Patents by Inventor Hideki Ueda
Hideki Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145926Abstract: A dielectric block includes a bottom surface that includes a conductive ground member including an antenna ground surface inclined with respect to the bottom surface. A feed element is disposed at a distance from the antenna ground surface, and constitutes a patch antenna together with the antenna ground surface. A feed line is connected to a feed point of the feed element, and a dielectric member that supports the feed element with respect to the ground member. The ground member is exposed to the bottom surface, on both a lower side and a higher side of a contour line passing through an intersection point of a perpendicular line from the feed point to a virtual plane including the bottom surface and a plane including the antenna ground surface, using the bottom surface as a height reference.Type: ApplicationFiled: January 11, 2024Publication date: May 2, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Hideki UEDA, Kaoru SUDO, Natsumi MINAMITANI, Jun ADACHI, Shu HAMADA
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Patent number: 11970837Abstract: A working machine control device includes a camera that obtains a captured image by imaging a particular part that is a part of a lower travelling body, and a controller, in which the controller includes a setting unit that sets a target slewing angle of an upper slewing body with respect to the lower travelling body, and a display control unit that causes a display unit to display a display screen in which a target image indicating a target position of the particular part is displayed in a superimposed manner at a position on the captured image, the position being where the particular part is displayed when a slewing angle of the upper slewing body with respect to the lower travelling body reaches the target slewing angle.Type: GrantFiled: January 24, 2019Date of Patent: April 30, 2024Assignee: KOBELCO CONSTRUCTION MACHINERY CO., LTD.Inventors: Kazuhiro Ueda, Seiji Saiki, Hideki Yoshihara
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Patent number: 11942685Abstract: A first antenna, a second antenna, and a waveguide structure are housed in a single cabinet. An operating frequency of the second antenna is higher than an operating frequency of the first antenna. The second antenna is an array antenna including a plurality of radiating elements. The waveguide structure is present outside a range of a half-value angle of a main beam as viewed from the first antenna, includes a unit waveguide disposed in a route of a radio wave received by the second antenna, and further attenuates a radio wave with the operating frequency of the first antenna.Type: GrantFiled: February 17, 2022Date of Patent: March 26, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hideki Ueda, Yasuhisa Yamamoto, Masashi Omuro, Kazunari Kawahata, Satoshi Tanaka, Ryuken Mizunuma
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Publication number: 20240088574Abstract: An antenna module includes a first sub array to a fourth sub array. The first sub array to the fourth sub array have a rectangular substrate. Each of the first sub array to the fourth sub array includes a plurality of radiation electrodes disposed along an extending direction of a long side. The first sub array to the fourth sub array are configured to radiate radio waves of the first polarized wave to the fourth polarized wave, respectively. The first polarized wave is different from the second polarized wave, and the third polarized wave is different from the fourth polarized wave. The first polarized wave is the same as the third polarized wave, and the second polarized wave is the same as the fourth polarized wave.Type: ApplicationFiled: November 15, 2023Publication date: March 14, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Kota ARAI, Ryo KOMURA, Hideki UEDA
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Patent number: 11901644Abstract: A ground plane, at least one composite antenna, and a power feeding line configured to supply power to the at least one composite antenna are provided in or on a substrate. The composite antenna includes a power feeding element configuring a patch antenna together with the ground plane, and at least one linear antenna configured to flow an electric current having a component in a vertical direction with respect to the ground plane. The power feeding line includes a main line connected to the power feeding element, and a branch line branched from the main line and connected to the linear antenna.Type: GrantFiled: May 7, 2021Date of Patent: February 13, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Hideki Ueda
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Patent number: 11885621Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.Type: GrantFiled: February 4, 2020Date of Patent: January 30, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Koichiro Nakashima, Takashi Uchida, Yusuke Nakamura, Hideki Ueda, Naruhito Noda, Toshitsugu Konishi, Toshio Yamazaki
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Patent number: 11777221Abstract: A plurality of multi-band antenna elements operable at a plurality of frequencies constitutes an array antenna. An antenna drive unit selects at least some of the multi-band antenna elements from the plurality of multi-band antenna elements in accordance with one operation frequency selected from the plurality of operation frequencies, and causes the selected multi-band antenna elements to operate.Type: GrantFiled: October 21, 2020Date of Patent: October 3, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hideki Ueda, Kaoru Sudo, Kengo Onaka, Hirotsugu Mori, Takaki Murata
