Patents by Inventor Hidetoshi Matsumoto

Hidetoshi Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7276744
    Abstract: This invention is intended to provide an HBT capable of achieving, if the HBT is a collector-up HBT, the constriction of the emitter layer disposed directly under an external base layer, and reduction in base-emitter junction capacity, or if the HBT is an emitter-up HBT, reduction in base-collector junction capacity. For the collector-up HBT, window structures around the sidewalls of a collector are used to etch either the emitter layer disposed directly under the external base layer, or an emitter contact layer For the emitter-up HBT, window structures around the sidewalls of an emitter are used to etch either the collector layer disposed directly under the external base layer, or a collector contact layer. In both HBTs, the external base layer is supported by a columnar structure to ensure mechanical strength.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: October 2, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Kenichi Tanaka, Tomonori Tanoue, Hidetoshi Matsumoto, Hiroshi Ohta, Kazuhiro Mochizuki, Hiroyuki Uchiyama
  • Publication number: 20070176687
    Abstract: Disclosed is a power amplifier having highly stable and excellent controllability, and having low noise in comparison with conventional power amplifiers. With the power amplifier, a differential amplifier made up of transistors Q1, Q2 is provided in the initial stage thereof, and baluns doubling as inter-stage matching circuits, comprised of Cp1, Cp2, Lp1, and Ct1, Ct2, Lt1, respectively, are provided between the initial stage, and a second stage while an unbalanced single-ended circuit is provided in the second stage. The differential amplifier has an emitter-coupled type configuration for coupling both emitters with each other, and output control of the amplifier in the initial stage is executed by varying current of a current source coupled to both the emitters.
    Type: Application
    Filed: August 24, 2005
    Publication date: August 2, 2007
    Inventors: Tomonori Tanoue, Masami Ohnishi, Hidetoshi Matsumoto, Akira Kuriyama
  • Patent number: 7248118
    Abstract: A radio frequency power amplifier module that brings sufficient attenuation to a radio frequency signal in a bias supply line connecting a bias control part and a radio frequency power amplifier part without increasing module substrate area is aimed. At least one bonding pad 106 having a capacitance component to a ground and stitch structure inductances 108, 109 composed of a bonding wire 105 provided via the bonding pad are provided in the bias supply line connecting the bias control part and the radio frequency power amplifier part.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: July 24, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Masami Ohnishi, Tomonori Tanoue, Hidetoshi Matsumoto
  • Publication number: 20070046370
    Abstract: In a base-bias-control-type high-frequency power amplifier with a plural stage configuration, a rising voltage of a base bias current supplied to an initial stage transistor is made lower than a rising voltage of a base bias current supplied to a second stage transistor by a bias circuit, and a difference between the both voltages is set to be smaller than a base-emitter voltage of an amplifying stage transistor. Also, a rising voltage of a base bias current supplied to a third stage transistor is made equal to the rising voltage of the base bias current supplied to an initial stage transistor. Accordingly, a technology capable of improving the power control linearity can be provided in a high-frequency power amplifier used in a polar-loop transmitter or the like.
    Type: Application
    Filed: July 20, 2006
    Publication date: March 1, 2007
    Inventors: Hidetoshi Matsumoto, Tomonori Tanoue, Isao Ohbu
  • Publication number: 20060267688
    Abstract: A high frequency power amplifier maintains an excellent linearity regardless of a fluctuation of a load impedance and is downsized. The high frequency power amplifier detects an AC voltage amplitude at an output terminal of a final amplification stage transistor, and suppresses an input signal amplitude of a power amplifier when the voltage amplitude exceeds a predetermined threshold value.
    Type: Application
    Filed: May 9, 2006
    Publication date: November 30, 2006
    Inventors: Tomonori Tanoue, Hidetoshi Matsumoto
  • Publication number: 20060267684
    Abstract: A high-frequency power amplifier comprising: a plurality of power amplifiers arranged in parallel; an inductance element inserted in series in an input signal line of said each power amplifier; an input matching circuit for performing matching of inputs of a parallel connection which connected each series connection of said power amplifier and said inductance element in parallel; an output matching circuit for performing matching of outputs of the parallel connection; and a control unit for controlling said power amplifiers in such a manner that one of said power amplifiers is always brought to an operation condition and the remainder of said power amplifiers are brought to an operation or non-operation condition.
