Patents by Inventor Hung-Yi Chang

Hung-Yi Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210249024
    Abstract: An audio processing method includes the following operations. A calculated value is obtained according to multiple audio clock frequency information contained in multiple audio input packets. An audio sampling frequency is generated according to the calculated value and a link symbol clock signal. Multiple audio output packets corresponding to the audio input packets are generated according to the audio sampling frequency.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 12, 2021
    Inventors: Chun-Chang LIU, Jing-Chu CHAN, Hung-Yi CHANG
  • Publication number: 20210211150
    Abstract: A signal receiving device adapting to a signal input mode and a signal processing method for the same are provided. The signal receiving device can determine various signal input modes, such as a differential signal or a single-ended signal, and select an appropriate signal source, such that the signal receiving device can not only receive the input signal correctly, but also adjust the received input signal to a differential signal with the same amplitude and opposite phases to make subsequent data analysis work easier.
    Type: Application
    Filed: October 14, 2020
    Publication date: July 8, 2021
    Inventors: CHEN-KANG LIN, HUNG-YI CHANG, BING-JUO CHUANG
  • Patent number: 11057070
    Abstract: A signal receiving device adapting to a signal input mode and a signal processing method for the same are provided. The signal receiving device can determine various signal input modes, such as a differential signal or a single-ended signal, and select an appropriate signal source, such that the signal receiving device can not only receive the input signal correctly, but also adjust the received input signal to a differential signal with the same amplitude and opposite phases to make subsequent data analysis work easier.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: July 6, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Chen-Kang Lin, Hung-Yi Chang, Bing-Juo Chuang
  • Patent number: 11051402
    Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 ?m to 1 ?m. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 ?m and 100 ?m.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: June 29, 2021
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang, Hung-Yi Chang
  • Publication number: 20210183195
    Abstract: A coin dispenser is disclosed to use a dialing rod of a dialing device of a coin dispensing unit to push one side of the peripheral edge of one metal coin so that the other side of the peripheral edge of the metal coin will push two coin-stopping columns of one spring plate of the coin dispensing unit, causing the two coin-stopping columns to slide along the peripheral edge of the metal coin, and thus, when the metal coin crosses two coin-stopping columns, the metal coin is sent out of the coin outlet, achieving the effect of dispensing one metal coin at one time.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 17, 2021
    Inventors: Chia-Min CHANG, Hung-Yi CHANG, Dong-Ying YANG
  • Patent number: 11008451
    Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 18, 2021
    Assignee: Nan Ya Plastics Corporation
    Inventors: Te-Chao Liao, Ying-Te Huang, Chih-Kai Chang, Hung-Yi Chang, Hao-Sheng Chen, Chia-Lin Liu
  • Publication number: 20210122879
    Abstract: A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by reacting a diamine having a specific structure with maleic anhydride, and has greater amounts of non-polar and hydrophobic groups in the molecular structure thereof.
    Type: Application
    Filed: August 27, 2020
    Publication date: April 29, 2021
    Inventors: TE-CHAO LIAO, HAO-SHENG CHEN, HUNG-YI CHANG, Chi-Lin Chen
  • Patent number: 10916852
    Abstract: An antenna device includes a circuit board and at least one chip antenna. The circuit board includes a clearance area and at least one signal feeding line disposed in the clearance area. The chip antenna includes a substrate and at least one resonance unit partially or wholly disposed on the surface of or within the substrate. The chip antenna is disposed in the clearance area of the circuit board and the resonance unit of the chip antenna is connected to the signal feeding line. A shortest distance from an edge of the clearance area to a nearest edge of the circuit board is greater than 1/10 of a smallest width of the circuit board. Therefore, the polarization direction of the chip antenna is approximately perpendicular to the upper surface of the circuit board, as well as the direction of the strongest signal strength of the radiation pattern is approximately parallel to the upper surface of the circuit board.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: February 9, 2021
    Assignee: Unictron Technologies Corporation
    Inventors: Chih-Shen Chou, Tsung-Shou Yeh, Hsiang-Cheng Yang, Hung-Yi Chang
  • Patent number: 10895007
    Abstract: An evaporation apparatus including a material source, a chamber, a passageway, and a heating component is provided. The material source is configured to provide a deposition material. The chamber includes a manifold. The passageway is configured to be connected to the material source and the manifold. The heating component is disposed in at least a portion of the passageway and configured to heat the deposition material. A calibration method of the evaporation apparatus is also provided.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: January 19, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Lin Hsu, Chien-Hung Lin, Kuo-Hsin Huang, Chao-Feng Sung, Chih-Ming Lai, Hung-Yi Chang
  • Patent number: 10889741
    Abstract: A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: January 12, 2021
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang, Hung-Yi Chang
  • Publication number: 20200389974
    Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 ?m to 1 ?m. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 ?m and 100 ?m.
    Type: Application
    Filed: October 25, 2019
    Publication date: December 10, 2020
    Inventors: TE-CHAO LIAO, HAO-SHENG CHEN, CHIH-KAI CHANG, HUNG-YI CHANG
  • Publication number: 20200325304
    Abstract: A thermosetting resin composition and a printed circuit board including the same are provided. The composition adopts a thermosetting polyphenylene ether resin whose terminal functional group is a styrene and an acrylic. The thermosetting polyphenylene ether resin has an appropriate hydroxyl value to be easily cured, and the ratio of two different functional groups is between 0.5 and 1.5, for adjusting heat resistance, fluidity, and filling property. A particle diameter of 1 ?m to 40 ?m is added to control a dielectric constant, and after curing characteristics of high dielectric constant, low dielectric loss, high Tg, high rigidity, high flame resistance and low moisture absorption rate can be achieved.