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Patent number: 11756902Abstract: A ground plane is disposed in a dielectric substrate or on the top surface of the dielectric substrate. A high-frequency semiconductor device is mounted on the bottom surface of the dielectric substrate. A shield structure that is provided in a space closer to the bottom surface than the ground plane is surrounds the high-frequency semiconductor device from below and sideways of the high-frequency semiconductor device and is connected to the ground plane. An opening is formed in the shield structure. A radiation-structure portion causes a high-frequency signal output by the high-frequency semiconductor device to be radiated through the opening.Type: GrantFiled: October 1, 2019Date of Patent: September 12, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Hideki Ueda
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Patent number: 11735832Abstract: A plurality of segments each include one input-output port and a plurality of antenna ports. A plurality of subarrays each include a plurality of elements connected to any of the plurality of antenna ports. The plurality of elements constitute a sequential array for each subarray. Each of the plurality of segments includes a distribution-combination circuit that distributes a signal input to a first port to the plurality of antenna ports and that combines signals input to the respective plurality of antenna ports to output a combined signal from the first port, and a first amplifier connected between the input-output port and the first port. In the plurality of subarrays, the plurality of antenna ports to which the respective plurality of elements included in one subarray are connected are included in one segment.Type: GrantFiled: September 9, 2021Date of Patent: August 22, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Hideki Ueda
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Patent number: 11705644Abstract: A plurality of segments each include one input-output port and a plurality of antenna ports. A plurality of subarrays each include a plurality of elements connected to any of the plurality of antenna ports. The plurality of elements constitute a sequential array for each subarray. Each of the plurality of segments includes a distribution-combination circuit that distributes a signal input to a first port to the plurality of antenna ports and that combines signals input to the respective plurality of antenna ports to output a combined signal from the first port, and a first amplifier connected between the input-output port and the first port. In the plurality of subarrays, the plurality of antenna ports to which the respective plurality of elements included in one subarray are connected are included in one segment.Type: GrantFiled: September 9, 2021Date of Patent: July 18, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Hideki Ueda
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Publication number: 20230145095Abstract: The antenna module includes a first substrate and a second substrate on each of which a radiating element is arranged, a third substrate, and a switch circuit. An RFIC for supplying a radio frequency signal to the first substrate and the second substrate is arranged on the third substrate. The switch circuit is configured to change over a connection between the RFIC and the radiating element on the first substrate and a connection between the RFIC and the radiating element on the second substrate.Type: ApplicationFiled: December 29, 2022Publication date: May 11, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Kengo ONAKA, Hirotsugu MORI, Yoshiki YAMADA, Kaoru SUDO, Hiroshi IZUMITANI, Hideki UEDA
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Publication number: 20230109026Abstract: The present invention has been made, for oral compositions comprising tectorigenins, for the purpose of ameliorating the taste of oral compositions comprising tectorigenins and ameliorating the stability of such oral compositions and the combination of tectorigenins and a specific compound can ameliorate the taste or stability of oral compositions comprising tectorigenins.Type: ApplicationFiled: September 29, 2020Publication date: April 6, 2023Applicant: TOYO SHINYAKU CO., LTD.Inventors: Hiroshi TOMOZAWA, Hideki UEDA, Aki MIYAMOTO, Tomoyasu KAMIYA
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Patent number: 11621496Abstract: An antenna device includes a substrate, a first antenna element extending in a direction perpendicular to a first surface of the substrate and functioning as a monopole antenna, a second antenna element provided adjacent to the first antenna element, extending in the direction perpendicular to the first surface of the substrate, and functioning as a monopole antenna, a ground layer provided in or on the substrate, a connection wire provided in or on the substrate and connecting the first antenna element and the second antenna element to each other, a power feeding line provided in or on the substrate and connected to the connection wire, and a first reflector provided in a direction in which the first antenna element and the second antenna element are adjacent to each other and facing the first antenna element and the second antenna element.Type: GrantFiled: December 29, 2020Date of Patent: April 4, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takaya Nemoto, Hideki Ueda
