Patents by Inventor Hideki Ueda

Hideki Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10305189
    Abstract: A circuit element mounting portion provided on a dielectric substrate is configured so as to mount a high-frequency integrated circuit element, and includes a ground land and a plurality of high-frequency signal lands. The dielectric substrate is provided with an antenna element including at least one radiation element. The dielectric substrate is provided with an exposed terminal portion including an exposed ground land and an exposed high-frequency signal land. The dielectric substrate is provided with a first transmission line connecting one high-frequency signal land of the circuit element mounting portion and the radiation element. Furthermore, a second transmission line connecting another high-frequency signal land of the circuit element mounting portion and the high-frequency signal land of the exposed terminal portion, and a ground conductor connecting the ground land of the circuit element mounting portion and the ground land of the exposed terminal portion are provided.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: May 28, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hideki Ueda
  • Publication number: 20190089071
    Abstract: First and second end-fire antennas are arranged on a dielectric substrate. The first end-fire antenna has polarization characteristics being parallel with a first direction. The second end-fire antenna has polarization characteristics being parallel with a second direction orthogonal to the first direction. A patch antenna provided with a first feed point and a second feed point, which are different from each other, is arranged on the dielectric substrate. When the patch antenna is fed from the first feed point, a radio wave whose polarization direction is parallel with the first direction is excited. When the patch antenna is fed from the second feed point, a radio wave whose polarization direction is orthogonal to the first direction is excited. A wireless communication module capable of achieving directivity in a wide range from a direction parallel with the substrate to the direction of the normal to the substrate is provided.
    Type: Application
    Filed: October 16, 2018
    Publication date: March 21, 2019
    Inventors: Kaoru Sudo, Hideki Ueda
  • Patent number: 10135155
    Abstract: First and second end-fire antennas are arranged on a dielectric substrate. The first end-fire antenna has polarization characteristics being parallel with a first direction. The second end-fire antenna has polarization characteristics being parallel with a second direction orthogonal to the first direction. A patch antenna provided with a first feed point and a second feed point, which are different from each other, is arranged on the dielectric substrate. When the patch antenna is fed from the first feed point, a radio wave whose polarization direction is parallel with the first direction is excited. When the patch antenna is fed from the second feed point, a radio wave whose polarization direction is orthogonal to the first direction is excited. A wireless communication module capable of achieving directivity in a wide range from a direction parallel with the substrate to the direction of the normal to the substrate is provided.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: November 20, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Hideki Ueda
  • Patent number: 10126322
    Abstract: An acceleration sensor includes a weight portion having a recess section and a solid section, beam portions, a movable electrode provided on the opposite surface of the weight portion from an open surface of the recess section to extend over the recess section and the solid section, a first fixed electrode arranged at the opposite side of the movable electrode from the recess section, and a second fixed electrode arranged at the opposite side of the movable electrode from the solid section. The acceleration sensor detects acceleration using a change in capacitance between the movable electrode and the fixed electrodes caused by rotation of the weight portion. The beam portions are shifted toward the recess section such that an angle between a perpendicular line extending from a gravity center position of the weight portion to the rotation axis and a surface of the movable electrode becomes equal to 45 degrees.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: November 13, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Hitoshi Yoshida, Nobuyuki Ibara, Hideki Ueda, Takeshi Okada, Takeshi Mori, Masatoshi Nomura, Katsumi Kakimoto, Yuji Suzuki
  • Patent number: 10088497
    Abstract: An acceleration sensor includes a CV conversion circuit, an AD conversion circuit, and first and second registers. The CV conversion circuit outputs a voltage corresponding to the capacitance changes between a movable electrode and each of first and second fixed electrodes disposed to face the movable electrode. The AD conversion circuit is connected to the CV conversion circuit and has a first detection range and a second detection range. The first register is connected to the AD conversion circuit and holds a first value. The second register is connected to the AD conversion circuit and holds a second value. The first value contains information about an acceleration in the first detection range, and the second value contains information about an acceleration in the second detection range. The first and second values indicate accelerations in the same direction.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: October 2, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takeshi Mori, Keisuke Kuroda, Hitoshi Yoshida, Kazuo Goda, Takumi Taura, Hideki Ueda
  • Publication number: 20180267079
    Abstract: A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.