    Type: Application
    Filed: May 25, 2006
    Publication date: November 30, 2006
    Inventors: Masami Ohnishi, Tomonori Tanoue, Hidetoshi Matsumoto
  • Patent number: 7123087
    Abstract: The present invention provides a radio frequency power amplifier which may not introduce radio frequency loss during switching power amplifier units between high and low output power levels. By connecting a first-stage matching network M12 and first-stage matching network M13 to respective output nodes of a power amplifier unit A11 and power amplifier unit A12 that either one operate by switching, connecting the output nodes of the first-stage matching network M12 and M13 in parallel, connecting a last-stage matching network M11 between the junction of M12 and M13 and the output terminal OUT, the first-stage matching networks M12, M13, and last-stage matching network M11 are formed, for both power amplifier units A11 and A12, so that impedance matching is established between the output terminal OUT and the power amplifier unit in operation when one unit is in operation the other is in stop of operation.
    Type: Grant
    Filed: September 21, 2005
    Date of Patent: October 17, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Masami Ohnishi, Hidetoshi Matsumoto, Tomonori Tanoue, Osamu Kagaya, Kenji Sekine
  • Patent number: 7102427
    Abstract: An amplifier using a wide band, high efficiency, and low distortion amplifier free from clipping distortion, and a high efficiency and low distortion radio frequency power amplifier, using that amplifier, which can be applied to wide band wireless communication systems are provided. The amplifier has a DC—DC converter 2, augmented with a low pass filter 4, for amplifying the low frequency components of an input signal from a terminal 5, and a class B amplifier, augmented with a high pass filter, for amplifying the input signal and supplying its high frequency components after amplification. The DC—DC converter and the class B amplifier are connected in parallel, and the power supply voltage of the class B amplifier is controlled with the low frequency components of the input signal.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: September 5, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Hidetoshi Matsumoto, Tomonori Tanoue, Masami Ohnishi
  • Publication number: 20060138458
    Abstract: This invention is intended to provide an HBT capable of achieving, if the HBT is a collector-up HBT, the constriction of the emitter layer disposed directly under an external base layer, and reduction in base-emitter junction capacity, or if the HBT is an emitter-up HBT, reduction in base-collector junction capacity. For the collector-up HBT, window structures around the sidewalls of a collector are used to etch either the emitter layer disposed directly under the external base layer, or an emitter contact layer For the emitter-up HBT, window structures around the sidewalls of an emitter are used to etch either the collector layer disposed directly under the external base layer, or a collector contact layer. In both HBTs, the external base layer is supported by a columnar structure to ensure mechanical strength.
    Type: Application
    Filed: December 27, 2005
    Publication date: June 29, 2006
    Inventors: Kenichi Tanaka, Tomonori Tanoue, Hidetoshi Matsumoto, Hiroshi Ohta, Kazuhiro Mochizuki, Hiroyuki Uchiyama
  • Publication number: 20060081879
    Abstract: The present invention provides a semiconductor device which comprises active components, passive components, wiring lines and electrodes and are satisfactory in terms of mechanical strength, miniaturization and thermal stability. In the semiconductor device, openings are formed just below active components. These openings are filled with conductor layers. Conductor layers are also formed where openings are not formed.
    Type: Application
    Filed: October 12, 2005
    Publication date: April 20, 2006
    Inventors: Kenichi Tanaka, Hidetoshi Matsumoto, Isao Ohbu, Kazuhiro Mochizuki, Tomonori Tanoue, Chisaki Takubo, Hiroyuki Uchiyama
  • Publication number: 20060061417
    Abstract: For use in an amplifier configuration including a high-power amplifier and a low-power amplifier which are always interconnected in terms of high frequencies and between which switching is made using no switches, a highly stable high-frequency power amplifier module with high isolation between the amplifiers is provided. To reduce wrapping around from a low-power amplifier section in an activated state to a high-power amplifier section in a deactivated state or from the high-power amplifier section in an activated state to the low-power amplifier section in a deactivated state, an input matching circuit having high isolation characteristics is included in an input matching circuit portion which does not have much to do with amplifier efficiency. Switching of each of the amplifier sections between an activated state and a deactivated state is effected by control using bias input terminals.
