Abstract: A three-dimensional integrated circuit non-volatile memory array includes a memory array with multiple vertical gate NAND memory cell strings formed in a different vertical layers over a substrate which share a common set of word lines, where different groupings of NAND memory cell strings formed between dedicated pairings of source line structures and bit line structures form separately erasable blocks which are addressed and erased by applying an erase voltage to the source line structure of the erase block being erased while applying a ground voltage to the other source line structures in the array and a high pass voltage to the bit line structures in the array.

Abstract: Described herein is a structure and method of manufacturing for a memory device with a thin silicon body. The memory device may be a semiconductor comprising: a first dielectric of a first width; a second dielectric of a second width, the second width less than the first width; and a thin film polycrystalline silicon (poly-Si) on sidewalls of the second dielectric.

Abstract: A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines.

Abstract: A high capacitance embedded capacitor and associated fabrication processes are disclosed for fabricating a capacitor stack in a multi-layer stack to include a first capacitor plate conductor formed with a cylinder-shaped storage node electrode formed in the multi-layer stack, a capacitor dielectric layer surrounding the cylinder-shaped storage node electrode, and a second capacitor plate conductor formed from a conductive layer in the multi-layer stack that is sandwiched between a bottom and top dielectric layer, where the cylinder-shaped storage node electrode is surrounded by and extends through the conductive layer.

Abstract: A three-dimensional integrated circuit nonvolatile memory array includes a memory array with a plurality of string stacks laterally disposed in parallel over a substrate to intersect with a plurality of parallel conductive gate structures separated from one another by intervening fin-shaped dielectric structures, where each string stack includes conductive strips separated from each other by interlayer insulating strips, and where a charge storage node is positioned between each conductive strip and each intersecting conductive gate structure to be electrically isolated from neighboring charge storage nodes x, y, and z directions.

Abstract: A three-dimensional integrated circuit non-volatile memory array includes a memory array of vertical channel NAND flash strings connected between a substrate source line and upper layer connection lines which each include n-type drain regions and p-type body line contact regions alternately disposed on each side of undoped or lightly doped string body regions so that each NAND flash string includes a vertical string body portion connected to a horizontal string body portion formed from the string body regions of the upper body connection lines.

Abstract: A non-volatile memory system that has junctionless transistors is provided that uses suppression of the formation of an inversion-layer source and drain in the junctionless transistors to cause a discontinuous channel in at least one string. The system may include NAND flash memory cells composed of junctionless transistors, and has a set of wordlines. During program operation, a selected wordline of the set of wordlines is biased at a program voltage, and wordline voltage low enough to suppress the formation of source/drains is applied on at least one word line on a source side of the selected wordline such that a channel isolation occurs thereby causing the discontinuous channel in the at least string.

Abstract: A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines.

Abstract: A non-volatile memory device having a memory array organized into a plurality of memory blocks, having either planar memory cells or stacks of cells. Row decoding circuitry of the memory device is configured to select a group of the plurality of memory blocks in response to a first row address, and to select a memory block of the group for receiving row signals in response to a second row address. Row decoding circuitry associated with each group of memory blocks can have a row pitch spacing that is greater than a row pitch spacing of a single memory block and less than or equal to a total row pitch spacing corresponding to the group of memory blocks.

Abstract: A non-volatile memory device, comprising: a substrate; a plurality of string stacks disposed over the substrate, each string stack comprising a long axis and a short axis in a plane parallel to the substrate, the long axis extending along a y-direction and the short axis extending along an x-direction, each string stack comprising a plurality of strings being stacked in a direction vertical to the substrate and having a first end and a second end at different locations in the y-direction, the plurality of string stacks comprising a first and a second set of string stacks, at least some of the string stacks of the first set of string stacks being offset along the x-direction from at least some of the string stacks of the second set of string stacks.

