Abstract: An elastic pressure sheet that is good in durability against liquid crystals and the like and is good in slipperiness and a process of manufacturing a liquid crystal display plate using the same are disclosed. The elastic pressure sheet comprises an elastic layer having elastic restoring force; hot-melt adhesive layers formed on the both surfaces of the elastic layer; a barrier layer formed on the outer surface of each of the adhesive layers and capable of preventing bleeding of the hot-melt adhesive layer; and a porous layer comprising ultrahigh molecular weight polyethylene, formed on the outer surface of each of the barrier layers.

Abstract: A method of producing a porous sheet, which comprises the steps consisting of preparing a dispersion having ultra-high-molecular-weight polyethylene particles dispersed in a solvent, applying the dispersion onto a film to form a coating layer thereon, sintering the coating layer, and removing the solvent contained in the coating layer.

Abstract: Compositions for forming silica-based coatings are provided that can form lower refractive-index layers of protective films on lenses of solid image-pickup devices or on optical members such as light guides. The compositions comprise a siloxane polymer and an alkyl quaternary amine. Such siloxane polymers are preferably utilized as hydrolysis products and/or partial condensates of at least one silane compound expressed by the formula (1) below: RnSiX4-n ??(1) in which each R represents independently a hydrogen atom or a monovalent organic group, X represents a hydrolyzable group, n is an integer of 0 to 2, and plural Rs may be identical or different from each other.

Abstract: A pressure sensitive adhesive composition comprising a copolymer and an isocyanate compound, without a substantial amount of a halogen compound, the copolymer being prepared by copolymerizing radical-polymerizable monomers essentially containing a radical-polymerizable monomer with a carboxyl group, using at least one chain transfer agent selected from a group consisting of ?-pinene, limonene, and terpinolene, in the presence of at least one organic solvent selected from a group consisting of ethyl acetate, acetone, methyl ethyl ketone, and methyl isobutyl ketone, but in the absence of toluene, is disclosed.

Abstract: The present invention provides a runflat tire having an effectively improved runflat durability while continuously running under a runflat condition due to a low tire pressure or puncture, without sacrificing other characteristics such as riding comfort during an ordinal driving at normal internal pressure. A runflat tire 1 according to the first aspect comprises a belt 8 consisting of at least one rubber-coated cord layer laid between a crown portion of a carcass 7 and a tread portion 5, the carcass consisting of at least one ply toroidally extending bead portions 3, sidewall portions 4 and the tread portion; a reinforcing rubber 11 which has a generally crescent sectional shape and is arranged at the interior surface side at least of sidewall portions 4; and a ring-shaped rim guard portion 13 protruding outwardly in the tire's width direction arranged at the exterior surface position of the tire immediately above a rim flange Rf.

Abstract: For suppressing decomposition of an organic group (for example, a CH3 group) which is bonded to an Si atom of an organic SOG film for use in a flattening process at the time of an ashing process, there is provided a method comprising the steps of: forming an organic SOG layer directly on a lower wiring layer or on a predetermined film including a hillock protection layer which is formed on the lower wiring layer in advance; forming an upper wiring layer on the organic SOG layer without using an etching back process; forming a via hole through an etching process by using a patterned resist layer provided on the upper wiring layer as a mask; performing an ashing process with a plasma by making ions or radicals which are induced from oxygen gas as a main reactant, under an atmospheric pressure ranging from 0.01 Torr to 30.0 Torr; and filling said via hole with a conductive material so as to electrically connect the lower wiring layer to the upper wiring layer.

Abstract: A pressure sensitive adhesive composition comprising a copolymer and an isocyanate compound, without a substantial amount of a halogen compound, the copolymer being prepared by copolymerizing radical-polymerizable monomers essentially containing a radical-polymerizable monomer with a carboxyl group, using at least one chain transfer agent selected from a group consisting of ?-pinene, limonene, and terpinolene, in the presence of at least one organic solvent selected from a group consisting of ethyl acetate, acetone, methyl ethyl ketone, and methyl isobutyl ketone, but in the absence of toluene, is disclosed.

Abstract: There is provided a measurement system for measuring a refinement rate of a competitive system, the system includes: input part for inputting competition data of the competitive system, said competition data, obtained by users between a beginning and end of the competition, including transition in information amount necessary to know a conclusion of the competition; first calculating part for obtaining an average completion time length D and an average degree of freedom B of the user and from said inputted competition data; and second calculating part for calculating a refinement rate S based on said obtained B and D.

Abstract: An evaluation system for evaluating ability is provided. The system includes: a) storing part for storing a plurality of problem groups, which are rated as a plurality of ranks based on difficulty levels, with associated right answers therein; b) first presenting part for presenting two or more problems of the plurality of problem groups, which are rated as a first rank, in the storing part to a user; and c) determination part for receiving answers to said two or more problems presented, to determine whether or not said received answers are correct with reference to the right answers in the storing part, and to obtain a correct answer rate based on the determination result.

Abstract: An elastic pressure sheet that is good in durability against liquid crystals and the like and is good in slipperiness and a process of manufacturing a liquid crystal display plate using the same are disclosed. The elastic pressure sheet comprises an elastic layer having elastic restoring force; hot-melt adhesive layers formed on the both surfaces of the elastic layer; a barrier layer formed on the outer surface of each of the adhesive layers and capable of preventing bleeding of the hot-melt adhesive layer; and a porous layer comprising ultrahigh molecular weight polyethylene, formed on the outer surface of each of the barrier layers.