    Type: Application
    Filed: November 2, 2016
    Publication date: September 20, 2018
    Inventors: TAKAHIRO SHINOHARA, HITOSHI YOSHIDA, KAZUO GODA, RIE OKAMOTO, HIROSHI NAKATSUKA, MASAKO YAMAGUCHI, HIDEKI UEDA, TAKANORI AOYAGI, YUKI MAEGAWA, TAKUYA KAJIWARA, KEISUKE KURODA, TAKESHI MORI
  • Publication number: 20180205155
    Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Inventors: Ryuken MIZUNUMA, Shinichiro BANBA, Michiharu YOKOYAMA, Hideki UEDA, Hideaki YAMADA, Noboru MORIOKA
  • Patent number: 10008783
    Abstract: A surface-layer conductive plate having an opening is disposed on a first surface of a dielectric substrate. A radiation electrode is disposed inside the opening on the first surface of the dielectric substrate. A ground conductive plate is disposed on a second surface of the dielectric substrate, the second surface being opposite to the first surface. Interlayer connection members are disposed so as to surround the opening as seen in a plan view. The interlayer connection members electrically connects the surface-layer conductive plate to the ground conductive plate and defines a cavity that causes electromagnetic resonance to occur. A reactance element is configured to cause an impedance that a side face of the cavity exhibits with respect to an electromagnetic wave propagating in the cavity to include a reactance component.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: June 26, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hideki Ueda
  • Publication number: 20180084637
    Abstract: A first board includes a first ground plane, a first ground land, a first transmission line, and a first signal land connected to the first transmission line, wherein the first ground land and the first signal land are formed on the same surface. A second board includes a second ground plane, a second ground land, a second transmission line, and a second signal land connected to the second transmission line, wherein the second ground land and the second signal land are formed on a surface opposing the first board. The second ground land and the second signal land oppose the first ground land and the first signal land, respectively. A conduction member connects the first ground land and the second ground land. The first signal land and the second signal land are connected by capacitance coupling without using any conductor.
    Type: Application
    Filed: September 15, 2017
    Publication date: March 22, 2018
    Inventor: Hideki Ueda
  • Publication number: 20180062263
    Abstract: A circuit element mounting portion provided on a dielectric substrate is configured so as to mount a high-frequency integrated circuit element, and includes a ground land and a plurality of high-frequency signal lands. The dielectric substrate is provided with an antenna element including at least one radiation element. The dielectric substrate is provided with an exposed terminal portion including an exposed ground land and an exposed high-frequency signal land. The dielectric substrate is provided with a first transmission line connecting one high-frequency signal land of the circuit element mounting portion and the radiation element. Furthermore, a second transmission line connecting another high-frequency signal land of the circuit element mounting portion and the high-frequency signal land of the exposed terminal portion, and a ground conductor connecting the ground land of the circuit element mounting portion and the ground land of the exposed terminal portion are provided.
    Type: Application
    Filed: August 24, 2017
    Publication date: March 1, 2018
    Inventor: Hideki UEDA
  • Publication number: 20180053735
    Abstract: A ground plane is provided to a dielectric board. A high-frequency integrated circuit element is mounted on the dielectric board. A shield member electromagnetically shielding the high-frequency integrated circuit element is provided on the dielectric board. A first antenna element is provided on the dielectric board and at the same side as the shield member with respect to the ground plane. The first antenna element is connected to the high-frequency integrated circuit element by a first feed line. In a plan view, a portion of the first antenna element is disposed outside the shield member, a remaining portion of the first antenna element overlaps the shield member, or an entire range of the first antenna element is disposed outside the shield member, and a spaced distance from the shield member to the first antenna element is not greater than about ½ of a resonant wavelength of the first antenna element.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 22, 2018
    Inventor: Hideki Ueda
  • Publication number: 20170336436
    Abstract: A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.
    Type: Application
    Filed: January 8, 2016
    Publication date: November 23, 2017
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: YUKI MAEGAWA, HIDEKI UEDA, HIDEAKI FUJIURA, TAKESHI UEMURA, HIROSHI NAKATSUKA, TSUYOSHI SAKAUE, RIE OKAMOTO, SHOYA KIDA
  • Publication number: 20170276696
    Abstract: An acceleration sensor includes a weight portion having a recess section and a solid section, beam portions, a movable electrode provided on the opposite surface of the weight portion from an open surface of the recess section to extend over the recess section and the solid section, a first fixed electrode arranged at the opposite side of the movable electrode from the recess section, and a second fixed electrode arranged at the opposite side of the movable electrode from the solid section. The acceleration sensor detects acceleration using a change in capacitance between the movable electrode and the fixed electrodes caused by rotation of the weight portion. The beam portions are shifted toward the recess section such that an angle between a perpendicular line extending from a gravity center position of the weight portion to the rotation axis and a surface of the movable electrode becomes equal to 45 degrees.
