Abstract: Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks.

Abstract: An electrophoretic display device is constituted by a first substrate and a second substrate which are disposed with a spacing therebetween, a partition wall disposed in the spacing, electrophoretic particles sealed in a closed space defined by the first and second substrates and the partition wall, a first electrode disposed at a side surface of the closed space, and a second electrode disposed at a bottom surface of the closed space. In the electrophoretic display device, a distribution state of the electrophoretic particles is changed to effect display, and the first electrode has an area substantially equal to or larger than an area of the second electrode.

Abstract: A multi-contact terminal fitting (T) has a plurality of resilient contact pieces (40) that extend from a rectangular tubular base (25) and can be brought into contact with an outer peripheral surface of a flat plate-shaped tab (11). The resilient contact pieces (40) extending from parts of the base (25) that have relatively high rigidity are narrow and those extending from less rigid parts of the base (25) are wider.

Abstract: An experiment is conducted in advance, for finding a temperature of a cooling plate attained as a result of balancing between a temperature of a substrate after heat treatment and a temperature of the cooling plate at the time of cooling of the substrate. Then, before heat treatment of a first substrate, the cooling plate is moved to a position above a hot plate, the cooling plate is heated to that temperature, and thereafter heat treatment of the substrate is started.

Abstract: Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks.

Abstract: Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks.

Abstract: An experiment is conducted in advance, for finding a temperature of a cooling plate attained as a result of balancing between a temperature of a substrate after heat treatment and a temperature of the cooling plate at the time of cooling of the substrate. Then, before heat treatment of a first substrate, the cooling plate is moved to a position above a hot plate, the cooling plate is heated to that temperature, and thereafter heat treatment of the substrate is started.

Abstract: A heating apparatus 2 comprises a housing 20; a flat heating chamber 4 which is provided in the housing 2 and adapted to heat a wafer W used as a substrate, with one side of the heating chamber 4 opening for carrying in and carrying out the wafer; and a heating plates 44, 45 provided in the heating chamber 4 such that the wafer W can be heated from both above and below. A cooling plate 3 is provided in the housing 20 located in the vicinity of the opening of the heating chamber 4, for cooling the wafer W after being heated by the heating plates 44, 45. Additionally, a carrying means is provided in the housing 20 for carrying the wafer W between an upper position of the cooling plate 3 and the interior of the heating chamber 4 such that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber 4.

Abstract: Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks.

Abstract: An experiment is conducted in advance, for finding a temperature of a cooling plate attained as a result of balancing between a temperature of a substrate after heat treatment and a temperature of the cooling plate at the time of cooling of the substrate. Then, before heat treatment of a first substrate, the cooling plate is moved to a position above a hot plate, the cooling plate is heated to that temperature, and thereafter heat treatment of the substrate is started.

Abstract: When a plurality of objects are subjected to a batch processing by an object selection unit and a batch processing execution unit, if an input is made to an object included in the plurality of objects, an information processing apparatus controls the processing execution unit so as to execute a processing on the object based on the input, thereby executing a processing of moving all of the selected plurality of objects simultaneously with a processing of moving an arbitrary object separately from other objects among the selected plurality of objects.

Abstract: A liquid crystal display device is provided to prevent gas bubbles from being generated due to the contact of an inspection probe. An insulating film composed of a gate insulating film and a protection film is formed on a gate wire and wire inspection terminal, and is partially removed from an upper surface of the wire inspection terminal to form a concave portion exposing the top surface of the wire inspection terminal. A transparent conductive film made of ITO is formed on the insulating film, including the concave portion on the wire inspection terminal. The transparent conductive film is electrically connected with the wire inspection terminal at the concave portion, and formed extending onto the gate insulating film and protection film on the opposite side of a scanning wire of the wire inspection terminal. Disconnection inspection is performed using the extending portion as a contact portion with an inspection probe.

Abstract: An electrophoretic display device is constituted by a first substrate and a second substrate which are disposed with a spacing therebetween, a partition wall disposed in the spacing, electrophoretic particles sealed in a closed space defined by the first and second substrates and the partition wall, a first electrode disposed at a side surface of the closed space, and a second electrode disposed at a bottom surface of the closed space. In the electrophoretic display device, a distribution state of the electrophoretic particles is changed to effect display, and the first electrode has an area substantially equal to or larger than an area of the second electrode.

Abstract: An electrophoretic display device is constituted by a first substrate and a second substrate which are disposed with a spacing therebetween, a partition wall disposed in the spacing, electrophoretic particles sealed in a closed space defined by the first and second substrates and the partition wall, a first electrode disposed a side surface of the closed space, and a second electrode disposed at a bottom surface of the closed space. In the electrophoretic display device, a distribution state of the electrophoretic particles is changed to effect display, and the first electrode has an area substantially equal to or larger than an area of the second electrode.

Abstract: A liquid crystal display device is provided to prevent gas bubbles from being generated due to the contact of an inspection probe. An insulating film composed of a gate insulating film and a protection film is formed on a gate wire and wire inspection terminal, and is partially removed from an upper surface of the wire inspection terminal to form a concave portion exposing the top surface of the wire inspection terminal. A transparent conductive film made of ITO is formed on the insulating film, including the concave portion on the wire inspection terminal. The transparent conductive film is electrically connected with the wire inspection terminal at the concave portion, and formed extending onto the gate insulating film and protection film on the opposite side of a scanning wire of the wire inspection terminal. Disconnection inspection is performed using the extending portion as a contact portion with an inspection probe.

Abstract: An experiment is conducted in advance, for finding a temperature of a cooling plate attained as a result of balancing between a temperature of a substrate after heat treatment and a temperature of the cooling plate at the time of cooling of the substrate. Then, before heat treatment of a first substrate, the cooling plate is moved to a position above a hot plate, the cooling plate is heated to that temperature, and thereafter heat treatment of the substrate is started.

Abstract: A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with a case where antireflection films are formed and a case where any antireflection film is not formed. Film forming unit blocks, namely, a TCT layer, a COT layer and a BCT layer, and developing unit blocks, namely, DEV layers, are stacked up in layers in a processing block. The TCT layer, the COT layer and the BCT layer are used selectively in the case where antireflection films are formed and where no antireflection film is formed. The coating and developing system is controlled by a simple carrying program.

Abstract: A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with either of a case where antireflection films are formed and where any antireflection film is not formed. Film forming unit blocks: TCT layer B3, a COT layer B4 and a BCT layer B5, and developing unit blocks: DEV layers B1 and B2, are stacked up in layers in a processing block S2. The TCT layer B3, the COT layer B4 and the BCT layer B5 are used selectively where antireflection films are formed and any antireflection film is not formed. The coating and developing system is controlled by a carrying program and software.

Abstract: A coating and developing system includes an auxiliary block, a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with either a case where antireflection films are formed or a case where no antireflection film is formed. Film forming unit blocks, namely, a TCT layer, a COT layer and a BCT layer, and developing unit blocks, namely, DEV layers, are stacked up in layers in a processing block S2. The TCT layer, the COT layer and the BCT layer are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a carrying program.

Abstract: A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system is capable of coping with either of a case where antireflection films are formed and a case where any antireflection film is not formed and needs simple software. Film forming unit blocks, namely, a TCT layer B3, a COT layer B4 and a BCT layer B5, and developing unit blocks, namely, DEV layers B1 and B2, are stacked up in layers in a processing block S2. The TCT layer B3, the COT layer B4 and the BCT layer B5 are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a simple carrying program and simple software.