Abstract: A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are uniformly dispersed in the resin composition. The resin composition includes 2 wt % to 40 wt % of a liquid rubber, 5 wt % to 60 wt % of a polyphenylene ether resin, 3 wt % to 40 wt % of a crosslinker, and 5 wt % to 40 wt % of a phosphorus flame retardant.

Abstract: A polyphenylene ether resin modified with bismaleimide, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the bismaleimide has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

Abstract: A polyphenylene ether resin modified with two amino functional groups, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the two amino functional groups has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

Abstract: A polyphenylene ether resin modified with benzoxazine, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the benzoxazine has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

Abstract: A resin composition, including resin and peroxide, is provided. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. The sum of the liquid rubber resin, the polyphenylene ether resin, and the crosslinking agent is 100 parts by mass. The amount of the peroxide used is between 0.1 phr and 5 phr. The peroxide is composed of tertiary butyl cumyl peroxide and an inorganic compound.

Abstract: A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.

Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

Abstract: A rubber resin material with high thermal conductivity and a metal substrate with high thermal conductivity are provided. The rubber resin material includes inorganic fillers and a rubber resin composition with high thermal conductivity. The rubber resin composition with high thermal conductivity includes 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

Abstract: A thermosetting resin material, a prepreg, and a metal substrate are provided. The thermosetting resin material includes a resin composition and inorganic fillers. The resin composition includes: 10 wt % to 30 wt % of a polyphenylene ether resin, 40 wt % to 60 wt % of a cyanate resin, and 20 wt % to 40 wt % of a bismaleimide resin. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

Abstract: A communication interface structure for connection between dies is provided, including a memory die, processing dies and interconnection routings. The memory die includes a first interface edge, wherein the first interface edge is split into a plurality of interface groups. Each of the processing dies includes a second interface edge. Interconnection routings respectively connect the second interface edges of the processing dies to the interface groups of the memory die.

Abstract: A communication interface structure for connection between dies is provided, including a memory die, processing dies and interconnection routings. The memory die includes a first interface edge, wherein the first interface edge is split into a plurality of interface groups. Each of the processing dies includes a second interface edge. Interconnection routings respectively connect the second interface edges of the processing dies to the interface groups of the memory die.

Abstract: A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

Abstract: A coin dispenser is disclosed to use a dialing rod of a dialing device of a coin dispensing unit to push one side of the peripheral edge of one metal coin so that the other side of the peripheral edge of the metal coin will push two coin-stopping columns of one spring plate of the coin dispensing unit, causing the two coin-stopping columns to slide along the peripheral edge of the metal coin, and thus, when the metal coin crosses two coin-stopping columns, the metal coin is sent out of the coin outlet, achieving the effect of dispensing one metal coin at one time.

Abstract: A resin composition for a high frequency substrate and a metal clad laminate are provided. Based on a total weight of the resin composition for the high frequency substrate being 100 phr, the resin composition for the high frequency substrate includes: 20 phr to 70 phr of a polyphenylene ether resin, 5 phr to 40 phr of a polybutadiene resin, 5 phr to 30 phr of a bismaleimide resin, and 20 phr to 45 phr of a crosslinker. A glass transition temperature of the resin composition for the high frequency substrate is higher than or equal to 230° C. The metal clad laminate includes a substrate and a metal layer disposed on the substrate. The substrate is formed from the resin composition for the high frequency substrate.

Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.

Abstract: An audio processing method includes the following operations. A calculated value is obtained according to multiple audio clock frequency information contained in multiple audio input packets. An audio sampling frequency is generated according to the calculated value and a link symbol clock signal. Multiple audio output packets corresponding to the audio input packets are generated according to the audio sampling frequency.

Abstract: A signal receiving device adapting to a signal input mode and a signal processing method for the same are provided. The signal receiving device can determine various signal input modes, such as a differential signal or a single-ended signal, and select an appropriate signal source, such that the signal receiving device can not only receive the input signal correctly, but also adjust the received input signal to a differential signal with the same amplitude and opposite phases to make subsequent data analysis work easier.

Abstract: A signal receiving device adapting to a signal input mode and a signal processing method for the same are provided. The signal receiving device can determine various signal input modes, such as a differential signal or a single-ended signal, and select an appropriate signal source, such that the signal receiving device can not only receive the input signal correctly, but also adjust the received input signal to a differential signal with the same amplitude and opposite phases to make subsequent data analysis work easier.

Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 ?m to 1 ?m. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 ?m and 100 ?m.

Abstract: A coin dispenser is disclosed to use a dialing rod of a dialing device of a coin dispensing unit to push one side of the peripheral edge of one metal coin so that the other side of the peripheral edge of the metal coin will push two coin-stopping columns of one spring plate of the coin dispensing unit, causing the two coin-stopping columns to slide along the peripheral edge of the metal coin, and thus, when the metal coin crosses two coin-stopping columns, the metal coin is sent out of the coin outlet, achieving the effect of dispensing one metal coin at one time.