Abstract: For suppressing decomposition of an organic group (for example, a CH3 group) which is bonded to an Si atom of an organic SOG film for use in a flattening process at the time of an ashing process, there is provided a method comprising the steps of: forming an organic SOG layer directly on a lower wiring layer or on a predetermined film including a hillock protection layer which is formed on the lower wiring layer in advance; forming an upper wiring layer on the organic SOG layer without using an etching back process; forming a via hole through an etching process by using a patterned resist layer provided on the upper wiring layer as a mask; performing an ashing process with a plasma by making ions or radicals which are induced from oxygen gas as a main reactant, under an atmospheric pressure ranging from 0.01 Torr to 30.0 Torr; and filling said via hole with a conductive material so as to electrically connect the lower wiring layer to the upper wiring layer.

Abstract: A sliding member comprising a slidable substrate and a pressure-sensitive adhesive layer provided on one side thereof, wherein the slidable substrate is a porous form comprising a plastic, and a barrier layer is provided between the slidable substrate and the pressure-sensitive adhesive layer. The sliding member has good sliding property and even when a load is applied thereto over a long period of time, can suppress exudation of the pressure-sensitive adhesive.

Abstract: In each embodiment of this invention, a pairing apparatus has a random pairing module which generates pairings from the first to (r1)-th rounds by the random system, and a modified Swiss pairing module which generates pairings from the (r1+1)-th to r-th rounds by the modified Swiss system. When first several matches are paired by the random system, win points are distributed to respective participating teams in accordance with their merits. For this reason, by subsequent pairings of the modified Swiss system, participating teams can be successively paired within a close merit range. Hence, the total win points (ranks) can reflect the merits. For this reason, the reverse phenomenon of merits and ranks can be suppressed without using the round-robin system.

Abstract: A method for processing a coating film includes the steps of forming a silica group coating film having a low dielectric constant on a substrate, conducting an etching process to the silica group coating film through a photoresist pattern, and processing the silica group coating film with plasma induced from helium gas. With this, it is possible to prevent the silica group coating film from being damaged when a wet stripping process is conducted to remove the photoresist pattern as a subsequent process, and to maintain the low dielectric constant of the coating film.

Abstract: For suppressing decomposition of an organic group (for example, a CH3 group) which is bonded to an Si atom of an organic SOG film for use in a flattening process at the time of an ashing process, there is provided a method comprising the steps of: forming an organic SOG layer directly on a lower wiring layer or on a predetermined film including a hillock protection layer which is formed on the lower wiring layer in advance; forming an upper wiring layer on the organic SOG layer without using an etching back process; forming a via hole through an etching process by using a patterned resist layer provided on the upper wiring layer as a mask; performing an ashing process with a plasma by making ions or radicals which are induced from oxygen gas as a main reactant, under an atmospheric pressure ranging from 0.01 Torr to 30.0 Torr; and filling said via hole with a conductive material so as to electrically connect the lower wiring layer to the upper wiring layer.

Abstract: A system is provided for providing an war game which is configured to dynamically change a range of location information of pieces which is to be transmitted to enemy players, depending on game situation to increase uncertainty of the game about win-or-lose. The system comprises transmitting part for transmitting location information of the opponent player's group of pieces to each of players, wherein said transmitting part comprises changing part for changing dynamically, on receiving move information, to be transmitted to each of players, a range of the location information of the opponent player's group based on the move of said move information and/or said location information of the two or more groups which are updated based upon move information.

Abstract: A damper which is adhered to the head suspension of a disc drive, which comprises a constraint layer/viscoelastic layer laminate, wherein the viscoelastic layer is temporarily provided with a release sheet that is removed on use so that the damper may be adhered to the head suspension, the side of the release sheet in contact with the viscoelastic layer having been treated with a non-silicone releasing agent, preferably a long-chain alkyl type or fluoroacrylate type releasing agent. No silicone is transferred to the viscoelastic layer so that silicone gas generation causing destruction of the memory layer of a disc can be prevented.

Abstract: For suppressing decomposition of organic group (for example, CH3 group) during ashing process, which is bonded to Si atom of an organic SOG film or layer for use in flattening process, a method comprises following steps: forming an organic SOG layer directly or through a predetermined film including a hillock protection layer on said lower wiring layer; forming said upper wiring layer on said organic SOG layer without processing of etching back; forming a via hole through an etching process by using a patterned resist layer provided on said upper wiring layer as a mask; performing ashing process with a plasma by making ion or radical which is induced from oxygen gas as a main reactant, under an atmosphere of pressure ranging from 0.01 Torr to 30.0 Torr; and burying said via hole with conductive material so as to electrically connect between said lower wiring layer and said upper wiring layer.

Abstract: A damper continuous feeding body having a plurality of punched out dampers, each of which is constituted by a viscoelastic body and a restraint body which are laminated on each other, wherein surfaces of the viscoelastic bodies are pasted on a release surface of a continuous liner so that the plurality of dampers are arranged at a predetermined pitch. The damper continuous feeding body allows dampers to be pasted by an automatic machine so as to improve the accuracy of the pasted positions of the dampers and to enhance the efficiency in pasting, and further whereby the dampers can be prevented from being exposed to contamination.

Abstract: For suppressing decomposition of organic group (for example, CH3 group) during ashing process, which is bonded to Si atom of an organic SOG film or layer for use in flattening process, a method comprises following steps: forming an organic SOG layer directly or through a predetermined film including a hillock protection layer on said lower wiring layer; forming said upper wiring layer on said organic SOG layer without processing of etching back; forming a via hole through an etching process by using a patterned resist layer provided on said upper wiring layer as a mask; performing ashing process with a plasma by making ion or radical which is induced from oxygen gas as a main reactant, under an atmosphere of pressure ranging from 0.01 Torr to 30.0 Torr; and burying said via hole with conductive material so as to electrically connect between said lower wiring layer and said upper wiring layer.