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Patent number: 11611361Abstract: A feed line connects an RFIC and a radiating element. A baseband ground plane (BB ground) is connected to a ground terminal of a BBIC. A radio frequency ground plane (RF ground) is placed in such a manner as to overlap the BB ground. The RF ground serves as a return path of the feed line. A first inter-ground connection circuit connects the BB ground and the RF ground. Furthermore, a second inter-ground connection circuit connects the BB ground and the RF ground. Connecting parts between these grounds and the second inter-ground connection circuit are arranged closer to the edges of these grounds than connecting parts between these grounds and the first inter-ground connection circuit. The connecting part between the ground and the second inter-ground connection circuit is placed on one side of a certain imaginary straight line that passes substantially the geometric center of the ground.Type: GrantFiled: September 25, 2020Date of Patent: March 21, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kazunari Kawahata, Ryuken Mizunuma, Hideki Ueda, Satoshi Tanaka, Masashi Omuro, Yasuhisa Yamamoto
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Publication number: 20230076794Abstract: A sensor device includes a conductive layer. The conductive layer is interposed between a first principal surface of an IC chip and a sensor element and faces the sensor element via a resin-based adhesive layer. The sensor element includes: a moving part including a moving electrode; a fixed part including a fixed electrode forming capacitance between the moving electrode and itself; a first terminal connected to the moving electrode; and a second terminal connected to the fixed electrode. The IC chip includes: a signal processor that processes a detection signal from the second terminal; a first voltage generator that generates a first voltage as an operating voltage for the processor; and a second voltage generator that generates a second voltage corresponding to the sensor element's reference potential applied to the first terminal. The conductive layer is electrically connected to the first terminal.Type: ApplicationFiled: August 5, 2022Publication date: March 9, 2023Inventors: Hideki UEDA, Koichiro NAKASHIMA
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Publication number: 20230020224Abstract: A distributing/synthesizing circuit includes first to fourth ports. A first radio frequency circuit transmits and receives a radio frequency signal to and from the first port through a first transmission line. A second transmission line is connected to the second port. A first radiating element is connected to the third port and the fourth port through a third transmission line and a fourth transmission line, respectively. The distributing/synthesizing circuit distributes and outputs the radio frequency signal input to the first port to the third port and the fourth port, synthesizes radio frequency signals that are reflected by the first radiating element and that are input to the third port and the fourth port to output the synthesized radio frequency signal to the second port. The second transmission line is longer than all of the first transmission line, the third transmission line, and the fourth transmission line.Type: ApplicationFiled: September 14, 2022Publication date: January 19, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Hideki UEDA, Haruka ARAKAWA
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Publication number: 20220408758Abstract: The present invention is a food product comprising dried Kudzu flower powder, and having a water content of 8% by weight or less, and preferably which proportion of fractions passing a sieve having a sieve opening of 2 mm is 20% by weight or more. The food product of the present invention has good taste and odor.Type: ApplicationFiled: September 11, 2020Publication date: December 29, 2022Applicant: TOYO SHINYAKU CO., LTD.Inventors: Kohei FUJIKI, Hideki UEDA, Aki MIYAMOTO, Chisato HOTTA, Tsuyoshi SATO, Tomoyasu KAMIYA
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Patent number: 11532895Abstract: A radio frequency module includes a first substrate having a first principal surface and a second principal surface on the opposite side to the first principal surface; a signal terminal which is provided on the first principal surface and through which a signal is transmitted to and received from an external circuit; a power supply terminal that is provided on the second principal surface and is supplied with a power supply signal; an antenna; and a radio frequency electronic component that is electrically connected to the signal terminal, the power supply terminal and the antenna, and controls transmission and reception of the antenna based on the signal and the power supply signal.Type: GrantFiled: August 26, 2020Date of Patent: December 20, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Hideki Ueda
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Publication number: 20220364864Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.Type: ApplicationFiled: November 6, 2020Publication date: November 17, 2022Inventors: Hideki UEDA, Yusuke NAKAMURA, Koichiro NAKASHIMA, Takashi UCHIDA, Toshio YAMAZAKI, Hiroyuki FUJII, Chikara NARA
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Patent number: D981379Type: GrantFiled: February 12, 2021Date of Patent: March 21, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hideki Ueda, Makoto Takeoka, Haruka Arakawa