Abstract: A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (20). Fins (22) are arranged in each cooling flow path (21c). Semiconductor elements (32) and (33) are arranged over the cooling unit (20) so that the semiconductor elements (32) and (33) are thermally connected to the fins (22). By doing so, a semiconductor module (10) is formed. Heat generated by the semiconductor elements (32) and (33) is conducted to the fins (22) arranged in each cooling flow path (21c) and is removed by a refrigerant which flows along each cooling flow path (21c).

Abstract: A semiconductor device includes an insulating substrate; a semiconductor element mounted on the insulating substrate; and a cooler cooling the semiconductor element. The cooler includes a heat radiating substrate bonded to the insulating substrate; a plurality of fins provided on a surface opposite to a surface bonded with the insulating substrate of the heat radiating substrate; and a case accommodating the fins, and including an inlet and an outlet for a coolant. Upper end portions of side walls of the case include cutaways to arrange end portions of the heat radiating substrate. The heat radiating substrate is liquid-tightly bonded to the case.

Abstract: A semiconductor device exhibits low pressure loss and is capable of cooling a plurality of power semiconductor chips evenly. This semiconductor device includes a semiconductor module and a cooler for cooling a power semiconductor element mounted in the semiconductor module. A cooling unit of the cooler has a first header part that has a first bottom surface disposed between a coolant inlet and an end portion of a first substrate on the coolant outlet side and inclined toward a bottom plane of cooling fins so that a coolant supplied from the coolant inlet flows toward the cooling fins; and a second header part that has a second bottom surface inclined from an end portion of the bottom plane of the cooling fins on the coolant outlet side so that the coolant discharged from the cooling fins flows to the coolant outlet.

Abstract: A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage.

Abstract: A semiconductor module cooler for supplying a refrigerant from exterior into a water jacket and cooling a semiconductor device disposed on an outer surface of the cooler, includes a heat sink thermally connected to the semiconductor device; a first flow path extending from a refrigerant inlet and arranged with a guide portion having an inclined surface for guiding the refrigerant toward one side surface of the heat sink; a second flow path extending toward a refrigerant outlet and formed with a sidewall parallel to the other side surface of the heat sink; a flow velocity adjustment plate disposed in the second flow path and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow path formed at a position communicating the first flow path and the second flow path. The heat sink is disposed in the third flow path.

Abstract: A cooling device for a semiconductor module supplying a coolant from outside into a water jacket and cooling a semiconductor element, includes a heat sink thermally connected to the semiconductor element; a first flow channel extending from a coolant introducing port and including a guide section having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel disposed parallel to the first flow channel and extending toward a coolant discharge port; a flow velocity adjusting plate disposed in the second flow channel and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow channel formed to communicate the first flow channel and the second flow channel. The heat sink is disposed in the third flow channel.

Abstract: A semiconductor module cooler includes a fin which is a heat sink, which is thermally connected to a semiconductor element, and which has one or more notches in an edge at one or more arbitrary positions in a longitudinal direction and one or more convex ribs which are formed on a bottom of a water jacket having a cooling flow path and which fit into the one or more notches at one or more arbitrary positions. By doing so, the efficiency of transferring heat generated by the semiconductor element by a coolant is improved and cooling performance is improved.

Abstract: A semiconductor module cooler supplies a coolant to a water jacket from outside and cools a semiconductor device arranged on an outer surface of the cooler. The semiconductor module cooler has a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel arranged inside the water jacket in parallel to the first flow channel and extending to a coolant outlet; and a third flow channel formed inside the water jacket at a position connecting the first flow channel and the second flow channel. The coolant inlet and the coolant outlet are formed on a same wall surface of the water jacket, and the heat sink is arranged in the third flow channel.

Abstract: A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage.

Abstract: A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (20). Fins (22) are arranged in each cooling flow path (21c). Semiconductor elements (32) and (33) are arranged over the cooling unit (20) so that the semiconductor elements (32) and (33) are thermally connected to the fins (22). By doing so, a semiconductor module (10) is formed. Heat generated by the semiconductor elements (32) and (33) is conducted to the fins (22) arranged in each cooling flow path (21c) and is removed by a refrigerant which flows along each cooling flow path (21c).

Abstract: When the ratio of a guest material to a host material is extremely small, it is difficult to maintain, with good accuracy, the ratio of the guest material to be vapor-deposited on the work surface and the distribution state of the guest material. The vacuum vapor deposition apparatus and method includes providing a shielding member, positioned between a first vapor deposition source and a substrate to be coated so that the vapor deposition amount of the guest material on the substrate surface is significantly less than the vapor deposition amount of the host material. A shielding member drive mechanism rotates the shielding member about a first axis while rotating the shielding member about a second axis, which is spaced from and parallel to the first axis.

Abstract: An organic light emitting device of high quality is disclosed that can be produced by a simple method and rarely causes color degradation due to current in the device. In one embodiment, the organic light emitting device comprises a substrate, a lower electrode disposed over the substrate, an organic light emitting layer disposed over the lower electrode and in electrical contact with the lower electrode, and an upper electrode disposed over the organic light emitting layer and in electrical contact with the organic light emitting layer. The upper electrode includes a first upper electrode element, a color conversion layer disposed on the first upper electrode element, and a second upper electrode element disposed on the color conversion layer and in electrical contact with the first upper electrode element.