Abstract: A semiconductor module cooler for reducing a pressure loss of a coolant includes a first plate mounted with a first semiconductor module; a jacket disposed under the first plate and having a distribution portion, and first and second through-holes separated from each other to be disposed at end portions of the depression respectively; an inlet-side header disposed to cover the first through-hole from under the jacket; an outlet-side header disposed to cover the second through-hole from under the jacket and extending in parallel to the inlet-side header; and a plurality of cooling fins disposed in the depression and extending from above a distribution portion of the inlet-side header to above a water collection portion of the outlet-side header.

Abstract: In a semiconductor device, an insulated substrate is bonded with a cooling body with lowered thermal resistance without a holding unit. The semiconductor device includes an insulated substrate where a wiring pattern copper plate unit for forming a plurality of wiring patterns is disposed on one side of an insulating plate unit, and a heat radiation copper plate unit disposed on the other side of the insulating plate unit; a semiconductor chip mounted on the wiring pattern copper plate unit; a cooling body contacted with the heat radiation copper plate unit; and a wiring conductor plate connected between the semiconductor chip and the wiring pattern copper plate unit. The heat radiation copper plate unit and the cooling body are bonded with a metal sintered material, and thicknesses of the wiring pattern copper plate unit and the heat radiation copper plate unit are set to such thermal stress is relaxed.

Abstract: A cooler 20 of a semiconductor device includes an inlet portion 27 and an outlet portion 28 for a cooling liquid, an inlet path 24, an outlet path 25, and a cooling flow path 26. The inlet path 24 and the outlet path 25 have asymmetrical planar shapes. A connection portion 271 between the inlet path 24 and the inlet portion 27 is opposed to the cooling flow path 26 of a part immediately below plural circuit substrates 13 arranged on the cooler 20. A connection portion 281 between the outlet path 25 and the outlet portion 28 is opposed to the cooling flow path 26 of a part immediately below plural circuit substrates 13 arranged on the cooler 20.

Abstract: A cooler includes: a jacket having an internal coolant conduction space surrounded by a main cooling surface top plate, an opposite bottom plate, and a side wall; coolant inflow and outflow pipes connected to two through holes in the side wall; a coolant introduction channel forming a part of the coolant conduction space and communicating with the coolant inflow pipe; a coolant discharge channel forming a part of the coolant conduction space and communicating with the coolant outflow pipe; and a fin unit between the coolant introduction and discharge channels. The fin unit includes a plurality of fins having separate main surfaces and thermally connected to the top plate. The fins have first ends acutely angled relative to a direction of flow of coolant in the coolant introduction channel, and second ends acutely angled relative to a direction of flow of coolant in the coolant discharge channel.

Abstract: A semiconductor module including an insulated circuit substrate having a substrate, a circuit layer on a front surface of the substrate, and a metal layer on a back surface of the substrate; a semiconductor element electrically connected to the circuit layer; a cooling unit having a ceiling board bonded to the metal layer, a bottom board opposite the ceiling board, a side wall connecting a periphery of the ceiling board and a periphery of the bottom board, and a fin connecting the ceiling board and bottom board, where thickness of the ceiling board is at least 0.5 mm and at most 2.0 mm and total thickness of the ceiling board and bottom board is at least 3 mm and at most 6 mm; and a solder layer that bonds together the metal layer and the ceiling board by melting at a temperature of at least 200° C. and at most 350° C.

Abstract: A cooler 20 of a semiconductor device includes an inlet portion 27 and an outlet portion 28 for a cooling liquid, an inlet path 24, an outlet path 25, and a cooling flow path 26. The inlet path 24 and the outlet path 25 have asymmetrical planar shapes. A connection portion 271 between the inlet path 24 and the inlet portion 27 is opposed to the cooling flow path 26 of a part immediately below plural circuit substrates 13 arranged on the cooler 20. A connection portion 281 between the outlet path 25 and the outlet portion 28 is opposed to the cooling flow path 26 of a part immediately below plural circuit substrates 13 arranged on the cooler 20.

