Patents by Inventor Hyun Jee Yoo

Hyun Jee Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive film
    Patent number: 10626307
    Abstract: The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 21, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang, Jung-Sup Shim
  • Adhesive and method of encapsulating organic electronic device using the same
    Patent number: 10622573
    Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: April 14, 2020
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Suk Chin Lee, Kwang Jin Jeong
  • Encapsulation film
    Patent number: 10593908
    Abstract: The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: March 17, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Jung Ok Moon, Hyun Jee Yoo, Hyun Suk Kim, Jung Woo Lee, Se Woo Yang
  • Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same
    Patent number: 10570321
    Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: February 25, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Yoon Gyung Cho, Kyung Yul Bae, Hyun Jee Yoo
  • Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns
    Patent number: 10522786
    Abstract: Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: December 31, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Suk Ky Chang, Jung Ok Moon
  • PRESSURE-SENSITIVE ADHESIVE COMPOSITION
    Publication number: 20190382632
    Abstract: The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.
    Type: Application
    Filed: August 21, 2019
    Publication date: December 19, 2019
    Inventors: Yoon Gyung CHO, Hyun Jee Yoo, Kyung Yul Bae, Suk Ky Chang, Jung Sup Shim
  • Display device
    Patent number: 10497904
    Abstract: The present application relates to a display device. The present application can provide a display device in which reflection of external light is reduced to improve a contrast ratio. Such a display device can be applied to not only OLED, a self-luminous display device, but also various display devices including LCD, a non-self-luminous display device, and the like, and can be also implemented as a flexible display device.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: December 3, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Suk Kim, Se Woo Yang, Hyun Jee Yoo, Hyun Hee Son, Jung Ok Moon, Hyoung Sook Park, Ban Seok Choi, Jung Woo Lee
  • Curable composition
    Patent number: 10457842
    Abstract: The present invention relates to a curable composition and an adhesive film including the same, and provides a curable composition and an adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifespan and durability of an organic electronic device.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: October 29, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Yoon Gyung Cho, Hyun Jee Yoo, Seung Min Lee, Suk Ky Chang, Jung Sup Shim
  • Adhesive film and organic electronic device comprising the same
    Patent number: 10442960
    Abstract: The present application relates to an adhesive film, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The present application enables an organic electronic device to show excellent moisture-blocking properties and have flexibility as well as excellent and reliable durability at high temperature and high humidity.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: October 15, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Kyung Yul Bae, Yoon Gyung Cho, Hyun Jee Yoo, Se Woo Yang
  • Pressure-sensitive adhesive composition
    Patent number: 10435596
    Abstract: The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: October 8, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Yoon Gyung Cho, Hyun Jee Yoo, Kyung Yul Bae, Suk Ky Chang, Jung Sup Shim
  • PRESSURE-SENSITIVE ADHESIVE FILM AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME
    Publication number: 20190270916
    Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 5, 2019
    Inventors: Yoon Gyung CHO, Kyung Yul BAE, Hyun Jee YOO
  • Encapsulation film and method for encapsulating organic electronic device using same
    Patent number: 10403850
    Abstract: Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: September 3, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Suk Ky Chang, Jung Ok Moon
  • Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
    Patent number: 10392536
    Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: August 27, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Kyung Yul Bae, Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang
  • Organic electronic device
    Patent number: 10385237
    Abstract: The present application relates to an organic electronic device, a method for preparing same, and a lighting apparatus and a display device comprising same. The present application enables an organic electronic device to show excellent moisture-blocking properties and have flexibility as well as excellent and reliable durability at high temperature and high humidity.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: August 20, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Kyung Yul Bae, Hyun Jee Yoo, Se Woo Yang, Yoon Gyung Cho, Sang Min Park
  • PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE FILM, AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME
    Publication number: 20190241773
    Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
    Type: Application
    Filed: April 17, 2019
    Publication date: August 8, 2019
    Inventors: Yoon Gyung Cho, Kyung Yul Bae, Min Soo Park, Jung Sup Shim, Hyun Jee Yoo
  • ENCAPSULATION FILM AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING SAME
    Publication number: 20190229292
    Abstract: Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.
    Type: Application
    Filed: March 28, 2019
    Publication date: July 25, 2019
    Inventors: Hyun Jee YOO, Seung Min LEE, Hyun Suk KIM, Suk Ky CHANG, Jung Ok MOON
  • Encapsulation film
    Patent number: 10355239
    Abstract: Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the encapsulation film, which may form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: July 16, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Hyun Jee Yoo, Hyun Suk Kim, Jung Ok Moon, Se Woo Yang
  • Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same
    Patent number: 10351738
    Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen from penetrating into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: July 16, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Kyung Yul Bae, Hyun Jee Yoo, Yoon Gyung Cho, Se Woo Yang
  • Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same
    Patent number: 10336917
    Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: July 2, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Yoon Gyung Cho, Kyung Yul Bae, Hyun Jee Yoo
  • Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
    Patent number: 10308842
    Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: June 4, 2019
    Assignee: LG CHEM LTD.
    Inventors: Yoon Gyung Cho, Kyung Yul Bae, Min Soo Park, Jung Sup Shim, Hyun Jee Yoo