Abstract: A high-frequency module includes a wiring board, a first duplexer that separates a transmission signal and a reception signal in a first frequency band, and a second duplexer that separates a transmission signal and a reception signal in a second frequency band whose reception-side frequency band partially overlaps with a frequency band of a third-order harmonic of the first transmission signal. The first duplexer is disposed near a predetermined side on a first main surface of the wiring board, and the second duplexer is disposed near an opposite side opposing the predetermined side. An extended line extending from a first transmission terminal of the first duplexer and an extended line extending from a second reception terminal of the second duplexer are spaced away from each other.

Abstract: A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate.

Abstract: A high-frequency front end circuit includes a duplexer, a phase adjustment circuit, and a power amplifier. The phase adjustment circuit is connected between the power amplifier and a transmission filter of the duplexer. The phase adjustment circuit carries out phase adjustment so that a quadrant in which an impedance ZRX (fr0) seen from the transmission filter toward the power amplifier at the fundamental frequency of a reception signal is present and a quadrant in which an impedance ZTX (fr0) seen from the power amplifier toward the transmission filter at the fundamental frequency of the reception signal is present are not in a conjugate relationship with respect to the phase.

Abstract: A radio frequency front-end circuit includes a duplexer, a phase adjustment circuit, and a low noise amplifier. The phase adjustment circuit is connected between an Rx filter of the duplexer and the low noise amplifier. The phase adjustment circuit executes phase adjustment such that a quadrant in which an impedance ZLNA(fn) at a particular frequency different from a fundamental frequency of a reception signal when looking at the low noise amplifier side from the Rx filter is present and a quadrant in which an impedance ZRX(fn) at the particular frequency when looking at the Rx filter side from the low noise amplifier is present are not in a conjugate relation in terms of phase.

Abstract: A high-frequency module includes a multilayer substrate, a switch IC, a SAW duplexer and a matching circuit. The matching circuit includes a wiring line and first and second inner layer ground electrodes. The matching circuit performs impedance matching between the switch IC and the SAW duplexer in a pass band of the SAW duplexer. The wiring line is an inner layer electrode of the multilayer substrate that is connected between the switch IC and the SAW duplexer. The first and second inner layer ground electrodes face the wiring line in a stacking direction with only dielectric layers of the multilayer substrate therebetween.

Abstract: A multilayer wiring board including a multilayer body including a plurality of insulating layers includes a ground electrode for external connection disposed in a center of a lower surface of the multilayer body, a plurality of individual electrodes at an outer edge of the lower surface of the multilayer body, and a surface insulating film including an interelectrode insulating portion and a surface covering portion, the interelectrode insulating portion covering an edge portion of the ground electrode to provide insulation between the ground electrode and each of the individual electrodes, the surface covering portion being disposed on a surface of a main body of the ground electrode to divide the surface of the main body into a plurality of regions.

Abstract: In a high frequency module, mounting lands for reception signal output side ports of SAW duplexers, respectively, on a top surface of a multilayer body are arranged so as to be superposed on reception side external connection lands on a bottom surface of the multilayer body along the layer direction and the mounting lands are directly connected to the reception side external connection lands via holes. Transmission side external connection lands are located on the bottom surface of the multilayer body. The transmission side external connection lands are connected to mounting lands for transmission signal input side ports on the top surface of the multilayer body via certain inner layer electrodes that do not come close to the via holes of the reception system and the via holes.

Abstract: A method reduces an area of a mounting electrode provided on a first surface of a multilayer body and connected to a specific component is reduced and decreases a pitch between mounting electrodes. A plating film is formed on the mounting electrodes with the reduced area. The mounting electrodes for connection to specific components are defined by first end surfaces of first via conductors, and hence, the areas of the mounting electrodes are significantly reduced, and the pitch between the mounting electrodes is significantly decreased. Also, the mounting electrodes defined by the first end surfaces of the first via conductors are connected to plane electrodes at end surfaces of second via conductors exposed from a surface of the multilayer body with internal wiring electrodes interposed therebetween. Thus, a plating film is able to be reliably provided on the mounting electrodes.

Abstract: A high frequency module includes a ground mounting electrode connected to a ground terminal of a component, a first ground in-plane conductor in a multilayer substrate on a portion under the component and connected to the ground mounting electrode with a first ground interlayer connecting conductor, a signal mounting electrode connected to a signal terminal of the component, and a signal in-plane conductor provided in the multilayer substrate on a portion under the first ground in-plane conductor and connected to the specific signal mounting electrode with a signal interlayer connecting conductor. The first ground in-plane conductor is between the component and the signal in-plane conductor, and the signal interlayer connecting conductor is on an outer side portion of the first ground in-plane conductor when seen from above.

Abstract: A multilayered high frequency module includes inductor conductor patterns each defined by a linear conductor having a coiled shape on intermediate insulator layers of a multilayer body. A first spiral inductor with its axis extending in the stacking direction is defined by the inductor conductor patterns on respective layers connected through conductive via holes. Overlapped portions of inner regions of the individual inductor conductor patterns within the coiled shape define an air core portion of the first inductor. A capacitor conductor pattern is provided on one layer lower than the insulator layers on which the inductor conductor patterns are provided. The capacitor conductor pattern is a flat plate and located at a position not overlapping with the air core portion when looking at the multilayer body in a plan view.

