Abstract: Aspects of this disclosure relate to an acoustic wave device that includes high velocity layers on opposing sides of a piezoelectric layer. A temperature compensation layer can be positioned between one of the high velocity layers and the piezoelectric layer. The acoustic wave device can be arranged to generate a boundary acoustic wave having a higher velocity than a respective acoustic velocity of each of the high velocity layers.

Abstract: A wireless base station and a first wireless terminal include means for collecting first wireless performance information regarding wireless communication in both a downstream direction and an upstream direction and transmitting the first wireless performance information to a wireless performance measurement device. The wireless base station and a second wireless terminal include means for collecting second wireless performance information regarding wireless communication in both the downstream direction and the upstream direction and transmitting the second wireless performance information to the wireless performance measurement device.

Abstract: Aspects of this disclosure relate to a surface acoustic wave device with a vertical stack over a piezoelectric layer. The vertical stack can include a first acoustic reflector disposed on the piezoelectric layer, a second acoustic reflector disposed on the piezoelectric layer, and an interdigital transducer electrode disposed on the piezoelectric layer and positioned between the first acoustic reflector and the second acoustic reflector. The interdigital transducer electrode has a first side that is closer to the first acoustic reflector and a second side that is closer to the second acoustic reflector. A vertical arrangement of the vertical stack can be configured such that an acoustic wave propagation velocity of a first region between the first side and a first reflector is faster than an acoustic wave propagation velocity of a second region between the first side and the second side.

Abstract: A surface acoustic wave device comprises a substrate and an interdigital transducer (IDT) electrode disposed on the substrate. The IDT electrode includes a lower electrode layer having a lower surface in contact with an upper surface of the substrate and an upper electrode layer having a lower surface defining a base in contact with an upper surface of the lower electrode layer. Side surfaces of the lower electrode layer are substantially perpendicular to the upper surface of the substrate. Side surfaces of the upper electrode layer are disposed at an acute angle relative to the upper surface of the substrate.

Abstract: In some embodiments, a surface acoustic wave device can include a piezoelectric substrate and an interdigital transducer electrode embedded in a surface of the piezoelectric substrate to support a high-order mode of a surface acoustic wave having a wavelength ? and a phase velocity greater than 8,000 m/s. Such a high-order mode can include a third-order mode, and the phase velocity can be at least 9,000 m/s. In some embodiments, such a surface acoustic wave device can be implemented in products such as a radio-frequency filter, a radio-frequency module and a wireless device.

Abstract: In some embodiments, a surface acoustic wave device can include a piezoelectric substrate and an interdigital transducer electrode implemented on a surface of the piezoelectric substrate, such that the surface acoustic device supports a surface acoustic wave having a wavelength ? and a phase velocity less than 3,000 m/s with an electromechanical coupling coefficient of at least 9.0. In some embodiments, the phase velocity less than 2,000 m/s, and the surface acoustic wave can include a lowest asymmetry (A0) mode. In some embodiments, such a surface acoustic wave device can be implemented in products such as a radio-frequency filter, a radio-frequency module and a wireless device.

Abstract: An acoustic wave device that includes a spinel layer, a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer is disclosed. The piezoelectric layer is disposed between the interdigital transducer electrode and the spinel layer. The acoustic wave device is configured to generate an acoustic wave having a wavelength of ?. The piezoelectric layer can have a thickness than is less than ?. In some embodiments, the acoustic wave device can include a temperature compensating layer that is disposed between the piezoelectric layer and the spinel layer.

Abstract: A projection unit (12) of an interference power estimation device (1) projects an orbit of a satellite onto a map representing a ground surface. A range acquisition unit (13) determines a plurality of ranges on the map so that the projected orbit is included in the ranges. An altitude calculation unit (14) calculates an altitude of the orbit of the satellite in each of the ranges. A range interference calculation unit (16) calculates, for each of the ranges, an interference power between the satellite at a position determined by a latitude and a longitude of the range and the altitude calculated for the range and a radio station installed on the ground surface. An estimation result calculation unit (17) selects, as an estimation result, a maximum value among the interference powers calculated for each of the ranges.

Abstract: A liquid ejection apparatus includes a liquid ejection head that is detachably attached and ejects a liquid, and a control section that is configured to transmit a delivery request for a new liquid ejection head to a server apparatus via a network.

Abstract: There are provided an information collecting device configured to collect a frame A transmitted and received between a wireless LAN base station that is an evaluation target and a wireless LAN terminal subordinate to the wireless LAN base station that is the evaluation target and a frame B transmitted and received between a wireless LAN base station that is a non-evaluation target and a wireless LAN terminal subordinate to the wireless LAN base station that is the non-evaluation target, and extract radio information on communication quality of each of the wireless LAN base stations from a header of a corresponding one of the frames A and B, and a wireless LAN communication quality estimation device configured to acquire, from the wireless LAN base station that is the evaluation target, information on the number of currently connected wireless LAN terminals, acquire, from the information collecting device, the radio information on the communication quality of each of the wireless LAN base stations, and analyze

Abstract: Provided is a reel member and an adhesive film winding body capable of suppressing sticking and blocking and preventing falling off. A real member includes: a winding core 3 around which an adhesive film 2 is to be wound; a pair of reel flanges 4 provided on both sides of the winding core 3; and a plurality of ribs 5 formed on an inner surface 4a of the reel flange 4, protruding from the inner surface 4a, and extending from the center side to the peripheral edge side of the reel flange 4, wherein in the rib 5, a rib top width W1 in contact with the adhesive film 2 is narrower than a rib base width W2 in contact with the inner surface 4a in cross-sectional view.

Abstract: An integrated device package is disclosed. The integrated device package can include a printed circuit board and a microelectronicmechanical systems die that is at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board. The integrated device package can include a filler material that is at least partially disposed between the microelectronicmechanical systems die and the printed circuit board. The integrated device package can include a lid that is coupled to the printed circuit board. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.

Abstract: An integrated device package is disclosed. The integrated device package can include a carrier that has an opening extending at least partially through a thickness of the carrier. The integrated device package can include a microelectronicmechanical systems die that is at least partially disposed in the opening and mechanically and electrically coupled to the carrier. The integrated device package can include a lid that is coupled to the carrier. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.

Abstract: An integrated device package is disclosed. The integrated device package can include a carrier that has a multilayer structure having a first layer and a second layer. The first layer at least partially defines a lower side of the carrier. An electrical resistance of the second layer is greater than an electrical resistance of the first layer. The integrated device package can include a microelectronicmechanical systems die that is mounted on an upper side of the carrier opposite the lower side. The integrated device package can include a lid that is coupled to the carrier. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.

Abstract: A crystal of 7-((3R,5S)-1-acryloyl-5-methylpyrrolidin-3-yl)-4-amino-6-(cyclopropylethynyl)-N-((R)-1-phenylethyl)-7H-pyrrolo[2,3-d]pyrimidine-5-carboxamide (compound (I)), and a crystal thereof with an acid (salt crystal or co-crystal) are provided. There are provided: a type II crystal of compound (I) with fumaric acid, having characteristic peaks at three or more diffraction angles (2? ± 0.2 °) selected from 5.5°, 6.8°, 9.3°, 13.4°, 15.3°, 16.3°, 18.5°, 19.8°, 22.0°, and 24.5° in a powder X-ray diffraction spectrum; a (free-form) type II crystal of compound (I) having characteristic peaks at three or more diffraction angles selected from 8.3°, 14.8°, 17.3°, 18.0°, 19.1°, 20.3°, 21.0°, 22.5°, 23.0°, and 26.2° in a powder X-ray diffraction spectrum; a (free-form) type I crystal of compound (I) having characteristic peaks at three or more diffraction angles selected from 9.9°, 11.7°, 13.2°, 17.7°, 18.1°, 18.8°, and 20.

Abstract: A surface acoustic wave (SAW) filter package comprises a substrate, one or more trenches formed in the substrate, a SAW filter formed in each trench of the one or more trenches, and a cavity forming layer extending horizontally across the substrate and each trench.

Abstract: Information related to a vehicle can be displayed by projecting an image based on the information on a road surface or the like. An image projection apparatus that projects an image includes: an acquisition unit that acquires information to be displayed; and an image projection unit that projects the image based on the information to be displayed acquired by the acquisition unit.

Abstract: Based on information about a vehicle, the information can be projected and displayed onto a road surface or the like. An image projection apparatus, which projects an image, includes an acquisition unit that acquires the information about the vehicle, and an image projection unit that projects the image based on the information acquired by the acquisition unit.

Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.

Abstract: Provided are a temperature sensor that performs high-speed sensing, whose cost is low, and whose layout is freely designed, the temperature sensor eliminating the need for complicated operations, and a method for manufacturing the temperature sensor. In a temperature sensor 1, terminal portions 9 of a connector portion 7 are exposed to an outside of a pipe section 2, a connector-side embedded portion 8 of the connector portion 7 is embedded in an embedding portion 4 of a side wall portion 3, an exposed portion 12 of a housing portion 11 is disposed in the pipe section 2, and an embedded base 13 of the housing portion 11 is embedded in the embedding portion 4. The housing portion 11 is made of a metal.