Abstract: A high-frequency module that includes: a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component including a PA controller which controls the power amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.

Abstract: A module includes a substrate and a first metal member. The substrate has an upper main surface and a lower main surface arranged in an up-down direction. The first metal member includes a first plate-shaped portion provided on the upper main surface of the substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The first metal member further includes a first left support portion. A boundary between the first plate-shaped portion and the first left support portion is defined as a first left boundary. The first left support portion bends with respect to the first plate-shaped portion at the first left boundary so as to be located behind the first plate-shaped portion.

Abstract: A radio frequency module includes a module substrate, a first component disposed on a principal surface side of the module substrate, a metal shield wall disposed on an upper surface of the first component and set to ground potential, a resin member covering the principal surface of the module substrate, the upper surface and a side surface of the first component, and a side surface of the metal shield wall, and a metal shield layer set to the ground potential and covering an upper surface of the resin member. An upper end of the metal shield wall is in contact with the metal shield layer. The first component includes a first terminal and a second terminal both connected to the module substrate. When the principal surface is viewed in plan, the metal shield wall is disposed between the first terminal and the second terminal.

Abstract: A radio frequency module includes a module substrate having a first principal surface and a second principal surface, a resin member covering the first principal surface and side surfaces of first and second components disposed on the first principal surface, a metal shield layer covering an upper surface of the resin member, a metal shield wall disposed on the first principal surface, a metal member disposed on the second principal surface, and a via conductor penetrating the module substrate. The metal shield wall is disposed between the first component and the second component when the first principal surface is viewed in plan. An upper end of the metal shield wall is connected to the metal shield layer. The via conductor electrically connects the metal shield wall and the metal member, and at least partially overlaps each of the metal shield wall and the metal member when viewed in plan.

Abstract: A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; and a metal shield plate disposed over the major face and set to a ground potential. The metal shield plate includes a shield part extending in a direction perpendicular to the major face, and a joint part parallel to the major face and spaced apart from the major face, the joint part extending from the shield part. A top face of at least one of the first circuit component and the second circuit component is connected with the joint part by a bonding wire. With the module substrate seen in plan view, the metal shield plate is disposed between the first circuit component and the second circuit component.

Abstract: A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.

Abstract: A module includes: a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member provided on the upper main surface of the substrate, the metal member having a plate-shaped portion including a front main surface and a back main surface arranged in a front-back direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and a sealing resin layer provided on the upper main surface of the substrate and covering the first electronic component, the second electronic component, and the metal member. The metal member includes an upper protruding portion extending on one side of the front-back direction from an upper end of the plate-shaped portion.

Abstract: A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.

Abstract: A high-frequency module includes a module substrate having a main surface, circuit components arranged on the main surface, a resin member covering at least a part of the main surface and the circuit components, a metallic shield layer covering at least an upper surface of the resin member, and a metallic shield plate arranged on the main surface and between the circuit component and the circuit component when the main surface is viewed in a plan view. The metallic shield plate is in contact with the metallic shield layer. An engraved mark portion indicating predetermined information is provided on the upper surface of the resin member.

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The metal member further includes one or more foot portions extending forward or backward from the lower side.

Abstract: A radio-frequency module includes a first inductor and a second inductor disposed on or above a major surface of a module substrate, a resin member, a metal shield layer covering a surface of the resin member, and a metal shield plate disposed on the major surface between the first inductor and the second inductor. The metal shield plate is in contact with a ground electrode of the major surface and the metal shield layer. The first inductor is disposed in any one of a transmitting path, a receiving path, and a transmitting and receiving path. The second inductor is disposed in any one of the transmitting path, the receiving path, and the transmitting and receiving path, other than the path in which the first inductor is disposed.

Abstract: A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.

Abstract: A substrate has an upper main surface and a lower main surface arranged in an up-down direction. The metal member is provided on the upper main surface of the substrate. The metal member includes a plate-shaped portion and one or more foot portions. The plate-shaped portion has a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction. The one or more foot portions extend backward from the lower side by bending the metal member at the lower side of the plate-shaped portion. A line extending in a predetermined direction is provided on the front main surface, the back main surface, the outer surface of the portion where the metal member is bent, and the inner surface of the portion where the metal member is bent.

Abstract: A metal member includes a plate-shaped portion extending upward from an upper main surface of a substrate, and has a front main surface and a back main surface arranged in the front-back direction when viewed in the up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side.

Abstract: A radio frequency module includes: a module substrate having a main surface; a conductive member to partition the main surface into regions in a plan view of the main surface, and being set to ground electric potential; a switch disposed in one of the regions and connected to an antenna connection terminal; a power amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch; and a low-noise amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch.

Abstract: A radio-frequency module includes a switch; power amplifiers; a transmission filter that has a passband including a transmission band of a communication band A included in a communication band group X and that has one end connected to an antenna connection terminal via the switch and the other end connected to an output of the power amplifier; a transmission filter that has a passband including a transmission band of a communication band C included in a communication band group Y lower than the communication band group X and that has one end connected to the antenna connection terminal via the switch and the other end connected to an output of the power amplifier; and a module substrate. In a plan view of the module substrate, a distance between the power amplifier and the switch is shorter than a distance between the power amplifier and the switch.

Abstract: A radio-frequency module includes: a module substrate having major faces; a first circuit component disposed over the major face; a second circuit component disposed over the major face: external connection terminals disposed over the major face; and a metal shield plate extending perpendicularly from the major face and set to a ground potential. The external connection terminals include a first external connection terminal and a second external connection terminal, the first external connection terminal being an external connection terminal through which a first radio-frequency signal is inputted or outputted, the second external connection terminal being an external connection terminal through which one of a power supply signal, a control signal, and a second radio-frequency signal is inputted or outputted. The metal shield plate has a recess in an end portion.

Abstract: A radio-frequency module includes a power amplifier, a power amplifier, a low noise amplifier, a duplexer that has a passband including a communication band A included in a communication band group X and that is connected to the power amplifier and the low noise amplifier, a duplexer that has a passband including a communication band C included in a communication band group Y lower than the communication band group X and that is connected to the power amplifier, and a module substrate having the power amplifier, the power amplifier, the low noise amplifier, and the duplexers arranged thereon. In a plan view of the module substrate, a distance between the power amplifier and the low noise amplifier is longer than a distance between the power amplifier and the low noise amplifier.

Abstract: A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.

Abstract: A high-frequency circuit includes: a diplexer that is composed of a filter which has a pass band including a first frequency band group and a filter which has a pass band including a second frequency band group; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a first communication band; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a second communication band; and switches that are connected with the notch filters. A band pass filter whose pass band is the first communication band and a band pass filter whose pass band is the second communication band are not connected between the filter and the switches.