Abstract: Generally, the present disclosure provides a non-volatile memory device having a hierarchical bitline structure for preventing erase voltages applied to one group of memory cells of the memory array from leaking to other groups in which erasure is not required. Local bitlines are coupled to the memory cells of each group of memory cells. Each local bitline can be selectively connected to a global bitline during read operations for the selected group, and all the local bitlines can be disconnected from the global bitline during an erase operation when a specific group is selected for erasure. Select devices for electrically connecting each bitline of a specific group of memory cells to the global bitline have device bodies that are electrically isolated from the bodies of those memory cells.

Abstract: A three-dimensional integrated circuit non-volatile memory array includes a memory array with first and second NAND memory cell string stacks having opposite orientations, where each NAND memory cell string includes a plurality of transistors and a source line contact connected in series between a bit line and string extension region which extends from the source line contact and past a first self-aligned SSL gate electrode located on a peripheral end of the NAND memory cell string, and also includes a string select transistor formed with a second self-aligned SSL connected in series between the bit line and the plurality of transistors, where the first and second self-aligned SSL gate electrodes are shared between adjacent NAND memory cell strings having opposite orientations.

Abstract: A three-dimensional integrated circuit non-volatile memory array includes a memory array with multiple vertical gate NAND memory cell strings formed in a different vertical layers over a substrate which share a common set of word lines, where different groupings of NAND memory cell strings formed between dedicated pairings of source line structures and bit line structures form separately erasable blocks which are addressed and erased by applying an erase voltage to the source line structure of the erase block being erased while applying a ground voltage to the other source line structures in the array and a high pass voltage to the bit line structures in the array.

Abstract: A three-dimensional NAND memory device and an associated method for manufacturing this device are provided. The three-dimensional NAND memory device includes a source contact electrically isolated from a conductive gate material. The source contact also electrically connects a conductive source line to a first silicon strip and a second silicon strip through the conductive gate material.

Abstract: A non-volatile memory device having a memory array organized into a plurality of memory blocks, having either planar memory cells or stacks of cells. Row decoding circuitry of the memory device is configured to select a group of the plurality of memory blocks in response to a first row address, and to select a memory block of the group for receiving row signals in response to a second row address. Row decoding circuitry associated with each group of memory blocks can have a row pitch spacing that is greater than a row pitch spacing of a single memory block and less than or equal to a total row pitch spacing corresponding to the group of memory blocks.

Abstract: A flash device comprising a well and a U-shaped flash cell string, the U-shaped flash cell string built directly on a substrate adjacent the well. The U-shaped flash cell string comprises one portion parallel to a surface of the substrate, comprising a junctionless bottom pass transistor, and two portions perpendicular to the surface of the substrate that comprise a string select transistor at a first top of the cell string, a ground select transistor at a second top of the cell string, a string select transistor drain, and a ground select transistor source.

Abstract: A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines.

Abstract: Described herein is a structure and method of manufacturing for a memory device with a thin silicon body. The memory device may be a semiconductor comprising: a first dielectric of a first width; a second dielectric of a second width, the second width less than the first width; and a thin film polycrystalline silicon (poly-Si) on sidewalls of the second dielectric.

Abstract: Generally, the present disclosure provides a non-volatile memory device having a hierarchical bitline structure for preventing erase voltages applied to one group of memory cells of the memory array from leaking to other groups in which erasure is not required. Local bitlines are coupled to the memory cells of each group of memory cells. Each local bitline can be selectively connected to a global bitline during read operations for the selected group, and all the local bitlines can be disconnected from the global bitline during an erase operation when a specific group is selected for erasure. Select devices for electrically connecting each bitline of a specific group of memory cells to the global bitline have device bodies that are electrically isolated from the bodies of those memory cells.

Abstract: Disclosed is a method of manufacturing flash memory with a vertical cell stack structure. The method includes forming source lines in a cell area of a substrate having an ion-implanted well and forming an alignment mark relative to the source lines. The alignment mark is formed in the substrate outside the cell area of the substrate. After formation of the source lines, cell stacking layers are formed. After forming the cell stacking layers, cell pillars in the cell stacking layers are formed at locations relative to the previously formed source lines using the alignment mark to correctly locate the cell pillars.