Abstract: A semiconductor device exhibits low pressure loss and is capable of cooling a plurality of power semiconductor chips evenly. This semiconductor device includes a semiconductor module and a cooler for cooling a power semiconductor element mounted in the semiconductor module. A cooling unit of the cooler has a first header part that has a first bottom surface disposed between a coolant inlet and an end portion of a first substrate on the coolant outlet side and inclined toward a bottom plane of cooling fins so that a coolant supplied from the coolant inlet flows toward the cooling fins; and a second header part that has a second bottom surface inclined from an end portion of the bottom plane of the cooling fins on the coolant outlet side so that the coolant discharged from the cooling fins flows to the coolant outlet.

Abstract: A semiconductor module cooler for reducing a pressure loss of a coolant includes a first plate mounted with a first semiconductor module; a jacket disposed under the first plate and having a distribution portion, and first and second through-holes separated from each other to be disposed at end portions of the depression respectively; an inlet-side header disposed to cover the first through-hole from under the jacket; an outlet-side header disposed to cover the second through-hole from under the jacket and extending in parallel to the inlet-side header; and a plurality of cooling fins disposed in the depression and extending from above a distribution portion of the inlet-side header to above a water collection portion of the outlet-side header.

Abstract: A semiconductor module includes a first semiconductor element, a second semiconductor element, a first heat spreader electrically and thermally connected to the first semiconductor element, a second heat spreader electrically and thermally connected to the second semiconductor element, a DCB substrate including a first metal foil on a top surface of a ceramic insulating substrate and including a second metal foil on a bottom surface, the first metal foil being electrically and thermally joined to the first heat spreader and the second heat spreader, and a cooler thermally connected to the second metal foil of the DCB substrate. The first semiconductor element is disposed on an upstream side, and the second semiconductor element is disposed on a downstream side with respect to a flowing direction of a refrigerant of the cooler. An area of the second heat spreader is greater than an area of the first heat spreader.

Abstract: A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.

Abstract: A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.

Abstract: A semiconductor module includes a first semiconductor element, a second semiconductor element, a first heat spreader electrically and thermally connected to the first semiconductor element, a second heat spreader electrically and thermally connected to the second semiconductor element, a DCB substrate including a first metal foil on a top surface of a ceramic insulating substrate and including a second metal foil on a bottom surface, the first metal foil being electrically and thermally joined to the first heat spreader and the second heat spreader, and a cooler thermally connected to the second metal foil of the DCB substrate. The first semiconductor element is disposed on an upstream side, and the second semiconductor element is disposed on a downstream side with respect to a flowing direction of a refrigerant of the cooler. An area of the second heat spreader is greater than an area of the first heat spreader.

Abstract: A semiconductor module cooler for supplying a refrigerant from exterior into a water jacket and cooling a semiconductor device disposed on an outer surface of the cooler, includes a heat sink thermally connected to the semiconductor device; a first flow path extending from a refrigerant inlet and arranged with a guide portion having an inclined surface for guiding the refrigerant toward one side surface of the heat sink; a second flow path extending toward a refrigerant outlet and formed with a sidewall parallel to the other side surface of the heat sink; a flow velocity adjustment plate disposed in the second flow path and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow path formed at a position communicating the first flow path and the second flow path. The heat sink is disposed in the third flow path.

Abstract: Provided is a semiconductor device comprising a cooler in which, by improving the shape of the connecting portions of an inlet/outlet of a coolant or the like, the pressure loss in the connecting portion or the like can be reduced. A cooler 20 of a semiconductor device 1 includes: an inlet 27 and an outlet 28 provided on side walls 22b1, 22b2 of a case 22 opposing to each other at diagonal positions; an introduction path 24 which is connected to the inlet 27 and formed in the case 22; a discharge path 25 which is connected to the outlet 28 and formed in the case 22; and a cooling flow channel 26 between the introduction path 24 and the discharge path 25. The height of the opening of the inlet 27 is larger than the height of the introduction path 24, and a connecting portion 271 between the inlet 27 and the introduction path 24 includes an inclined surface 271b which is inclined from the bottom surface of the connecting portion 271 toward the longitudinal direction of the introduction path 24.

