Patents by Inventor In Kyum Kim

In Kyum Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200372340
    Abstract: The present invention relates to a neural network parameter optimization method and a neural network computation method and apparatus suitable for hardware implementation. The neural network parameter optimization method suitable for hardware implementation according to the present invention may include transforming an existing parameter of a neural network into a signed parameter and a magnitude parameter having a single value for each channel and generating an optimized parameter by pruning the transformed magnitude parameter. Accordingly, the present invention provides a neural network parameter optimization method and a neural network computation method and apparatus thereof, which optimize a large amount of computation and parameters of a convolutional neural network to be effective in hardware implementation, thereby achieving minimal accuracy loss and maximum computation speed.
    Type: Application
    Filed: July 18, 2019
    Publication date: November 26, 2020
    Inventors: Sang Hun LEE, Myung Kyum KIM, Joo Hyuk KIM
  • Patent number: 10808272
    Abstract: Provided are a method of preparing an antibody with a regulated, sugar chain content, the method including the step of culturing antibody-expressing cells in a medium including glycerol as an additive for regulating the antibody sugar chain content, a method of preparing a high-quality population of antibodies by regulating the sugar content of the antibody to a desired content, and a population of antibodies prepared by the method. Further, provided is a method of regulating the antibody sugar chain content, the method including the step of culturing antibody-expressing cells in a medium including glycerol as an additive for regulating the antibody sugar chain content. Furthermore, provided is a medium composition, for regulating the antibody sugar chain content, the medium composition including glycerol as an additive for regulating the antibody sugar chain content.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: October 20, 2020
    Assignee: Prestige Biopharma PTE. LTD.
    Inventors: Jae Young Chang, Eun Ho Hwang, Yong Jin Kim, Won Kyum Kim, Sang Kyung Park, Jun Yong Park, Kyo Eun Ahn, Yong Ho Ahn, Ji Yong Yoon, Jung Woo Lee
  • Publication number: 20200317471
    Abstract: The present invention relates to a system for measuring noise, vibration and running speed of an elevator, wherein the system can measure noise, vibration, running speed, etc. of an elevator through wireless communication in a state in which an operator is not in the elevator, to analyze riding quality, running state etc. The present invention provides a system for measuring noise, vibration and running speed of an elevator and an escalator, the system comprising: a measurement body 31 installed on an inner floor or a step tread 21 of an elevator 10 or an escalator 20; an acceleration sensor 32 and noise sensor 33 installed in the measurement body 31; and a display device 35 allowing data obtained by the acceleration sensor 32 and noise sensor 33 to be identified outside through wireless communication.
    Type: Application
    Filed: December 18, 2017
    Publication date: October 8, 2020
    Applicant: KOREA ELEVATOR SAFETY AGENCY
    Inventors: Yun Kyum KIM, Chan Yong PARK
  • Publication number: 20200291998
    Abstract: A bearing of which a load supporting position capable of being changed, including: a cylindrical housing comprising a hollow inner circumferential surface; one or more support members provided in the housing and disposed along a circumferential direction of the inner circumferential surface; a plurality of pin holes provided along an outer circumferential surface of the housing; and a rotation preventing pin coupled to a first pin hole of the plurality of pin holes and configured to prevent rotation of the housing. In addition, threads are formed on inner circumferential surfaces of the pin holes and an outer circumferential surface of the rotation preventing pin to enable a pin hole and the rotation preventing pin to be easily coupled and decoupled.
    Type: Application
    Filed: December 30, 2019
    Publication date: September 17, 2020
    Applicant: HANWHA POWERSYSTEMS CO., LTD
    Inventors: Seung Hoon SHIN, Won Kyum KIM
  • Patent number: 10700074
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • Publication number: 20200205119
    Abstract: A method for notifying a user of a disembarkation time by a user equipment (UE) is disclosed. Information about a departure station and information about a destination station are detected not only using at least one of Wi-Fi information and location information collected in an entry station, but also using a station pool. A preceding station located before a disembarkation station is detected not only using a subway line map, but also using at least one of Wi-Fi information and location information collected by the UE on the basis of the detected destination station information. A disembarkation time at a transfer station or at a destination station is pre-notified the user on the basis of the preceding-station recognition time. Therefore, it is possible to pre-notify a user of disembarkation time information at a transfer station and a destination station on a subway route through 5G network.
    Type: Application
    Filed: January 15, 2020
    Publication date: June 25, 2020
    Applicant: LG ELECTRONICS INC.
    Inventors: Yongseok SEO, Taeyoung LEE, Juhyoung LEE, Yong Suk LEE, Jong Jin PARK, Yoon Kyum KIM, Dong Woo SOHN, Sung Hyun PARK
  • Publication number: 20200176455
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Application
    Filed: February 5, 2020
    Publication date: June 4, 2020
    Inventors: Jun-Kyum KIM, Jung-Woo SEO, Sung-Un KWON
  • Publication number: 20200132226
    Abstract: A non-welded type branch piping reinforcement apparatus capable of preventing damage to a branch pipe system by increasing the strength of the branch pipe system by covering and protecting the branch pipe system connected to a header pipe, by a joint clamp, a connection pipe clamp, and a valve clamp includes: a joint clamp arranged to cover the branch pipe joint and the connection pipe and having an arc-shaped cross section; a connection pipe clamp arranged to cover the connection pipe and having an arc-shaped cross section; and a valve clamp arranged to cover the connection pipe and the valve and having an arc-shaped cross section, wherein one end of the connection pipe clamp is connected to the joint clamp and the other end of the connection pipe clamp is connected to the valve clamp.
