Abstract: A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.

Abstract: The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.

Abstract: An airless tire includes multiple tire pieces including a first tire piece and a second tire piece such that the first and second tire pieces are integrated in alignment in tire axial direction. The first tire piece includes a first tread ring, a first inner periphery portion and first spokes such that the first ring has a cylindrical form and a ground contact surface, the first periphery portion is formed on radial direction inner side of the first ring, and the first spokes are connecting the first ring and periphery portion, and the second tire piece includes a second tread ring, a second inner periphery portion, and second spokes such that the second ring has a cylindrical form and a ground contact surface, the second periphery portion is formed on radial direction inner side of the second ring, and the second spokes are connecting the second ring and periphery portion.

Abstract: A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.

Abstract: The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.

Abstract: A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.

Abstract: To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion.

Abstract: A disinfection cap is provided with a cap main body and a wiping body held by the cap main body. The cap main body includes a cap side locking section that prevents pullout of the cap main body by engagement with a medical connector side locking section. The wiping body includes an impregnation section impregnated with an antiseptic solution and is movable with respect to the cap main body so as to wipe at least the surface of a top face wall, the inner peripheral face of an opening of the top face wall, or the surface of a valve body in a male connector connection section of a medical connector with the impregnation section with the cap side locking section engaged with the medical connector side locking section.

Abstract: To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion.

Abstract: An optical sensor has a glass base having a concave portion, and a glass lid is bonded to the base and overlies the concave portion to form a cavity portion. A photoelectric conversion element id accommodated in the cavity portion. Internal wirings are each connected at one end to the photoelectric conversion element and extend through notches each formed at a corner of a peripheral edge along an outside surface of the base. The other ends of the internal wirings are connected inside the notches to external wirings that extend along an outside surface of the base and terminate in external terminals.

Abstract: To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component (1) is formed by bonding together a base (3) made of glass and a lid (2). Outer electrodes (8) and (18) are formed on a bottom surface of the base (3), and the outer electrodes (8) and (18) are respectively connected to through electrodes (7) and (17). The outer electrodes (8) and (18) each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes (8) and (18) are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Abstract: An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.

Abstract: An air filter assembly has a fan, pre-filter, a main filter, and a control circuit which generates various signals to the user as to when the pre-filter and the main filter should be replaced. The control circuit detects when the pre-filter should be replaced from two conditions: a first pre-filter replacement condition based decreased air flow, and a second pre-filter replacement condition based on cumulative operating time. The control circuit detects when the main filter should be replaced based on a formula containing a number of the occurrences of the first pre-filter replacement condition and a number of occurrences of the second pre-filter replacement condition. The control circuit also detects a main filter replacement condition based on cumulative operating time of main filter. The main filter can have a fuse that is blown when the main filter should be replaced.

Abstract: An optical sensor has a glass base having a concave portion, and a glass lid is bonded to the base and overlies the concave portion to form an hermetically sealed cavity portion. A photoelectric conversion element is accommodated in the cavity portion. Internal wirings are each connected at one end to the photoelectric conversion element and extend through notches formed in a peripheral edge of the base. The other ends of the internal wirings are connected inside the notches to external wirings that extend along an outside surface of the base and terminate in external terminals.

Abstract: In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.

Abstract: A data storage medium support member is produced by resin molding. The data storage medium support member includes an accommodating portion, a guide portion, and a gate cut portion. The accommodating portion accommodates a magnetic member around a central axis. The guide portion has a guide surface for guiding an inner edge of a disc, and is arranged radially outward of the accommodating portion. The gate cut portion is formed on a rear surface of the guide portion. The data storage medium support member can be produced by the resin molding while securing space for accommodating the magnetic member and preventing an increase in the axial dimension of the data storage medium support member.

Abstract: An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.

Abstract: An electronic component includes a glass substrate, a lid that is bonded to the glass substrate, an internal electrode, an external electrode, and a through electrode that is disposed in a through hole passing through the glass substrate and electrically connects the internal electrode to the external electrode. A sputtered metal layer is formed on the end face of a core member of the through electrode, which is made of a metal, by sputtering.

Abstract: An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.

Abstract: An air filter assembly has a fan, pre-filter, a main filter, and a control circuit which generates various signals to the user as to when the pre-filter and the main filter should be replaced. The control circuit detects when the pre-filter should be replaced from two conditions: a first pre-filter replacement condition based decreased air flow, and a second pre-filter replacement condition based on cumulative operating time. The control circuit detects when the main filter should be replaced based on a formula containing a number of the occurrences of the first pre-filter replacement condition and a number of occurrences of the second pre-filter replacement condition. The control circuit also detects a main filter replacement condition based on cumulative operating time of main filter. The main filter can have a fuse that is blown when the main filter should be replaced.