    Type: Application
    Filed: July 18, 2005
    Publication date: March 23, 2006
    Inventors: Masami Ohnishi, Tomonori Tanoue, Hidetoshi Matsumoto
  • Patent number: 7015761
    Abstract: A CDMA system is provided which includes a power amplifier module have a DC current amplifier. The DC and current amplifier detects a DC component of an input signal and amplifies this detected DC component. The power amplifier module also includes an amplifier which receives the current amplified by the DC current amplifier as an input current. The input signal supplied to the DC current amplifier changes in response to an input power level.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: March 21, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Hidetoshi Matsumoto, Tomonori Tanoue, Satoshi Tanaka, Kiichi Yamashita
  • Publication number: 20060012425
    Abstract: The present invention provides a radio frequency power amplifier which may not introduce radio frequency loss during switching power amplifier units between high and low output power levels. By connecting a first-stage matching network M12 and first-stage matching network M13 to respective output nodes of a power amplifier unit A11 and power amplifier unit A12 that either one operate by switching, connecting the output nodes of the first-stage matching network M12 and M13 in parallel, connecting a last-stage matching network M11 between the junction of M12 and M13 and the output terminal OUT, the first-stage matching networks M12, M13, and last-stage matching network M11 are formed, for both power amplifier units A11 and A12, so that impedance matching is established between the output terminal OUT and the power amplifier unit in operation when one unit is in operation the other is in stop of operation.
    Type: Application
    Filed: September 21, 2005
    Publication date: January 19, 2006
    Inventors: Masami Ohnishi, Hidetoshi Matsumoto, Tomonori Tanoue, Osamu Kagaya, Kenji Sekine
  • Patent number: 6949974
    Abstract: The present invention provides a radio frequency power amplifier which may not introduce radio frequency loss during switching power amplifier units between high and low output power levels. By connecting a first-stage matching network M12 and first-stage matching network M13 to respective output nodes of a power amplifier unit A11 and power amplifier unit A12 that either one operate by switching, connecting the output nodes of the first-stage matching network M12 and M13 in parallel, connecting a last-stage matching network M11 between the junction of M12 and M13 and the output terminal OUT, the first-stage matching networks M12, M13, and last-stage matching network M11 are formed, for both power amplifier units A11 and A12, so that impedance matching is established between the output terminal OUT and the power amplifier unit in operation when one unit is in operation the other is in stop of operation.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: September 27, 2005
    Assignee: Renesas Technology Corp.
    Inventors: Masami Ohnishi, Hidetoshi Matsumoto, Tomonori Tanoue, Osamu Kagaya, Kenji Sekine
  • Patent number: 6943624
    Abstract: The present invention provides a radio frequency power amplifier which may not introduce radio frequency loss during switching power amplifier units between high and low output power levels. By connecting a first-stage matching network M12 and first-stage matching network M13 to respective output nodes of a power amplifier unit A11 and power amplifier unit A12 that either one operate by switching, connecting the output nodes of the first-stage matching network M12 and M13 in parallel, connecting a last-stage matching network M11 between the junction of M12 and M13 and the output terminal OUT, the first-stage matching networks M12, M13, and last-stage matching network M11 are formed, for both power amplifier units A11 and A12, so that impedance matching is established between the output terminal OUT and the power amplifier unit in operation when one unit is in operation the other is in stop of operation.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: September 13, 2005
    Assignee: Renesas Technology Corp.