Abstract: A cooling device for a semiconductor module supplying a coolant from outside into a water jacket and cooling a semiconductor element, includes a heat sink thermally connected to the semiconductor element; a first flow channel extending from a coolant introducing port and including a guide section having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel disposed parallel to the first flow channel and extending toward a coolant discharge port; a flow velocity adjusting plate disposed in the second flow channel and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow channel formed to communicate the first flow channel and the second flow channel. The heat sink is disposed in the third flow channel.

Abstract: A semiconductor module cooler supplies a coolant to a water jacket from outside and cools a semiconductor device arranged on an outer surface of the cooler. The semiconductor module cooler has a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel arranged inside the water jacket in parallel to the first flow channel and extending to a coolant outlet; and a third flow channel formed inside the water jacket at a position connecting the first flow channel and the second flow channel. The coolant inlet and the coolant outlet are formed on a same wall surface of the water jacket, and the heat sink is arranged in the third flow channel.

Abstract: In a semiconductor device, an insulated substrate is bonded with a cooling body with lowered thermal resistance without a holding unit. The semiconductor device includes an insulated substrate where a wiring pattern copper plate unit for forming a plurality of wiring patterns is disposed on one side of an insulating plate unit, and a heat radiation copper plate unit disposed on the other side of the insulating plate unit; a semiconductor chip mounted on the wiring pattern copper plate unit; a cooling body contacted with the heat radiation copper plate unit; and a wiring conductor plate connected between the semiconductor chip and the wiring pattern copper plate unit. The heat radiation copper plate unit and the cooling body are bonded with a metal sintered material, and thicknesses of the wiring pattern copper plate unit and the heat radiation copper plate unit are set to such thermal stress is relaxed.

Abstract: A power semiconductor module includes an insulated wiring board; semiconductor elements mounted on one main surface of the insulated wiring board; a heat radiation board bonded to another main surface of the insulated wiring board; a plurality of fins including a first group of fins each having one end fixed to the another main surface of the heat radiation board and another end with a free end; and a water jacket housing the plurality of fins and allowing coolant to flow among the plurality of fins. The plurality of fins further includes a second group of fins as reinforced fins each having one end fixed to the another main surface of the heat radiation board and another end bonded to the water jacket.

Abstract: A semiconductor module cooler includes a fin which is a heat sink, which is thermally connected to a semiconductor element, and which has one or more notches in an edge at one or more arbitrary positions in a longitudinal direction and one or more convex ribs which are formed on a bottom of a water jacket having a cooling flow path and which fit into the one or more notches at one or more arbitrary positions. By doing so, the efficiency of transferring heat generated by the semiconductor element by a coolant is improved and cooling performance is improved.

Abstract: Provided is a semiconductor device comprising a cooler in which, by improving the shape of the connecting portions of an inlet/outlet of a coolant or the like, the pressure loss in the connecting portion or the like can be reduced. A cooler 20 of a semiconductor device 1 includes: an inlet 27 and an outlet 28 provided on side walls 22b1, 22b2 of a case 22 opposing to each other at diagonal positions; an introduction path 24 which is connected to the inlet 27 and formed in the case 22; a discharge path 25 which is connected to the outlet 28 and formed in the case 22; and a cooling flow channel 26 between the introduction path 24 and the discharge path 25. The height of the opening of the inlet 27 is larger than the height of the introduction path 24, and a connecting portion 271 between the inlet 27 and the introduction path 24 includes an inclined surface 271b which is inclined from the bottom surface of the connecting portion 271 toward the longitudinal direction of the introduction path 24.