Abstract: Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

Abstract: Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

Abstract: Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device can be prevented.

Abstract: Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: Provided are a pressure-sensitive adhesive composition, an encapsulation film including the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

Abstract: Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. Particularly, the encapsulation film, which effectively blocks moisture or oxygen entering the organic electronic device from the outside, and has excellent mechanical properties such as handleability and processability, and the organic electronic device including the same are provided.

Abstract: Provided are a pressure-sensitive adhesive composition, an encapsulation film including the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

Abstract: Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 101 to 106 Pa·s and a viscosity at room temperature of 106 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided.

Abstract: Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the encapsulation film, which may form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

Abstract: Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Particularly, the encapsulation film, which effectively blocks moisture or oxygen entering the organic electronic device from the outside, and has excellent mechanical properties such as handleability and processability, and the organic electronic device including the same are provided.

Abstract: There are provided a method of evaluating a reliable lifespan of an encapsulant film and a device for evaluating reliability of the film. The present application may provide a film that may be provided for an evaluation method in which reliability of an encapsulant film is simply and easily evaluated only by measuring a haze immediately before the encapsulant film is used, a failure of a product is determined and reliability may be predicted.

Abstract: Provided is an adhesive film capable of being used to encapsulate or capsulate an OED. The adhesive film includes an adhesive layer whose surface has at least one groove for exhausting air.

Abstract: An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process.

Abstract: There are provided a film and an organic electronic device. The present application may provide a film that may be provided for an evaluation method in which reliability of an encapsulant film is simply and easily evaluated only by measuring a haze immediately before the encapsulant film is used, thereby a failure of a product is determined and reliability may be predicted.

Abstract: There are provided a composition for encapsulation film, an encapsulation film, and an electronic device having the same. The present application may provide an encapsulation film having an excellent moisture barrier property, operability, workability, and durability and a structure including an element encapsulated by the encapsulation film.

Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Abstract: An adhesive film, a method for preparing an adhesive film, and an organic electronic device are provided. According to the adhesive film in exemplary embodiments of the present invention, fluidity of an adhesive can be controlled in the case of applying the adhesive between objects to be subsequently adhered to each other and then thermal-compressing by including an adhesive layer with cured side faces contacting with the outside. The adhesive film is used, for example for assembling a panel and the like, and thereby a defect rate at the time of assembling a panel and the like can be reduced and excellent work characteristics can be provided. In addition, before being applied to a panel or the like, a moisture absorbent included inside an adhesive layer of an adhesive film can be protected from external moisture or the like, thereby being easily stored, and also when it is applied to a product, reliability of life span, and the like can be secured.

Abstract: The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.