    Inventors: Masami Ohnishi, Hidetoshi Matsumoto, Tomonori Tanoue, Osamu Kagaya, Kenji Sekine
  • Patent number: 6943387
    Abstract: In a semiconductor device using an emitter top heterojunction bipolar transistor having a planar shape in a ring-like shape, a structure is provided in which a base electrode is present only on an inner side of a ring-like emitter-base junction region. This allows reduction of base/collector junction capacitance per unit emitter area, whereby a semiconductor device having high power adding efficiency and high power gain suitable for a power amplifier can be realized. Further, in a multistage power amplifier including first and second amplifier circuits each having one or more of bipolar transistors, a bipolar transistor in the first amplifier circuit uses an emitter having a planar shape in a rectangular shape, and a bipolar transistor in the second amplifier circuit uses an emitter having a ring-like shape and a base electrode only on the inner side of the emitter.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: September 13, 2005
    Assignee: Renesas Technology Corp.
    Inventors: Isao Ohbu, Tomonori Tanoue, Chushiro Kusano, Yasunari Umemoto, Atsushi Kurokawa, Kazuhiro Mochizuki, Masami Ohnishi, Hidetoshi Matsumoto
  • Publication number: 20050176380
    Abstract: An RF circuit module, in which a power amplifier and a transceiver are united, with reduced interference between its electronic circuit blocks, downsized and still having high performance, and with a stable performance not dependent on the ground land structure on the motherboard, is provided. The ground plane 110 for at least a last-stage amplifier 11 of the power amplifier 10 where the greatest power is generated in the whole RF circuit block, that is, the source of generating the greatest noise and heat for the RF circuit block, is isolated from the ground plane for at least one circuit portion of the transceiver 9 including an LNA 51, receiver 52, transmitter 30, and VCO 70. These ground planes are connected to a common ground plane 480 through different connection conductors, respectively.
    Type: Application
    Filed: December 17, 2004
    Publication date: August 11, 2005
    Inventors: Hiroshi Okabe, Hidetoshi Matsumoto
  • Publication number: 20050110573
    Abstract: The present invention provides a radio frequency power amplifier which may not introduce radio frequency loss during switching power amplifier units between high and low output power levels. By connecting a first-stage matching network M12 and first-stage matching network M13 to respective output nodes of a power amplifier unit A11 and power amplifier unit A12 that either one operate by switching, connecting the output nodes of the first-stage matching network M12 and M13 in parallel, connecting a last-stage matching network M11 between the junction of M12 and M13 and the output terminal OUT, the first-stage matching networks M12, M13, and last-stage matching network M11 are formed, for both power amplifier units A11 and A12, so that impedance matching is established between the output terminal OUT and the power amplifier unit in operation when one unit is in operation the other is in stop of operation.
    Type: Application
    Filed: December 29, 2004
    Publication date: May 26, 2005
    Inventors: Masami Ohnishi, Hidetoshi Matsumoto, Tomonori Tanoue, Osamu Kagaya, Kenji Sekine
  • Publication number: 20050088236
    Abstract: A CDMA system is provided which includes a power amplifier module have a DC current amplifier. The DC and current amplifier detects a DC component of an input signal and amplifies this detected DC component. The power amplifier module also includes an amplifier which receives the current amplified by the DC current amplifier as an input current. The input signal supplied to the DC current amplifier changes in response to an input power level.
    Type: Application
    Filed: October 29, 2004
    Publication date: April 28, 2005
    Inventors: Hidetoshi Matsumoto, Tomonori Tanoue, Satoshi Tanaka, Kiichi Yamashita
  • Publication number: 20050046474
    Abstract: An amplifier using a wide band, high efficiency, and low distortion amplifier free from clipping distortion, and a high efficiency and low distortion radio frequency power amplifier, using that amplifier, which can be applied to wide band wireless communication systems are provided. The amplifier has a DC-DC converter 2, augmented with a low pass filter 4, for amplifying the low frequency components of an input signal from a terminal 5, and a class B amplifier, augmented with a high pass filter, for amplifying the input signal and supplying its high frequency components after amplification. The DC-DC converter and the class B amplifier are connected in parallel, and the power supply voltage of the class B amplifier is controlled with the low frequency components of the input signal.
    Type: Application
    Filed: August 20, 2004
    Publication date: March 3, 2005
    Inventors: Hidetoshi Matsumoto, Tomonori Tanoue, Masami Ohnishi