    Type: Application
    Filed: November 11, 2019
    Publication date: October 15, 2020
    Inventors: TE-CHAO LIAO, HAO-SHENG CHEN, HUNG-YI CHANG, CHIA-LIN LIU, CHIH-KAI CHANG
  • Patent number: 10781297
    Abstract: A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210° C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent curability.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 22, 2020
    Assignee: Nan Ya Plastics Corporation
    Inventors: Te-Chao Liao, Ying-Te Huang, Hao-Sheng Chen, Hung-Yi Chang, Chia-Lin Liu
  • Publication number: 20200165434
    Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulos; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 28, 2020
    Inventors: Te-Chao LIAO, Ying-Te HUANG, Chih-Kai CHANG, Hung-Yi CHANG, Hao-Sheng CHEN, Chia-Lin LIU
  • Publication number: 20200165501
    Abstract: A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 28, 2020
    Inventors: Te-Chao LIAO, Hao-Sheng CHEN, Chih-Kai CHANG, Hung-Yi CHANG
  • Publication number: 20200165446
    Abstract: A thermosetting resin composition comprises a thermosetting polybutadiene resin, a thermosetting polyphenylene ether resin that is ended with styrene and acrylate in a weight ratio of 0.5-1.5 as reactive functional groups, a thermoplastic resin that serves to set desired heat resistance, flowability and filling performance, a compound cross-linking initiator composed of peroxides of different half-life temperatures to effectively improve its crosslink density during its thermal curing process; particularly the composition after cured has a low dielectric constant, a low dielectric dissipation factor, a high Tg, and high rigidity, and the prepreg made thereof is easy to cut.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 28, 2020
    Inventors: Te-Chao LIAO, Ying-Te HUANG, Hao-Sheng CHEN, Hung-Yi CHANG, Chia-Lin LIU
  • Patent number: 10354508
    Abstract: An ink-staining anti-theft cash box includes a cash box mounted in a host machine for receiving and storing bills, an ink-jet module and an anti-theft security device consisting of a gas cylinder, a needle valve unit, a drive unit and a trigger unit. When the trigger unit detects abnormal separation of the cash box from the host machine, the trigger unit is triggered, and the drive unit is activated to move the gas cylinder toward the needle valve unit from a first position to a second position where an air seal diaphragm of the gas cylinder is pierced by the needle valve unit, and the compressed gas of the gas cylinder is released through an ink tub into an ink cartridge to force an ink out of a nozzle assembly of the ink-jet module for staining storage bills in the box body, enhancing the security level of the cash box.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: July 16, 2019
    Assignee: INTERNATIONAL CURRENCY TECHNOLOGIES CORPORATION
    Inventors: Chia-Min Chang, Hung-Yi Chang, Chia-Hung Hu, Yi-Hsin Chen
  • Patent number: 10308749
    Abstract: A process for producing a modified polyphenylene ether resin having a purity of more than 99.4%, comprising steps of graft modification, water rinse, and extraction as well as phase splitting, is disclosed that step of separating out powder during purification is no needed, and the solvent for use in performing dissolving of or/and extraction of polyphenylene ether resin can be recycled for future use, so that the manufacturing process is simple and uses less solvent as compared to the prior art, and further helps to conserve resources and is environmentally friendly.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: June 4, 2019
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Ying-Te Huang, Hao-Sheng Chen, Hung-Yi Chang, Chuan Chou, Jui-Jung Lin Lai
  • Publication number: 20190127843
    Abstract: An evaporation apparatus including a material source, a chamber, a passageway, and a heating component is provided. The material source is configured to provide a deposition material. The chamber includes a manifold. The passageway is configured to be connected to the material source and the manifold. The heating component is disposed in at least a portion of the passageway and configured to heat the deposition material. A calibration method of the evaporation apparatus is also provided.
    Type: Application
    Filed: December 14, 2017
    Publication date: May 2, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Lin Hsu, Chien-Hung Lin, Kuo-Hsin Huang, Chao-Feng Sung, Chih-Ming Lai, Hung-Yi Chang
  • Publication number: 20190130715
    Abstract: An ink-staining anti-theft cash box includes a cash box mounted in a host machine for receiving and storing bills, an ink-jet module and an anti-theft security device consisting of a gas cylinder, a needle valve unit, a drive unit and a trigger unit. When the trigger unit detects abnormal separation of the cash box from the host machine, the trigger unit is triggered, and the drive unit is activated to move the gas cylinder toward the needle valve unit from a first position to a second position where an air seal diaphragm of the gas cylinder is pierced by the needle valve unit, and the compressed gas of the gas cylinder is released through an ink tub into an ink cartridge to force an ink out of a nozzle assembly of the ink-jet module for staining storage bills in the box body, enhancing the security level of the cash box.
    Type: Application
    Filed: February 8, 2018
    Publication date: May 2, 2019
    Inventors: Chia-Min CHANG, Hung-Yi CHANG, Chia-Hung HU, Yi-Hsin CHEN