Patents by Inventor Hyun Jee Yoo

Hyun Jee Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENCAPSULATION FILM
    Publication number: 20190157612
    Abstract: The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.
    Type: Application
    Filed: April 12, 2017
    Publication date: May 23, 2019
    Inventors: Hyun Jee YOO, Hyun Suk KIM, Jung Ok MOON, Se Woo YANG, Jae Jin KIM, Dae Han SEO, Min Soo SONG, Jung Woo LEE
  • PRESSURE SENSITIVE ADHESIVE COMPOSITION, PRESSURE SENSITIVE ADHESIVE FILM, AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME
    Publication number: 20190127612
    Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
    Type: Application
    Filed: December 18, 2018
    Publication date: May 2, 2019
    Inventors: Sang Min PARK, Yoon Gyung CHO, Kyung Yul BAE, Hyun Jee YOO, Jung Sup SHIM, Min Soo PARK
  • ENCAPSULATION FILM
    Publication number: 20190123299
    Abstract: The present application relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same, and provides an encapsulation film which allows forming a structure capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, and has excellent handleability and processability, and excellent bonding property between the encapsulation layer and the panel of the organic electronic device and endurance reliability.
    Type: Application
    Filed: April 3, 2017
    Publication date: April 25, 2019
    Inventors: Jung Woo LEE, Hyun Jee YOO, Hyun Suk KIM, Jung Ok MOON, Se Woo YANG
  • ENCAPSULATION FILM
    Publication number: 20190115562
    Abstract: The present application relates to an encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same and a method for manufacturing an organic electronic device using the same. The present invention provides an encapsulation film which can form a structure capable of effectively blocking moisture or oxygen flowing from the outside into an organic electronic device, has excellent handling property and workability, and has excellent adhesion property and endurance reliability between the encapsulation film and the organic electronic device.
    Type: Application
    Filed: April 12, 2017
    Publication date: April 18, 2019
    Applicant: LG CHEM, LTD.
    Inventors: Jung Ok MOON, Hyun Jee YOO, Hyun Suk KIM, Jung Woo LEE, Se Woo YANG
  • ENCAPSULATION FILM
    Publication number: 20190077120
    Abstract: The present application relates to an encapsulating film, a reliability assessment therefor, an organic electronic apparatus comprising the encapsulating film, and a method for producing an organic electronic apparatus which has used the encapsulating film, and provides: a reliability assessment method which can predict the reliability of the encapsulating film before same is applied to the organic electronic apparatus, the encapsulating film blocking moisture or oxygen from the outside entering the organic electronic apparatus; and the encapsulating film which can block moisture with high reliability.
    Type: Application
    Filed: March 13, 2017
    Publication date: March 14, 2019
    Inventors: Hyun Suk KIM, Hyun Jee YOO, Jung Ok MOON, Jung Woo LEE, Se Woo YANG
  • Adhesive film
    Patent number: 10227514
    Abstract: The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: March 12, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Jee Yoo, Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim
  • ORGANIC ELECTRONIC DEVICE
    Publication number: 20190074480
    Abstract: Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 7, 2019
    Inventors: Hyun Jee YOO, Seung Min LEE, Hyun Suk KIM, Suk Ky CHANG, Jung Ok MOON
  • ADHESIVE FILM AND SEALING PRODUCT FOR ORGANIC ELECTRONIC DEVICE USING SAME
    Publication number: 20190071553
    Abstract: Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 7, 2019
    Inventors: Seung Min LEE, Suk Ky CHANG, Hyun Jee YOO, Jung Sup SHIM, Yoon Gyung CHO, Kyung Yul BAE
  • Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
    Patent number: 10202525
    Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: February 12, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Sang Min Park, Yoon Gyung Cho, Kyung Yul Bae, Hyun Jee Yoo, Jung Sup Shim, Min Soo Park
  • ENCAPSULATION FILM AND ORGANIC ELECTRONIC DEVICE COMPRISING THE SAME
    Publication number: 20190019987
    Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.
    Type: Application
    Filed: August 31, 2018
    Publication date: January 17, 2019
    Inventors: Ban Seok CHOI, Hyun Jee YOO, Hyun Suk KIM, Seung Min LEE, Jung Ok MOON, Se Woo YANG
  • Encapsulation film and organic electronic device comprising the same
    Patent number: 10181577
    Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: January 15, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Ban Seok Choi, Hyun Jee Yoo, Hyun Suk Kim, Seung Min Lee, Jung Ok Moon, Se Woo Yang
  • DISPLAY DEVICE (AMENDED)
    Publication number: 20180366684
    Abstract: The present application relates to a display device. The present application can provide a display device in which reflection of external light is reduced to improve a contrast ratio. Such a display device can be applied to not only OLED, a self-luminous display device, but also various display devices including LCD, a non-self-luminous display device, and the like, and can be also implemented as a flexible display device.
    Type: Application
    Filed: March 7, 2017
    Publication date: December 20, 2018
    Inventors: Hyun Suk KIM, Se Woo YANG, Hyun Jee YOO, Hyun Hee SON, Jung Ok MOON, Hyoung Sook PARK, Ban Seok CHOI, Jung Woo LEE
  • ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME
    Publication number: 20180342687
    Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
    Type: Application
    Filed: July 23, 2018
    Publication date: November 29, 2018
    Inventors: Hyun Jee YOO, Yoon Gyung CHO, Suk Ky CHANG, Jung Sup SHIM, Suk Chin LEE, Kwang Jin JEONG
  • Method for manufacturing electronic device
    Patent number: 10141543
    Abstract: Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: November 27, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Yoon Gyung Cho, Hyun Jee Yoo, Suk Ky Chang, Jung Sup Shim, Seung Min Lee
  • Encapsulation film with light absorbing material
    Patent number: 10135022
    Abstract: Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device can be prevented.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: November 20, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Jung Ok Moon, Ban Seok Choi, Se Woo Yang
  • Adhesive film and product for encapsulating organic electronic device using same
    Patent number: 10125292
    Abstract: Provided are an adhesive film and an organic electronic device (OED) encapsulation product using the same. As moisture resistance is maintained by preventing traveling of moisture in a matrix resin, moisture or oxygen input to the organic electronic device from an external environment may be effectively prevented, and temporal stability, life span and durability may be enhanced even when a panel of the organic electronic device is formed as a thin film, thereby ensuring long-term reliability.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: November 13, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Seung Min Lee, Hyun Jee Yoo, Suk Ky Chang, Jung Sup Shim, Yoon Gyung Cho, Kyung Yul Bae
  • Organic electronic device having dimension tolerance between encapsulating layer and metal-containing layer less than or equal to 200 microns
    Patent number: 10103352
    Abstract: Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: October 16, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Suk Ky Chang, Jung Ok Moon
  • Encapsulation film and organic electronic device comprising the same
    Patent number: 10103353
    Abstract: The present application relates to an encapsulation film and an organic electronic device including the encapsulation film, and provides an encapsulation film and an organic electronic device which effectively prevents the penetration of moisture or oxygen from the outside into the organic electronic device and also achieves the light diffusion and extraction effects.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: October 16, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Yoon Gyung Cho, Hyun Jee Yoo, Kyung Yul Bae, Suk Ky Chang, Jung Hyoung Lee, Jun Rye Choi
  • Encapsulation film and organic electronic device comprising the same
    Patent number: 10096797
    Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: October 9, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Ban Seok Choi, Hyun Jee Yoo, Hyun Suk Kim, Seung Min Lee, Jung Ok Moon, Se Woo Yang
  • Adhesive film and sealing product for organic electronic device using same
    Patent number: 10093785
    Abstract: Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: October 9, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Seung Min Lee, Suk Ky Chang, Hyun Jee Yoo, Jung Sup Shim, Yoon Gyung Cho, Kyung Yul Bae