    Type: Application
    Filed: October 23, 2019
    Publication date: April 30, 2020
    Inventors: Youn Ho WON, Soo Kyum KIM, Chang Bin JEONG, Dong Geon LEE
  • Patent number: 10612985
    Abstract: A force/torque sensor includes a ground unit having an internal space, a sensor unit positioned within the internal space and including a plurality of electrodes generating capacitances with the ground unit, and a support unit combined with a portion of the ground unit and supporting the sensor unit.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: April 7, 2020
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Hyouk Ryeol Choi, Ui Kyum Kim, Yong Bum Kim
  • Patent number: 10586809
    Abstract: An integrated circuit includes a complex logic cell. The complex logic cell includes a first logic circuit providing a first output signal from a first input signal group and a common input signal group, and a second logic circuit providing a second output signal from a second input signal group and the common input signal group. The first and second logic circuits respectively include first and second transistors formed from a gate electrode, the gate electrode extending in a first direction and receiving a first common input signal of the common input signal group.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: March 10, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ju-Hyun Kang, Hyun Lee, Min-Su Kim, Ji-Kyum Kim, Jong-Woo Kim
  • Patent number: 10573653
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: February 25, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • Publication number: 20200032826
    Abstract: The present invention relates to a corrugated steel sheet, and provides a corrugated steel sheet (B) having an inclined portion in which the position of a coupling hole is adjusted, wherein: among a pair of corrugated steel sheets (A, B), a corrugated steel sheet (B) is overlapped and joined with the upper portion of a lower corrugated steel sheet (A) and has the same thickness as the lower corrugated steel sheet (A); a common bolt is coupled to both a coupling hole in the lower corrugated steel sheet (A) and a coupling hole in the corrugated steel sheet (B); and when assuming that the distance between the center of a middle crest portion coupling hole (111) and the center of an adjacent inclined portion coupling hole (141) is a coupling hole distance (a, b), the coupling hole distance (b) for the corrugated steel sheet (B) is calculated by equation 1.
    Type: Application
    Filed: December 27, 2017
    Publication date: January 30, 2020
    Applicants: CHUNGAMENC CO., LTD., DAEDO TECH CO., LTD.
    Inventors: Jong Wha RHEE, Jung Hyun LEE, Moon Kyum KIM, Jun Hyum SHIN, Choon Woo LEE, Kyung Soo BAEK, Ki Hyun GU
  • Patent number: 10523188
    Abstract: A semiconductor device includes: first through fourth active regions spaced apart from one another; a first gate line disposed to overlap with the first and second active regions, but not with the third and fourth active regions, and to extend in a first direction; a second gate line disposed to overlap with the third and fourth active regions, but not with the first and second active regions, and to extend in the first direction while being spaced apart from the first gate line; and a dummy gate line disposed to overlap with the first through fourth active regions and a field region, to be spaced apart from the first and second gate lines in a second direction, and to extend in the first direction, wherein a signal input to the first or second active region is transmitted to the third or fourth active region.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: December 31, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Kyum Kim, Dae Seong Lee, Min Su Kim
  • Publication number: 20190386009
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Jun-Kyum KIM, Jung-Woo SEO, Sung-Un KWON
  • Patent number: 10495528
    Abstract: Provided herein is a capacitive torque sensor, which can completely offset forces/torques in all axial directions, except for force/torque in a direction of a central axis, by measuring variations in capacitances of four sensing cells arrayed at angular intervals of 90 degrees on the basis of a center of the sensor and can offer a sensing value for the torque in a central axis direction.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: December 3, 2019
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Hyouk Ryeol Choi, Ui Kyum Kim, Yong Bum Kim, Dong-Yeop Seok, Jin Ho So
  • Patent number: 10446558
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: October 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • Patent number: 10395224
    Abstract: A financial device includes a medium depositing and withdrawing module having a medium receiving space to receive a medium, a discrimination module to discriminate the medium, a temporary stacking module to temporarily stack the medium, a medium storage unit to store at least one of media to be deposited and withdrawn, which are accepted into the medium receiving space, and a transfer module to guide a medium to the medium storage unit and a medium discharged from the medium storage unit. A portion of the transfer module can be changed or replaced to install or remove an additional function module which performs at least one function of a replenishment function to replenish a medium to the medium storage unit and a collection function to collect a medium from the medium storage unit.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: August 27, 2019
    Assignee: ATEC AP CO., LTD.
    Inventors: Hak Kyum Kim, Seung Gill Baek
  • Patent number: D871402
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: December 31, 2019
    Assignee: Hyundai Mobis Co., Ltd.
    Inventors: Bong Geun Jeon, Jong Wan Choi, Jin Kyum Kim, Seo Hyun Kim, Jin Kwon, Min Hee Kim, Sang Hun Yoo
  • Patent number: D877144
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: March 3, 2020
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Bong Geun Jeon, Jong Wan Choi, Jin Kwon, Sang Hun Yoo, Jin Kyum Kim, Seo Hyun Kim, Min Hee Kim
  • Patent number: D892077
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: August 4, 2020
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventor: Jin Kyum Kim