    Type: Application
    Filed: June 8, 2017
    Publication date: September 28, 2017
    Inventors: Hitoshi YOSHIDA, Nobuyuki IBARA, Hideki UEDA, Takeshi OKADA, Takeshi MORI, Masatoshi NOMURA, Katsumi KAKIMOTO, Yuji SUZUKI
  • Publication number: 20170222333
    Abstract: First and second end-fire antennas are arranged on a dielectric substrate. The first end-fire antenna has polarization characteristics being parallel with a first direction. The second end-fire antenna has polarization characteristics being parallel with a second direction orthogonal to the first direction. A patch antenna provided with a first feed point and a second feed point, which are different from each other, is arranged on the dielectric substrate. When the patch antenna is fed from the first feed point, a radio wave whose polarization direction is parallel with the first direction is excited. When the patch antenna is fed from the second feed point, a radio wave whose polarization direction is orthogonal to the first direction is excited. A wireless communication module capable of achieving directivity in a wide range from a direction parallel with the substrate to the direction of the normal to the substrate is provided.
    Type: Application
    Filed: April 19, 2017
    Publication date: August 3, 2017
    Inventors: Kaoru Sudo, Hideki Ueda
  • Patent number: 9702895
    Abstract: An acceleration sensor includes a weight portion having a recess section and a solid section, beam portions, a movable electrode provided on the opposite surface of the weight portion from an open surface of the recess section to extend over the recess section and the solid section, a first fixed electrode arranged at the opposite side of the movable electrode from the recess section, and a second fixed electrode arranged at the opposite side of the movable electrode from the solid section. The acceleration sensor detects acceleration using a change in capacitance between the movable electrode and the fixed electrodes caused by rotation of the weight portion. The beam portions are shifted toward the recess section such that an angle between a perpendicular line extending from a gravity center position of the weight portion to the rotation axis and a surface of the movable electrode becomes equal to 45 degrees.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: July 11, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hitoshi Yoshida, Nobuyuki Ibara, Hideki Ueda, Takeshi Okada, Takeshi Mori, Masatoshi Nomura, Katsumi Kakimoto, Yuji Suzuki
  • Patent number: 9550663
    Abstract: A MEMS device includes a movable section, a frame, a beam, and an electrode substrate. The frame surrounds a surrounding of the movable section. The beam extends from at least a part of the frame, and is connected to the movable section. The electrode substrate includes a fixed electrode, an extended electrode, and a substrate section. The fixed electrode is formed on the electrode substrate in at least a part of a region facing a swing section. The extended electrode is connected to the fixed electrode, and is formed on the electrode substrate in at least a part of a region facing the shaft.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: January 24, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuo Goda, Takumi Taura, Shinichi Kishimoto, Hideki Ueda, Takeshi Mori
  • Publication number: 20160276751
    Abstract: A surface-layer conductive plate having an opening is disposed on a first surface of a dielectric substrate. A radiation electrode is disposed inside the opening on the first surface of the dielectric substrate. A ground conductive plate is disposed on a second surface of the dielectric substrate, the second surface being opposite to the first surface. Interlayer connection members are disposed so as to surround the opening as seen in a plan view. The interlayer connection members electrically connects the surface-layer conductive plate to the ground conductive plate and defines a cavity that causes electromagnetic resonance to occur. A reactance element is configured to cause an impedance that a side face of the cavity exhibits with respect to an electromagnetic wave propagating in the cavity to include a reactance component.
    Type: Application
    Filed: June 2, 2016
    Publication date: September 22, 2016
    Inventor: Hideki Ueda
  • Publication number: 20160202287
    Abstract: An acceleration sensor includes a CV conversion circuit, an AD conversion circuit, and first and second registers. The CV conversion circuit outputs a voltage corresponding to the capacitance changes between a movable electrode and each of first and second fixed electrodes disposed to face the movable electrode. The AD conversion circuit is connected to the CV conversion circuit and has a first detection range and a second detection range. The first register is connected to the AD conversion circuit and holds a first value. The second register is connected to the AD conversion circuit and holds a second value. The first value contains information about an acceleration in the first detection range, and the second value contains information about an acceleration in the second detection range. The first and second values indicate accelerations in the same direction.
    Type: Application
    Filed: March 18, 2016
    Publication date: July 14, 2016
    Inventors: TAKESHI MORI, KEISUKE KURODA, HITOSHI YOSHIDA, KAZUO GODA, TAKUMI TAURA, HIDEKI UEDA
  • Patent number: D757693
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: May 31, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Michiharu Yokoyama, Hideki Ueda, Ryuken Mizunuma, Masayuki Nakajima
  • Patent number: D830348
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: October 9, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Michiharu Yokoyama, Hideki Ueda, Ryuken Mizunuma, Masayuki Nakajima