Abstract: A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by conductor patterns. The area where inductor is located is not superposed with the area where the second ground conductor is located, when the one main surface or the other main surface of the multilayer circuit substrate is viewed in plan, the second ground conductor being closer to the layer where the inductor is located than the first ground conductor is.

Abstract: A multilayer wiring board including a multilayer body including a plurality of insulating layers includes a ground electrode for external connection disposed in a center of a lower surface of the multilayer body, a plurality of individual electrodes at an outer edge of the lower surface of the multilayer body, and a surface insulating film including an interelectrode insulating portion and a surface covering portion, the interelectrode insulating portion covering an edge portion of the ground electrode to provide insulation between the ground electrode and each of the individual electrodes, the surface covering portion being disposed on a surface of a main body of the ground electrode to divide the surface of the main body into a plurality of regions.

Abstract: A high frequency module includes a ground mounting electrode connected to a ground terminal of a component, a first ground in-plane conductor in a multilayer substrate on a portion under the component and connected to the ground mounting electrode with a first ground interlayer connecting conductor, a signal mounting electrode connected to a signal terminal of the component, and a signal in-plane conductor provided in the multilayer substrate on a portion under the first ground in-plane conductor and connected to the specific signal mounting electrode with a signal interlayer connecting conductor. The first ground in-plane conductor is between the component and the signal in-plane conductor, and the signal interlayer connecting conductor is on an outer side portion of the first ground in-plane conductor when seen from above.

Abstract: A composite module includes outer ground electrodes on one main surface of a wiring substrate, a wiring electrode inside the wiring substrate, and a first ground electrode between the wiring electrode and the outer ground electrode. A cutout is provided in the first ground electrode at least at a portion of a region overlapping with the wiring electrode and the outer ground electrode when viewed from above, and the wiring electrode overlaps with at least one of the first ground electrode and the outer ground electrode when viewed from above to reduce stray capacitance produced on the wiring electrode and to adjust impedance of the wiring electrode while preventing signals leaked from the exterior from interfering with the wiring electrode.

Abstract: A multilayered high frequency module includes inductor conductor patterns each defined by a linear conductor having a coiled shape on intermediate insulator layers of a multilayer body. A first spiral inductor with its axis extending in the stacking direction is defined by the inductor conductor patterns on respective layers connected through conductive via holes. Overlapped portions of inner regions of the individual inductor conductor patterns within the coiled shape define an air core portion of the first inductor. A capacitor conductor pattern is provided on one layer lower than the insulator layers on which the inductor conductor patterns are provided. The capacitor conductor pattern is a flat plate and located at a position not overlapping with the air core portion when looking at the multilayer body in a plan view.

Abstract: In a duplexer, a common terminal is arranged in a central region of a back surface of a main body of the duplexer, a transmission terminal and a reception terminal are arranged on a virtual line that is parallel or substantially parallel with one side of the back surface of the main body and that passes through the common terminal such that the common terminal is sandwiched between the transmission terminal and the common terminal. By arranging a plurality of the duplexers such that the transmission terminals are aligned and the reception terminals are aligned, the common terminals, the transmission terminals, and the reception terminals provided on the respective duplexers are not spaced apart from one another.

Abstract: A module includes a multilayer body including laminated ceramic green sheets that have been fired, multiple mounting terminals arranged to mount a component thereon, the mounting terminals each including an end surface that is exposed at a main surface of the multilayer body, and multiple via conductors disposed inside the multilayer body so as to correspond to the mounting terminals at positions overlapped by the corresponding mounting terminals when viewed in a plan view. The lengths of the via conductors are adjusted so that predetermined points on the mounting terminals are positioned on the same plane.

Abstract: A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate.

Abstract: A high-frequency switch module includes a first diplexer arranged to receive a GPS signal and to send/receive a GSM 1800 communication signal and a GSM 1900 communication signal, and a switch element arranged to switch between the sending/receiving of the GSM 1800 and the sending/receiving of the GSM 1900 communication signal. A SAW filter having a passage band corresponding to the frequency band of the GSM 1900 communication signal and a SAW filter having a passage band corresponding to the frequency band of the GSM 1800 communication signal are connected to the switch element. A line length of a transmission line for connection to the SAW filter which provides a reflection phase closer to the open side for the GPS signal as viewed from the switch element is greater than that of a transmission line for connection to the other SAW filter.

Abstract: A high-frequency module includes a multilayer substrate, a switch IC, a SAW duplexer and a matching circuit. The matching circuit includes a wiring line and first and second inner layer ground electrodes. The matching circuit performs impedance matching between the switch IC and the SAW duplexer in a pass band of the SAW duplexer. The wiring line is an inner layer electrode of the multilayer substrate that is connected between the switch IC and the SAW duplexer. The first and second inner layer ground electrodes face the wiring line in a stacking direction with only dielectric layers of the multilayer substrate therebetween.