Abstract: An actinic ray-sensitive or radiation-sensitive resin composition comprises (A) a resin that exhibits an increased solubility in an alkali developer when acted on by an acid, and (B) at least two types of sulfonic acid generators that generate a sulfonic acid when exposed to actinic rays or radiation, wherein the two types of sulfonic acid generators (B) consist of sulfonic acid generators (B1) and (B2) satisfying the following requirements, namely the sulfonic acid generator (B1) generates a sulfonic acid composed of 9 to 20 elements with an acid strength (pKa) satisfying the relationship pKa<?3.50, and the sulfonic acid generator (B2) generates an acid composed of 17 or more elements with an acid strength (pKa) satisfying the relationship ?2.00>pKa??3.50, provided that no hydrogen atom is included in the number of elements of the generated acids.

Abstract: A resist composition for an electron beam, EUV or X-ray comprising (A1) a compound that has a reduction potential higher than that of diphenyl iodonium salt and generates an acid upon irradiation of an actinic ray or radiation.

Abstract: A chemical amplification resist composition comprising (A) a resin increasing the solubility in an alkali developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, (C) a compound having a fluorine atom and a hydroxyl group, and a pKa value of from 4 to 15, and (D) a solvent, and a pattern-forming method using the same.

Abstract: A resist composition for immersion, comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a photoacid generator; and (C) a mixed solvent containing an alkylene glycol alkyl ether carboxylate and a propylene glycol monomethyl ether.

Abstract: A positive resist composition comprising (A) a resin that increases solubility in an alkali developing solution by the action of an acid and (B-1) a compound having a structure represented by formula (I) defined in the specification.

Abstract: A positive photosensitive composition includes: a resin (A) whose dissolution rate in an alkaline developing solution increases by the action of an acid, the resin (A) containing an acid decomposable repeating unit represented by a general formula (I) and an acid nondecomposable repeating unit represented by a general formula (II); and a compound (B) capable of generating an acid upon irradiation with one of active rays and radiations: wherein Xa1 represents one of a hydrogen atom, an alkyl group, a cyano group, and a halogen atom, A1 represents one of a single bond and a divalent connecting group, ALG represents an acid leaving hydrocarbon group, Xa2 represents one of a hydrogen atom, an alkyl group, a cyano group, and a halogen atom, A2 represents one of a single bond and a divalent connecting group, and ACG represents an acid nonleaving hydrocarbon group.

Abstract: A positive-working resist composition comprising (A) a resin that increases solubility in an alkali developing solution by the action of an acid, (B) a compound which generates an acid upon irradiation of an actinic ray or radiation, (C) a nonionic cyclic compound having at least one partial structure represented by the following formula (I) or (II) and at least having either a melting point of 35° C. or more or a boiling point of 100° C./10 mmHg or more: and (D) a solvent.

Abstract: A positive resist composition of the present invention achieving significant performance improvements in high energy-beam lithography, which comprises a phenolic polymer having a property of being insoluble or hardly soluble in an aqueous alkali solution and becoming soluble in an aqueous alkali solution by the action of an acid, in which the phenolic polymer includes a repeating unit containing at least one selected from the group consisting of an acetal-protected phenolic hydroxyl group, a ketal-protected phenolic hydroxyl group, a tertiary ester-protected carboxyl group and a tetrahydropyranyl-protected carboxyl group; and a compound having a phenacylsulfonium structure and capable of generating an acid upon irradiation with one of actinic rays and radiation.

Abstract: A stimulus sensitive composition containing a compound capable of generating an acid or a radical on receipt of an external stimulus, the compound being represented by the following formula (I): wherein Y represents a group having a bridged cyclic structure; R1 and R2 each independently represent a hydrogen atom, an alkyl group or an aryl group; R1 and R2 may be taken together to form a ring; Y1 and Y2 each independently represent an alkyl group or an aryl group; Y1 and Y2 may be taken together to form a ring; and X? represents a non-nucleophilic anion.

Abstract: The resist composition of the present invention, ensuring excellent pattern profile and excellent isolation performance for use in the pattern formation by the irradiation of actinic rays or radiation, particularly, electron beam, X ray or EUV light, which comprising (A) a compound having a specific partial structure and a counter ion, the compound generating an acid upon irradiation of actinic rays or radiation.

Abstract: The resist composition of the present invention, ensuring excellent pattern profile and excellent isolation performance for use in the pattern formation by the irradiation of actinic rays or radiation, particularly, electron beam, X ray or EUV light, which comprising (A) a compound having a specific partial structure and a counter ion, the compound generating an acid upon irradiation of actinic rays or radiation.

Abstract: A resist composition comprises (A) a compound having a molecular weight of 3,000 or lower which has in its molecule a structure having two or more monovalent anions and a structure having two or more monovalent cations.

Abstract: A chemical amplification resist composition comprising (A) a resin increasing the solubility in an alkali developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, (C) a compound having a fluorine atom and a hydroxyl group, and a pKa value of from 4 to 15, and (D) a solvent, and a pattern-forming method using the same.

Abstract: A resist composition for immersion, comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a photoacid generator; and (C) a mixed solvent containing an alkylene glycol alkyl ether carboxylate and a propylene glycol monomethyl ether.

Abstract: A negative type resist composition comprising: (A1) a compound generating a sulfonic acid upon irradiation with actinic rays or a radiation and having the specific formula, (A2) a compound generating a sulfonic acid upon irradiation with actinic rays or a radiation and having the specific structure, (B) an alkali-soluble resin, and (C) a crosslinking agent capable of carrying out an addition reaction with the alkali-soluble resin which is the component (B) by the action of an acid.

Abstract: A positive resist composition comprising: (A) a resin which increases a solubility of the resin (A) in an alkali developer by an action of an acid; (B-1) a triarylsulfonium salt having a fluorine atom in a cation part of the triarylsulfonium salt, wherein the triarylsulfonium salt generates one of: an aliphatic sulfonic acid having a fluorine atom; and an aromatic sulfonic acid having a fluorine atom upon irradiation with one of an actinic ray and a radiation; (C) a nitrogen-containing basic compound; and (D) an organic solvent, and pattern forming method using the same.

Abstract: A positive resist composition comprising (A) a resin that increases solubility in an alkali developing solution by the action of an acid and (B-1) a compound having a structure represented by formula (I) defined in the specification.

Abstract: A positive-working resist composition comprising (A) a resin that increases solubility in an alkali developing solution by the action of an acid, (B) a compound which generates an acid upon irradiation of an actinic ray or radiation, (C) a nonionic cyclic compound having at least one partial structure represented by the following formula (I) or (II) and at least having either a melting point of 35° C. or more or a boiling point of 100° C.

Abstract: A stimulus sensitive composition containing a compound capable of generating an acid or a radical on receipt of an external stimulus, the compound being represented by the following formula (I): 1

Abstract: A negative type resist composition comprising: