Abstract: A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by conductor patterns. The area where inductor is located is not superposed with the area where the second ground conductor is located, when the one main surface or the other main surface of the multilayer circuit substrate is viewed in plan, the second ground conductor being closer to the layer where the inductor is located than the first ground conductor is.

Abstract: In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode is mainly transmitted along an edge of the ground electrode and the transmission signal that has leaked into the ground electrode flows into a plurality of via conductors arranged with end surfaces superposed with the edge of the ground electrode when viewed in plan. Therefore, a transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along the edge of the ground electrode toward the reception electrode side. As a result, isolation characteristics of the transmission electrode and the reception electrode from each other are improved.

Abstract: A via conductor connected to a mounting electrode near a corner portion of a circuit substrate is provided in a position in a corresponding mounting electrode, located closer to the center of the circuit substrate. Thus, concentration of a stress in a portion of the via conductor is effectively reduced, and a break, a chip, or a crack is prevented from occurring to the circuit substrate. Even if the portion located closer to the corner portion of the mounting electrode is peeled from the circuit substrate, the electrical characteristics of the circuit module are secured because disconnection between the corresponding mounting electrode and the via conductor is prevented.

Abstract: In a duplexer, a common terminal is arranged in a central region of a back surface of a main body of the duplexer, a transmission terminal and a reception terminal are arranged on a virtual line that is parallel or substantially parallel with one side of the back surface of the main body and that passes through the common terminal such that the common terminal is sandwiched between the transmission terminal and the common terminal. By arranging a plurality of the duplexers such that the transmission terminals are aligned and the reception terminals are aligned, the common terminals, the transmission terminals, and the reception terminals provided on the respective duplexers are not spaced apart from one another.

Abstract: In a high frequency module, mounting lands for reception signal output side ports of SAW duplexers, respectively, on a top surface of a multilayer body are arranged so as to be superposed on reception side external connection lands on a bottom surface of the multilayer body along the layer direction and the mounting lands are directly connected to the reception side external connection lands via holes. Transmission side external connection lands are located on the bottom surface of the multilayer body. The transmission side external connection lands are connected to mounting lands for transmission signal input side ports on the top surface of the multilayer body via certain inner layer electrodes that do not come close to the via holes of the reception system and the via holes.

Abstract: A high-frequency switch module includes a first diplexer arranged to receive a GPS signal and to send/receive a GSM 1800 communication signal and a GSM 1900 communication signal, and a switch element arranged to switch between the sending/receiving of the GSM 1800 and the sending/receiving of the GSM 1900 communication signal. A SAW filter having a passage band corresponding to the frequency band of the GSM 1900 communication signal and a SAW filter having a passage band corresponding to the frequency band of the GSM 1800 communication signal are connected to the switch element. A line length of a transmission line for connection to the SAW filter which provides a reflection phase closer to the open side for the GPS signal as viewed from the switch element is greater than that of a transmission line for connection to the other SAW filter.

Abstract: A laminated electronic component includes a laminate having first and second major surfaces. Four predetermined indication locations are provided on the first major surface. One or more via-hole conductors are arranged at corresponding one or more of the indication locations. The locations and the number of indicating via-hole conductors allows for identification of information regarding the laminated electronic component. Each indicating via-hole conductor is exposed at the first major surface, does not reach the second major surface, and is electrically isolated from wiring conductors built into the laminate.

Abstract: A laminated electronic component includes a laminate having first and second major surfaces. Four predetermined indication locations are provided on the first major surface. One or more via-hole conductors are arranged at corresponding one or more of the indication locations. The locations and the number of indicating via-hole conductors allows for identification of information regarding the laminated electronic component. Each indicating via-hole conductor is exposed at the first major surface, does not reach the second major surface, and is electrically isolated from wiring conductors built into the laminate.