-side select transistor, supplies a first voltage to the word line in a state where the first drain-side select transistor and the first source-side select transistor are turned off, and then, supplies a second voltage to the word line in a state where the first drain-side select transistor and the first source-side select transistor are turned on.

Abstract: A semiconductor storage device includes a first memory cell and a second memory cell which are connected to each other in series, a first word line which is connected to the first memory cell, a second word line which is connected to the second memory cell, and a control circuit. The control circuit is configured to charge a first node while applying a second voltage to the second word line and a first voltage to the first word line, to charge a second node on the basis of a voltage of the charged first node, to discharge the second node while applying the second voltage to the second word line and a third voltage to the first word line, and to read data from the first memory cell on the basis of voltages of the charged and discharged second node.

Abstract: A semiconductor memory device includes separate first and second word lines respectively facing first and second portions of a semiconductor and sandwiching the semiconductor; and first and second cell transistors respectively located in the first and second portions and respectively coupled to the first and second word lines. In a first operation, a first read is executed on the second cell transistor while a first voltage and a higher second voltage are being respectively applied to the first and second word lines. In a second operation, a second read is executed on the first cell transistor while a third voltage between the first and second voltages is being applied to the second word line.

Abstract: According to the present embodiment, a nonvolatile semiconductor memory device includes a memory string group including k stacked memory strings, each of the memory strings including a plurality of nonvolatile memory cells connected in series, a selection transistor group including k selection transistors, each of the k selection transistors corresponding to each of the k memory strings respectively, the selection transistor group divided into n selection transistor sub-groups, each of the n selection transistor sub-groups including k/n selection transistors, n bit lines arranged in parallel to each of the k memory strings, and n bit line contacts arranged perpendicularly, each of the n bit line contacts connected to each of the n bit lines, respectively, each of the n bit line contacts connected to the k/n selection transistors belonging to the each of the n selection transistor sub-group respectively.

Abstract: A semiconductor memory device comprises: a memory transistor; a first wiring connected to a gate electrode of the memory transistor; and a control device that executes a read operation to read data of the memory transistor and a write operation to write data in the memory transistor. In the read operation or the write operation, the control device: increases a voltage of the first wiring to a first voltage from a first timing to a second timing; and adjusts a length from the first timing to the second timing corresponding to at least one of a voltage of the first wiring, a current of the first wiring, and an amount of charge flowed through the first wiring.

Abstract: A semiconductor storage device includes a first memory cell and a second memory cell which are connected to each other in series, a first word line which is connected to the first memory cell, a second word line which is connected to the second memory cell, and a control circuit. The control circuit is configured to charge a first node while applying a second voltage to the second word line and a first voltage to the first word line, to charge a second node on the basis of a voltage of the charged first node, to discharge the second node while applying the second voltage to the second word line and a third voltage to the first word line, and to read data from the first memory cell on the basis of voltages of the charged and discharged second node.

Abstract: According to one embodiment, a memory controller transmits a first instruction to a memory device. The memory device includes cell transistors; word lines coupled to gates of the cell transistors; a first data latch; and a second latch. The first instruction instructs application of a positive voltage to one of the word lines. The memory controller transmits a second instruction after the transmission of the first instruction and before transmitting a third instruction. The third instruction instructs output of data from the memory device. The second instruction is different from the third instruction and a fourth instruction instructing copy of data from the first data latch to the second data latch.

Abstract: A semiconductor memory device comprises: a memory transistor; a first wiring connected to a gate electrode of the memory transistor; and a control device that executes a read operation to read data of the memory transistor and a write operation to write data in the memory transistor. In the read operation or the write operation, the control device: increases a voltage of the first wiring to a first voltage from a first timing to a second timing; and adjusts a length from the first timing to the second timing corresponding to at least one of a voltage of the first wiring, a current of the first wiring, and an amount of charge flowed through the first wiring.

Abstract: According to the present embodiment, a nonvolatile semiconductor memory device includes a memory string group including k stacked memory strings, each of the memory strings including a plurality of nonvolatile memory cells connected in series, a selection transistor group including k selection transistors, each of the k selection transistors corresponding to each of the k memory strings respectively, the selection transistor group divided into n selection transistor sub-groups, each of the n selection transistor sub-groups including k/n selection transistors, n bit lines arranged in parallel to each of the k memory strings, and n bit line contacts arranged perpendicularly, each of the n bit line contacts connected to each of the n bit lines, respectively, each of the n bit line contacts connected to the k/n selection transistors belonging to the each of the n selection transistor sub-group respectively.

Abstract: According to one embodiment, a memory controller transmits a first instruction to a memory device. The memory device includes cell transistors; word lines coupled to gates of the cell transistors; a first data latch; and a second latch. The first instruction instructs application of a positive voltage to one of the word lines. The memory controller transmits a second instruction after the transmission of the first instruction and before transmitting a third instruction. The third instruction instructs output of data from the memory device. The second instruction is different from the third instruction and a fourth instruction instructing copy of data from the first data latch to the second data latch.

Abstract: According to one embodiment, a memory controller transmits a first instruction to a memory device. The memory device includes cell transistors; word lines coupled to gates of the cell transistors; a first data latch; and a second latch. The first instruction instructs application of a positive voltage to one of the word lines. The memory controller transmits a second instruction after the transmission of the first instruction and before transmitting a third instruction. The third instruction instructs output of data from the memory device. The second instruction is different from the third instruction and a fourth instruction instructing copy of data from the first data latch to the second data latch.

Abstract: According to one embodiment, a memory controller transmits a first instruction to a memory device. The memory device includes cell transistors; word lines coupled to gates of the cell transistors; a first data latch; and a second latch. The first instruction instructs application of a positive voltage to one of the word lines. The memory controller transmits a second instruction after the transmission of the first instruction and before transmitting a third instruction. The third instruction instructs output of data from the memory device. The second instruction is different from the third instruction and a fourth instruction instructing copy of data from the first data latch to the second data latch.

Abstract: A memory device includes a first memory string including a first selection transistor and a first memory cell, a second memory string including a second selection transistor and a second memory cell, a bit line electrically connected to the first memory string and the second memory string, and a control circuit configured to perform a collective write operation on the first memory cell and the second memory cell by applying a voltage to turn on the first transistor, a voltage to turn on the second transistor, and then a program voltage at the same time to gates of the first and second memory cells.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of groups of memory cells above a substrate, the groups including a first group and a second group, each of the first and second groups including a first memory string and a second memory string, the first memory string including first memory cells that are disposed in a first layer, the second memory string including second memory cell that are disposed in a second layer above the first layer, and a controller configured to perform an erasing operation on the memory cells, the erasing operation including a verifying operation on the memory cells to determine on a layer by layer basis whether the memory cells failed to erase data stored therein.